GARCHING/MUNICH, GERMANY: SUSS MicroTec, a supplier of innovative process and test solutions for the semiconductor industry and related markets, has shipped a LithoPack300 lithography cluster to Japan.
The system has been successfully installed at the customer site where it will be used for 3D integration technology development. The cluster solution with coat, bake, expose and develop modules for wafers up to 300mm constitutes a cost-efficient approach for the challenging Through-Silicon-Via (TSV) manufacturing and backside redistribution layer (RDL) in 3D integration production.
With this integrated lithography solution and further solutions for permanent and temporary wafer bonding SUSS MicroTec offers a complete process and technology portfolio for 3D integration. SUSS MicroTec has recently announced its participation in a range of research projects on 3D integration processes driving technology advances from the equipment supplier side.
The LithoPack300 combines two 300mm photolithography modules in one system and represents the most cost-efficient integrated lithography solution in the market. The MA300 Gen2 module, a 300mm next generation mask aligner platform, provides excellent back-side processing capabilities that enable highly accurate photolithography processes for the manufacturing of back side redistribution layers or TSV etch masks.
The ACS300 module offers closed cover coating technology and best-in-class edge bead removal precision and therefore enables optimum thick resist processing for 3D integration processes.
“In recent years SUSS MicroTec lithography systems have developed into an enabling platform for next generation 3D Integration technologies”, said Rolf Wolf, general manager of SUSS MicroTec’s lithography division. “Today SUSS Mask Aligners can be enhanced with tooling for submicron alignment, wafer edge handling or UV-bonding for wafer to wafer stacking, all features that have become critically important for 3D applications.
“With the involvement of SUSS MicroTec in international research cooperations we are proud to become further involved in 3D integration process development.” said Raymond Lau, Business Manager for SUSS MicroTec in Japan.
“Our Japanese customers will directly benefit from these technical advances. We enjoy being able to offer a well-engineered solution portfolio for 3D integration that really meets their specific needs.”
Showing posts with label SUSS MicroTec. Show all posts
Showing posts with label SUSS MicroTec. Show all posts
Tuesday, 25 August 2009
Thursday, 4 June 2009
SUSS MicroTec intros new illumination system for mask aligners
MUNICH & GARCHING, GERMANY: SUSS MicroTec, a leading supplier of equipment solutions for 3D Integration, MEMS, Advanced Packaging and Nanotechnology markets, has launched with the MO Exposure Optics a new illumination system designed for all generations of manual and automatic SUSS mask aligners.
The new optical system is based on unique microlens arrays of high optical quality to provide higher intensity, improved exposure light uniformity and customized illumination shaping. This allows users of SUSS MicroTec mask aligners to optimize the process window and enhance yield in contact and proximity lithography. MO Exposure Optics (patent pending) has been exclusively developed by SUSS MicroOptics, a world leading supplier for high-quality optic solutions in illumination, laser beam shaping, metrology, medical and vision systems.
MO Exposure Optics is provided with a library of illumination settings, including all established SUSS MicroTec mask aligner settings (A-Optics, D-Optics, LGO and HR) plus additional settings like ring illumination, dipole, quadrupole, multipole and maltese cross.
By a simple change of the Illumination Filter Plates (IFP) the user can choose the optimized illumination settings to achieve a higher process latitude. Automated IFP exchanger will be offered for production mask aligners.
A free choice of optimized illumination settings, e.g. ring illumination for vias and maltese cross for vertical and horizontal lines will increase the depth of focus and exposure latitude while reducing mask error factors. The system also allows users to design fully made-to-order illumination that optimizes their layer-specific process windows.
"MO Exposure Optics is a major step forward in yield improvements providing high resolution at even large proximity gaps for all our mask aligners”, explained Dr. Ralf Süss, general manager of SUSS MicroTec's Lithography Division.
The MO Exposure Optics illumination system is available for immediate shipment for all manual and automated mask aligners. Existing SUSS MicroTec mask aligners can be retrofitted in the field.
“By offering the possibility to upgrade the installed base with the new MO Exposure Optics illumination system we help our customers to protect their investment in the well-proven mask aligner technology” added Frank P. Averdung, President and CEO of SUSS MicroTec AG. “It will allow them to immediately save cost in this challenging economical environment.”
The new optical system is based on unique microlens arrays of high optical quality to provide higher intensity, improved exposure light uniformity and customized illumination shaping. This allows users of SUSS MicroTec mask aligners to optimize the process window and enhance yield in contact and proximity lithography. MO Exposure Optics (patent pending) has been exclusively developed by SUSS MicroOptics, a world leading supplier for high-quality optic solutions in illumination, laser beam shaping, metrology, medical and vision systems.
MO Exposure Optics is provided with a library of illumination settings, including all established SUSS MicroTec mask aligner settings (A-Optics, D-Optics, LGO and HR) plus additional settings like ring illumination, dipole, quadrupole, multipole and maltese cross.
By a simple change of the Illumination Filter Plates (IFP) the user can choose the optimized illumination settings to achieve a higher process latitude. Automated IFP exchanger will be offered for production mask aligners.
A free choice of optimized illumination settings, e.g. ring illumination for vias and maltese cross for vertical and horizontal lines will increase the depth of focus and exposure latitude while reducing mask error factors. The system also allows users to design fully made-to-order illumination that optimizes their layer-specific process windows.
"MO Exposure Optics is a major step forward in yield improvements providing high resolution at even large proximity gaps for all our mask aligners”, explained Dr. Ralf Süss, general manager of SUSS MicroTec's Lithography Division.
The MO Exposure Optics illumination system is available for immediate shipment for all manual and automated mask aligners. Existing SUSS MicroTec mask aligners can be retrofitted in the field.
“By offering the possibility to upgrade the installed base with the new MO Exposure Optics illumination system we help our customers to protect their investment in the well-proven mask aligner technology” added Frank P. Averdung, President and CEO of SUSS MicroTec AG. “It will allow them to immediately save cost in this challenging economical environment.”
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