Showing posts with label STMicroelectronics. Show all posts
Showing posts with label STMicroelectronics. Show all posts

Monday, 28 September 2009

ST intros MotionBee platform for remote motion control

SINGAPORE: STMicroelectronics, a leader in MEMS and wireless technologies, has introduced MotionBee, a complete, ready-for-use platform that combines state-of-the-art motion sensing with ZigBee wireless technology in a single ultra-compact module.

Boasting low power consumption and high level of integration, ST’s MotionBee enables system developers to quickly and cost-effectively build wireless sensor networks for remote motion recognition and tracking in many different application areas, including healthcare, security, industrial control and environmental monitoring.

The first-generation MotionBee module integrates ST’s market-proven 3-axis digital-output MEMS accelerometer with a ZigBee platform from Ember Corporation that includes the EM250 System-on-Chip, a 2.4GHz, IEEE 802.15.4-compliant radio transceiver and processor, together with the EmberZNet PRO ZigBee networking software.

The module detects accelerations in the selectable range of +/-2g and +/- 6g and transmits the information to a central connection point (star topology) or every other node (mesh topology) in a ZigBee wireless network. The module is fully programmable and its small size (49 x 27 x 5 mm) makes the deployment easier, such as in wearable medical or sports equipment.

Addressing specifically the requirements of remote sensing and control systems, ZigBee technology enables the implementation of broad-based wireless mesh networks that are able to run for months on inexpensive primary batteries, representing a viable alternative to costly hard-wired systems.

The first-generation MotionBee modules are optimized for designs that require long battery life, a low external component count, and a reliable, proven, industry-standard networking solution.

ST’s complete and cost-effective remote motion control platform enables wireless sensor networks in a variety of existing and emerging applications, such as vibration monitoring and detection in different indoor and outdoor environments, automated navigation systems, or bio-sensor networks in remote-healthcare scenarios.

ST’s first MotionBee device, the SPMB250-A1, is available now, with samples priced at $60. An evaluation kit is also available, with two pre-programmed modules and a ZigBee dongle for integration with a PC.

Friday, 25 September 2009

STMicroelectronics' combined audio converter/driver IC

SINGAPORE: Audiophiles and aficionados of portables entertainment devices such as MP3 players, cellular phones, personal computers, laptop computers and/or PDAs are extremely demanding about the sound quality of their entertainment experience.

Meanwhile, engineers behind the scenes continue to struggle with delivering increasing quality with new features in more stylish packaging at lower cost.

Combined audio converter/driver ICs are simplifying the design of set-top boxes and other consumer audio/video products, but the new TS4657 from STMicroelectronics, a leading provider of digital audio ICs, improves on existing technology by reducing external components and power consumption and improving sound quality.

ST’s new TS4657 is a single chip combining audio-DAC (digital-to-analog converter) and line-driver functions to feed the audio Line-Out connection of set-top boxes, DVD players, portable multimedia devices, sound cards, or similar equipment. The Line Out provides a direct connection to drive an external home amplifier, allowing for a better audio experience by maintaining constant signal levels, better digital volume control and a wider volume range.

The IC uses an internal power management unit to produce a 2.2Vrms audio-output signal for voltages from 3.0V to 5.5V, eliminating the need for a separate high-voltage power supply to drive the Line-Out output. Similar devices typically require four external capacitors for the charge pumps but ST’s high-frequency design integrates this function on-chip, thereby saving board space and bill-of-materials costs.

The TS4657 is in production now, available in the 4 x 4mm QFN20 package and priced at $0.91 in quantities of 1,000 units.

Tuesday, 22 September 2009

Boost for wireless monitoring apps from ST's 32-bit MCU/SoC with embedded 2.4GHz radio

SINGAPORE: STMicroelectronics has extended its STM32 microcontroller portfolio by introducing the STM32W family, which features an integrated IEEE 802.15.4 radio to deliver a true System-on-Chip platform supporting embedded wireless sensor network design.

IEEE 802.15.4 is an open standard for low-power, low-data-rate radio in the unlicensed 2.4GHz band, and is widely used in communication and networking applications such as smart energy metering, home automation, security and monitoring equipment, and remote controls. The ZigBee Alliance has specified IEEE 802.15.4 as the radio platform for the industry-standard ZigBee protocol, which is popular in applications such as sensor networking and automatic meter reading.

ST’s new STM32W family implements the IEEE 802.15.4 physical (PHY) layer as well as the Media Access Control (MAC) layer, giving developers the flexibility to target ZigBee-compliant specifications or to build any network wireless protocol which interfaces with the standardized IEEE802.15.4 MAC.

Other well known protocols include ZigBee RF4CE for radio-frequency remote controls or 6LoWPAN for wireless embedded Internet solutions. Software support for the STM32W family includes libraries for the latest ZigBee PRO specification, as well as ZigBee RF4CE, and the IEEE 802.15.4 MAC.

The new devices combine the benefits of a best-in-class radio platform with the added performance, flexibility and scalability of the STM32 microcontroller architecture. The STM32 portfolio is the industry’s leading microcontroller product range featuring the advanced 32-bit ARM Cortex-M3 processor, and it was the first to eliminate all obstacles to broad 32-bit usage in embedded applications.

Advantages such as high processing performance, advanced power management and high integration, as well as real-time behavior, have attracted large numbers of developers to the STM32 platform, worldwide.

Joining this successful product line, the STM32W family benefits from compatibility with other STM32 variants and also leverages the STM32 development ecosystem. Developers also benefit from best-in-class code density, which is at least 20 percent better than other architectures thanks to the efficiency of the Cortex-M3 core.

The STM32W is a true SoC combining best-in-class IEEE 802.15.4 RF performance as well as 32-bit processing. The devices can transmit up to 7dBm output power and support up to 107dB link budget, achieve up to –100dBm receiver sensitivity, and allow coexistence with nearby Wi-Fi and Bluetooth networks, which also operate in the 2.4GHz frequency band.

Performance highlights of the STM32W family include low power consumption, drawing as little as 27mA in receive mode and 31mA in transmit mode, and implementing a 1µA Deep-Sleep mode to aid power management. Special features supporting wireless applications include 8Kbyte SRAM, 128Kbyte Flash for code storage, and embedded AES encryption with hardware acceleration.

General-purpose resources include a flexible ADC, an SPI/UART/TWI serial interface, multiple timers, and 24 GPIOs with Schmitt-trigger inputs. Single-voltage operation from 2.1V to 3.6V simplifies design, while high integration also saves external components. Only a single 24MHz crystal is required, or an optional 32.768kHz crystal for increased timer accuracy. There is also support for an external power amplifier.

The smart combination of a best-in-class 2.4GHz radio and powerful 32-bit machine brings outstanding network system performance and associated low-power operation enhancing battery life time.

The STM32W family is available in a 6 x 6mm 40-pin QFN package pin-to-pin compatible with the SN260, or a 7 x 7mm 48-pin QFN compatible with the SN250. Pricing begins at $2.90 for quantities over 100,000 units with ZigBee PRO feature-set.

Wednesday, 2 September 2009

ST-Ericsson Board of Directors appoints wireless expert Gilles Delfassy as President and CEO

GENEVA, SWITZERLAND: ST-Ericsson, a joint venture of STMicroelectronics and Ericsson announced the appointment of Gilles Delfassy as President and CEO of ST-Ericsson.

Alain Dutheil, who has successfully led the company during the crucial period of formation and integration, will work with Delfassy over the coming months to ensure a smooth transition. Delfassy will assume his position as President and CEO effective November 2, 2009.

After then, Dutheil will continue to support ST-Ericsson by joining its Board and will return to his previous role as STMicroelectronics’ Chief Operating Officer.

In addition, Hans Vestberg, CFO and incoming CEO of Ericsson, and a member of the Board of ST-Ericsson, has become Chairman of the Board of ST-Ericsson, succeeding Carl-Henric Svanberg, President and CEO of Ericsson.

Delfassy, 54, is a highly-respected expert in the wireless industry. During his 28-year career at Texas Instruments, he created and built what would become, during that time, the largest wireless semiconductor business in the world. After his retirement from Texas Instruments in 2007, Delfassy became an advisor to many high-tech companies and has served on several corporate boards.

Alain Dutheil, current President and CEO of ST-Ericsson, said: “In less than one year, ST-Ericsson has become a leading force in our industry, with strong innovation capabilities, outstanding customer relationships, ability to offer a unique portfolio, and with what I am proud to define as the best team of professionals. Together, we have already come a long way in reshaping and integrating the company.

"Now, with Gilles joining us with his decades of wireless expertise and outstanding track record, the team will be even stronger and well positioned to achieve long term, profitable growth.”

Carl-Henric Svanberg, previously Chairman of ST-Ericsson’s Board, and Carlo Bozotti, Vice-Chairman, praised the efforts and results of Dutheil: “Putting together three separate companies to create a formidable wireless business is a challenging undertaking, especially in the current macro-economic environment. Alain has done an extraordinary job in building a strong team and a solid foundation from which ST-Ericsson can grow.”

Hans Vestberg, newly-appointed Chairman of ST-Ericsson’s Board, and Carlo Bozotti, warmly welcomed Delfassy: “We are very pleased that Gilles will now take over as he has the right expertise and experience to successfully lead the company going forward.”

Delfassy sees this as a unique and challenging opportunity. “I am proud to join ST-Ericsson,” he said. “Being part of a successful and growing business has been one of the most rewarding experiences of my career. Now I have the honor to lead ST-Ericsson from its early stages to what I believe can be profitable growth and true market leadership. I look forward to working with the management team and all of ST-Ericsson’s talented employees to build on the excellent work started by Alain.”

ST's battery-monitoring IC delivers higher accuracy, extra features

SINGAPORE: STMicroelectronics, a leading provider of semiconductors for handheld products, has introduced a battery-condition monitoring IC enabling increased accuracy for ‘fuel-gauge’ style indicators showing the operating time remaining.

The device will improve the user experience for owners of products such as mobile handsets, portable navigation devices, digital cameras and personal media players. The STC3100 battery-monitor IC can be located in the battery pack or in the handheld device, and integrates functions to monitor the battery voltage, current and temperature.

It has a built-in Coulomb counter to calculate battery charge, and stores the data at 16-bit resolution for retrieval by the system controller. Access is via an industry-standard I2C interface, enabling the controller to create an accurate graphical representation of remaining battery-operating time.

ST has added several other reasons for designers to choose this chip over competing battery monitors. The device supports extra functionality by providing one external pin for use as a detector input or to drive an LED indicator.

Each IC is also pre-programmed with a unique 64-bit identifier, which enables traceability of individual battery packs or subsystems. In addition, 32 bytes of accessible RAM allow storage of battery history or application-related information throughout the lifetime of the battery.

There are also two package options, giving designers the choice of a small-outline MiniSO-8 leaded package or a 1mm-high DFN8 leadless package with 3x3mm overall footprint. The STC3100 is in mass production, and available at $1.20 in quantities of 1,000 units.

Sunday, 16 August 2009

STMicro on corporate responsibility -- Part 2

Friends, here's the second and concluding part of my discussion with Vivek Sharma, Director, India Design Center, and Vice President, Emerging Market Regions, STMicroelectronics.
Here, we have discussed how the company's corporate social responsibility has helped ST reduce greenhouse gases/reducing carbon footprint/CO2 emissions, handling e-waste and chemicals, and the company's success in developing 'greener and cleaner' supply chains.

Reducing greenhouse gases, etc.
First, How has this initiative helped reduce greenhouse gases/reducing carbon footprint/CO2 emissions?

Sharma said: "This Initiative has helped us in reducing greenhouse gases/ reducing carbon foot print/CO2 emissions. Although the semiconductor industry makes a relatively small contribution to climate change compared to many other industries, ST integrated a formal, structured approach to reducing its environmental footprint in the early 1990s.

"Working with the World Business Council for Sustainable Development (WBCSD) at that time helped us to define the areas for action and improvement relating to CO2 emissions and other greenhouse gases (GHG); we called the resulting 10-part plan our ‘Environmental Decalogue’.

"Some of the key strategies are constant dedication to reducing our own environmental impact by reducing our consumption of resources such as energy and water and our net emissions of greenhouse gases, working with our suppliers and other stakeholders to share our vast experience and encourage best practices, developing advanced devices that minimize the power consumed in electronic equipment.

"Power-conscious design has two aspects: reduction of energy consumption in the chip itself and contribution to energy saving in the end application, such as home appliances or lighting."

Some key highlights:
* A reduction in energy consumption per unit by 5 percent compared to 2007. This consumption now represents around 49% of its 1994 level, meaning that the energy saved each year is equivalent to the consumption of a town of 400,000 people;
* Outstanding progress in the reduction of CO2 emissions, which are now represent only 68% of what they were in 2005 in absolute value, despite a 4 percent increase in production volume over the same period.

Handling e-waste and chemicals
Since 1993, ST has been working on programs to reduce its hazardous substances consumption and improve the resulting waste treatment. "The evolution of our Decalogue helped us to successfully challenge our performance in these areas. Thus we have been reducing our chemical consumption by more than 5 percent a year, on average, since 1998," added Sharma.

Through corporate and local chemical saving plans, many initiatives have been implemented and shared across ST to outperform this goal, such as substitution of the most hazardous substances, chemical recycling, process optimization or hardware modification to dilute chemicals and lower their flow rates. In 2008, a focus was given to tend to the elimination of PFOs compounds in Front-end and the conversion to halogen free materials in back-end applications.

Impact on greener, cleaner products
According to him, for a semicondcuctor company, there are three key areas for directly contributing towards greener and cleaner environment.

First, to reduce consumption and waste. This has been already highlighted in terms of reduction of energy usage, CO2 emissions, chemical usage, eco footprint, etc.

ST intends to become environmentally neutral by 2012 utilizing other mechanisms like plating trees, using non conventional energy sources etc. as well to neutralize even the reduced levels of environment impact.

Second, to design products which help in reducing the energy consumption of end products. ST has already identified 4 fields where semiconductor components can help: stand-by, lighting, electric enginers, airconditioning and heating.

For example, ST’s green products like ST's microcontroller-based lamp ballast reduces the energy consumption by as much as 80 percent by using high-performing switching components to minimize the power losses. ST’s patented sensorless motor controller with inverter driving allows a microcontroller to control the frequency and voltage of the power supplied to the motor.

In white goods appliances and air-conditioning systems, this approach delivers real world savings of 30 percent compared to existing solutions. ST’s dedicated solution for refrigerators integrates full digital temperature regulation that helps maintain the internal temperature more accurately for better food preservation while saving power. With the incorporation of “start&stop” systems in cars, 15 percent of fuel can be saved.

Third, to design products which inherently consume less power. As an example, chips designed on our latest 45nm Low Power platform can have significant less power consumption compared to the standard platforms depending upon the configuration of the chip.

Developing greener, cleaner supply chains
Finally, how successful has ST been in developing 'greener and cleaner' supply chains?

According to Sharma, ST, being a full member of the EICC (Electronics Industry Citizenship Coalition), has applied its Code of Conduct to the operations and extended the proposal to suppliers and subcontractors. It decided to get involved in the EICC, to participate to a standardized approach to Corporate Responsibility management within the electronic industry supply chain.

"ST’s Corporate Responsibility department is responsible for deploying the Electronics Industry Citizenship Coalition (EICC) program. To manage the suppliers and subcontractors involvement in this initiative, it works in collaboration with the Purchasing and Sourcing department which has created a new central role in 2008 to manage the Quality and Sustainable Excellence programs.

"As we are among the first companies to launch this phase at the supply chain level, we decided to adopt a temperate approach. For the moment, our objective is to promote the EICC initiative rather than imposing it. Purchasing and Sourcing department managers have spent several months negotiating with each company to agree on subscribing to E-TASC and filling in the questionnaire for their main sites, and then to share their Corporate Responsibility performance.

"The spirit of the approach is to explain that as it is an industry initiative, if they complete the SAQ once, they will be able to share their results with other customers that might be EICC members too.

"In 2009, we will keep on inviting new companies to complete their SAQ and integrate these specific criteria in our suppliers /subcontractors performance evaluation tools (SPE)," he concluded.

Saturday, 15 August 2009

STMicroelectronics on corporate responsibility -- part 1

STMicroelectronics recently launched its Corporate Social Responsibility Report -- said to be the first of its kind. I was fortunate enough to catch up with Vivek Sharma, Director, India Design Center, and Vice President, Emerging Market Regions, and find out more about this report. Here's what he had to say:

ST's concept of sustainable excellence
Corporate Social Responsibility has been the core belief for STMicroelectronics since its inception. In fact, STMicroelectronics is one of the first global industrial companies to recognize the importance of environmental responsibility and has won many awards for its pioneering work in this field.

The Company played a leading role in demonstrating that ‘Green is Black’ i.e. that environmental responsibility delivers real financial benefits and these goals are not in contradiction to each other. For building a culture on this core belief, all levels in an organization have not only to be involved, but also to ensure their commitment as well.

This was given a communicatble & practical shape when corporation adopted TQM principles in early nineties and its concepts, processes and practices were cascaded to all levels of whole enterprise. Soon after, company published its first ‘Environmental Decalogue’ in 1994 followed by another wave of TQEM.

In this journey, the company has continually widened the scope of its definition of corporate responsibility and increasingly formalized both the deployment of its principles within the company and the reporting of the results to stakeholders to ensure that it remains at the forefront of Corporate Responsibility.

ST’s Sustainable Excellence program was launched in 2007 to revamp the same core belief and to embed Corporate Responsibility into every level of the Company’s activities. The term reflects ST’s firm belief in its ability to balance stakeholders’ expectations to make the Company ‘sustainable’ – successful now and in the future – in the short and long term and enable it to contribute to sustainable development at a global level. This progam is based on three key principals i.e. Integrity, People and Excellence which captures the essence of it.

Why such a report now?
What's the need for such a report at this point of time? That's the obvious question!

Sharma said: "It is an annual report through which we intend to give an overview of our Corporate Responsibility strategy, our achievements at company and local levels and a description of the challenges we face in all areas of corporate responsibility such as environment, employee well-being, community involvement, and product responsibility while also demonstrating strong performance in aspects that are becoming increasingly important to stakeholders. This is a testimony to our commitment to CSR and it reports the progress track record on various fronts, hence demonstrating our accountability.

Progress in all areas
I asked Sharma to elaborate how ST was able to record continued progress in all areas of Corporate Responsibility.

As can be noticed in the report, we are able to make continued progress in all the areas. The key reason lies in the fact these CSR goals have been successfully deployed throughout the organization and we are able to generate high commitment to this cause.

As an example, the energy used per production unit has been more than halved since our pulishing of decaloque where in there was a target of 5 percent reduction every year. For us, Corporate Responsibility is a process of continuous improvement while adapting to a changing business environment.

On a regular basis, our company is evaluated by rating agencies and extra-financial analysts working with ethical indices or asset management companies, thereby ensuring that our practices are benchmarked with other leaders and this external evaluation has also direct impact on potential investors in the company.

"As outlined above, on annual basis we intend to give an overview of our Corporate Responsibility strategy, our achievements at company and local levels and a description of the challenges we face in all areas of corporate responsibility such as environment, employee well-being, community involvement, and product responsibility while also demonstrating strong performance in aspects that are becoming increasingly important to stakeholders.

"These include Health & Safety of our employees, diffusion of Corporate Responsibility in the supply chain, implementation of human rights,responsible restructuring etc. apart from economic results," he said.

Benefits of the concept
Next, I asked him to elaborate on the short-term and long-term benefits of this concept.

Although CSR focus is well understood to yield sustained results over long-term, it very well offers numerous short term advantages. Simply, short term results achieved without compromising CSR principals would yield sustained long term results. Let us take a relatively obvious example, keeping employees healthy and safe, providing them good work life balance etc. can deliver high quality results in short term whereby ensuring their long term sustainability.

Although, all examples may not be so obvious and rather sometimes can even be very challenging to arrive at the balance, nevertheless these principals provide guiding direction This helps building aligned expectations from stakeholders.

"Let us take another example in the area of environment and product responsibility. The short-term and long-term benefits from this concept would be seen in various areas such as power applications in our homes, from lighting, heating,air-conditioning, white goods appliances and entertainment electronics.

"Replacing traditional incandescent bulb lamps with compact fluorescent lamps (CFL) cut energy use by a factor of five, using advanced motor control technologies for energy efficiency, silent operation etc. can brings down energy consumption by as high as 40% and noise levels as well. In short term, electricity bills come down and in long-term this helps in conserving the environment as energy needs go down.

Involvement of ST India
It would be interesting to find out a bit about the involvement of ST's Indian arm in all of this.

Sharma said: "ST’s India operations are seamlessly integrated into ST corporate culture hence embody the CSR initiatives with equal vigor through structure, systems, processes & practices, while also taking into consideration local realities.

"As a matter of structure, locally we have Sustainable Excellence Committees, Ethics Committee and employees’ voluntary committee known as Community & Environment Support (CES). As an example of processes, Sustainable Excellence Operations Review is carried out every quarter with SE committee.

"Being a major Intellectual Property design center, quality and timeliness of the products developed has an impact on the economic results of the company. To strengthen these, various training programs, both corporate and local are deployed along-with strong practices e.g. project management.

"The sites are ISO/TS certified to ensure these. Further, a design center is a key place to ensure high energy efficiency of semiconductor products. As an example. our local teams are developing Low Power design platforms in latest technologies e.g. 45nm, 32nm, on which semiconductors chips are designed and which can help in bringing down the power consumption as high as 30 percent.

"Chips and embedded software are also designed to consume less power e.g. Set-Top-Box System-On-Chip solutions. The sites are certified to latest information security standard of ISO 27001.

"On the social front, the company’s health program is fully deployed locally as well. In the last one and a half year, more than 85 percent of our employees have undergone health check. There is continuous series of health talks on the local sites from medical specialists.

"Even though, Greater Noida is a design center, hence less changes of employee safety issues as compared to manufacturing plants, it is OHSAS 18001 certified to keep the high standards. Also, regular employee engagement surveys are done to ensure high level of employee motivation."

Another corporate program, under the aegis of ST Foundation namely Digital Unify, intended to bridge the Digital Divide is being pursued strongly locally. Already 9 labs have been opened in Indian schools where students don’t have access to computers and internet. The basic infrastructure comprising of computers and associated hardware along-with training is provided here. So far, more than 2,000 students have been trained with the goal of doubling this number this year.

"In order to extend good practices in the supply chain, we invite our suppliers to agree on the Business Ethics principals. As a local initiative, we systematically inform our suppliers not to offer any gifts to any of our employees/decision makers in order to ensure no conflict of interest and high business integrity.

"Under the environment focus, first and foremost need is to spread the awareness about the environment challenges world is facing. Time to time, events are organized e.g. Environment Week in June this year, wherein environment related movies are screened, stalls are put-up like CFL/LED bulbs, painting competition and quizzes on environment are organized, NGOs are invited to interact with our employees, plant saplings are distributed etc.

"Being non manufacturing units in India, although, there is no direct pollution, however, reduction of waste in various forms remain under focus e.g., energy/water/paper consumption, food wastage etc. In order to optimize transport related pollution, we have deployed 38 buses running on CNG, which carry more than 80 percent of our employees at Greater Noida," noted Sharma.

I will continue my conversation with Vivek Sharma in the next post.

There, we will be discussing how the CSR strategy has helped ST reduce greenhouse gases/reducing carbon footprint/CO2 emissions, handling e-waste and chemicals, and the company's success in developing 'greener and cleaner' supply chains.

Thursday, 13 August 2009

Semiconductors and ICs update: Gauging fallout from ITC's Tessera ruling

USA: Presenting Converge's Market Intelligence Report, August 2009.

Overall, the general IC activity has remained relatively flat compared to last month. However, the shortages discussed in last month’s Market Insights report for the Xilinx Virtex 5 product line continue, as do those mentioned from TI, Altera and Freescale.

Activity for ST Micro has increased over the last several weeks, most likely out of concerns regarding the ITC's Tessera ruling. Consumer/telecom demand is still subdued, but demand in the industrial PC and embedded technology sectors are showing some signs of life.

Fallout from the ITC's Tessera ruling has been difficult to gauge, as specific information regarding the judgment has been slow to emerge. Some suppliers have adhered immediately to what they perceive will be the strictest letter of the law, while others have been quick to move inventory to make it available for sale in anticipation of enforcement.

In addition, increased customs enforcement by nations in Asia and Europe have made it much more difficult and time-consuming to move certain products, including FPGAs, from one region to another. Converge is advising our customers to add an additional one to two weeks to lead times on parts originating from these countries.

Friday, 7 August 2009

STMicroelectronics intros silicon tuner for digital-terrestrial TV standard

GENEVA, SWITZERLAND: As demand grows for economical equipment allowing households to access digital terrestrial TV services, STMicroelectronics has introduced a single-chip DVB-T silicon tuner that enables manufacturers to simplify product assembly and supply-chain management.

ST's new silicon tuner, the STV4100, addresses growing global demand for digital STBs and integrated digital televisions (iDTVs) as countries worldwide switch from analog to digital television broadcasting.

This process, called Digital Switchover (DSO) or Analog Switch-off (ASO), is ongoing, and is already complete in nine countries, including the USA and parts of Europe and Scandinavia.

In total, over 120 territories have selected DVB-T, the standard supported by the STV4100, as offering the best flexibility, quality of service, and accessibility for all socio-economic groups.

By introducing the STV4100, ST now offers complete chipsets for digital-terrestrial receivers, including the tuner and a choice of demodulators, MPEG decoders, and combined demodulator/decoder ICs.

This enables customers to gain cost and efficiency advantages by partnering with ST to fulfill their entire chipset requirements for Standard-Definition (SD) or High-Definition (HD) products. The STV4100 meets all DVB-T standards including DTG, Nordig Unified v2.0, and Digitenne.

Silicon tuners are replacing the so-called 'can tuners' often supplied by third-party providers, which combine multiple discrete components in a metal enclosure and must be individually adjusted for optimum performance.

ST's STV4100 saves up to 30 separate components, has a compact QFN 5 x 5mm footprint, and requires no adjustment. In addition, the operating current of only 600mA helps minimize the power consumption of products such as set-top boxes, iDTVs, PC-TV receivers, and DVD or Blu-ray recorders.

"With digital switchover now imminent in many territories using DVB-T broadcasting, the STV4100 allows us to deliver complete silicon chipsets for DVB-T equipment at a time when growth in worldwide demand is expected to accelerate dramatically," said Philippe Lambinet, Executive Vice President of ST's Home Entertainment and Displays Group.

"This device follows logically from our silicon tuners for digital-satellite applications, which have achieved cumulative shipments of more than 50 million units since 2004, and will strengthen our position in markets for DVB-T equipment."

The STV4100 can be used with the STV0362 demodulator to create a generic STB front-end for a decoder IC such as the STi7105.

Alternatively, the device can be used with one of ST's combined demodulator/decoder ICs such as the STi516x family for SD MPEG2 decoder, or the forthcoming STi5267 and STi7167 H.264 decoders for SD and HD applications, respectively.

The STV4100 is in production now, priced at $1.80 in quantities of 10,000 units.

Thursday, 6 August 2009

PGI Visual Fortran 9.0 adds support for MPI debugging on Windows HPC Server 2008 clusters

SINGAPORE: The Portland Group, a wholly-owned subsidiary of STMicroelectronics, today announced the general availability of PGI Visual Fortran (PVF) Release 9.0 for Windows workstations, servers and clusters.

PVF 9.0 is the first general release to include support for the building, launching and debugging of Microsoft MPI (MSMPI) Fortran applications from within the Microsoft Visual Studio integrated development environment.

PVF augments the Visual Studio debugger by adding a Fortran language specific custom debug engine. The PVF debug engine supports debugging of single- and multi-thread, OpenMP, multi-thread MSMPI and hybrid MSMPI+OpenMP Fortran applications.

It enables debugging of 64-bit or 32-bit applications using source code or assembly code, and provides full access to the registers and hardware state of the processors.

Other new multi-process MSMPI capabilities in PVF 9.0 include Visual Studio property pages for configuring compile-time options, launching applications either locally on a workstation or on a distributed-memory Windows HPC Server 2008 cluster system, and debugging of programs running either locally or on a cluster.

“PVF 9.0 is a big step forward in ease-of-use for HPC Fortran programmers porting applications to or developing applications for Windows workstations, servers and clusters,” said Douglas Miles, director, The Portland Group.

“For Windows Fortran users looking to leverage the power of Windows HPC Server 2008 clusters, the ability to cover all aspects of MPI and parallel Fortran application development from within the Microsoft Visual Studio IDE can simplify their work considerably.

“The majority of HPC applications are still written in Fortran and parallelized using MPI and OpenMP,” said Vince Mendillo, Director, Technical Computing Marketing, Microsoft.

“By including MSMPI job launch and debugging support within PGI Visual Fortran, PGI has further enhanced the Windows HPC Server 2008 ecosystem and simplified porting of HPC applications to Windows clusters.”

Additional new features in PVF 9.0 include support for Intel Core i7 (Nehalem) and Six-Core AMD Opteron (Istanbul) processors, several incremental Fortran 2003 features, improvements in serial debugging and disassembly speed, and completely updated documentation and online help.

PGI Visual Fortran is compatible with both the current version of Visual Studio, Visual Studio 2008, and the previous version, Visual Studio 2005.

PGI Release 9.0 is the first general release to include support for the high-level PGI Accelerator™ programming model on x64 processor-based Linux systems incorporating NVIDIA CUDA-enabled GPUs. Announced last month, the PGI Release 9.0 line of high-performance parallelizing compilers and development tools for Linux, Mac OS X and Windows is now available.

Thursday, 30 July 2009

STMicro, Stollmann to deliver complete NFC solution

GENEVA, SWITZERLAND & HAMBURG, GERMANY: STMicroelectronics and Stollmann, a leading supplier of communication protocol software, announced a joint agreement to offer turnkey NFC interface solutions, complete with all the necessary hardware and software components, to leading manufacturers of handsets and mobile consumer devices.

Near Field Communication (NFC), is a fast-growing wireless connectivity technology that can be used with various consumer devices, including mobile phones, enabling fast and secure short-range data-transfer wireless services, such as payment and transport ticketing applications.

ST's NFC chips and Stollmann's NFC software stack are now available for sampling to lead customers, and provide all the API (Application Programming Interface) and implementation technology required to meet NFC standards, including compliance with NFC Forum specifications.

"Stollmann is very well known for its expertise in the development of connectivity software," said Laurent Degauque, Telecom and NFC marketing manager, Digital Secure Access (DSA) Division, STMicroelectronics. "This is an important cooperation that will allow ST's customers to benefit from a complete and ready-to-use NFC solution that complies with all relevant standards."

"This co-operation with STMicroelectronics is a major milestone for Stollmann and its software solutions for NFC," said Christian Luhrs, Managing Director of Stollmann. "The combined strength of ST, with its leadership in contactless chips, and Stollmann, a leading protocol stack supplier, should mean that we see NFC handsets and other mobile devices in the hands of providers and consumers very quickly."

Within the framework of this cooperative effort, Stollmann is adapting its portable NFC software with the Java JSR-257 API to ST's NFC chips, including the extended functions that will be supported by ST.

ST's ST21NFCA chip supports all popular formats for contactless smart cards and RFID tags as well as an extended set of wired interfaces and protocols. These include I2C and SPI interfaces with ETSI HCI and a Single-Wire Protocol (SWP) interface for Secure Elements (SE). This chip supports all NFC modes (Peer-to-peer, Reader/Writer and CardEmulation).

The Stollmann protocol stack facilitates NFC communications with NDEF and RTD formats and supports direct legacy access to contactless smart cards and RFID tags. The NFaCe+ API allows simple access to any type of smart card. It is also possible to adapt the system to existing interfaces such as PCSC. The stack itself has been developed with porting to different platforms in mind.

Stollmann offers a JSR-257 implementation for Java platforms suitable especially for mobile phones and similar devices and supporting extended functions for legacy transfers.

Wednesday, 29 July 2009

GlobalFoundries in strategic customer engagement with STMicroelectronics

SUNNYVALE, USA: GLOBALFOUNDRIES announced a strategic customer relationship with STMicroelectronics.

One of the world’s leading suppliers of semiconductor solutions, ST will partner with GLOBALFOUNDRIES to produce products based on 40nm Low Power (LP) bulk silicon technology.

The 40nm LP process is ideal for the next generation of wireless applications, handheld devices, and consumer electronics, which require excellent performance and long battery life. First tape out and production of ST products by GLOBALFOUNDRIES is planned to start in 2010.

“When we launched GLOBALFOUNDRIES, our long-term vision was to bring a new business model to the foundry market and to become the partner of choice for the largest and most innovative semiconductor design and manufacturing companies,” said Doug Grose, Chief Executive Officer, GLOBALFOUNDRIES.

“With the addition of an industry-leader in low-power technology like STMicroelectronics we now begin to deliver on this vision. We look forward to harnessing our full capabilities for ST to provide best-in-class service in bringing their 40nm design innovation to life in high volumes and at mature yields.”

“To ensure ample capacity for our customer/partners at the leading-edge of low-power design, ST needs an agile and high-performance manufacturing partner that can adapt to our changing needs,” said Jean-Marc Chery, Executive Vice President, Chief Technology Officer, STMicroelectronics.

“With a strong commitment to manufacturing and technology excellence at the leading-edge, we believe GLOBALFOUNDRIES is an excellent partner to collaborate on low-power design innovation in 2010 and beyond.”

GLOBALFOUNDRIES production is currently centered at a state-of-the-art 300mm manufacturing campus in Dresden, Germany –- otherwise known as Fab 1. Consistently ranked as one of the top fabs in the industry, Fab 1 has a proven track record of ramping leading-edge technologies at high-volume and mature yields, most recently evidenced on a seamless ramp of 45nm process technology.

In July 2009, GLOBALFOUNDRIES also broke ground on Fab 2, a $4.2B wafer manufacturing facility in Malta, N.Y. Once complete, Fab 2 is expected to be the most advanced semiconductor foundry in the world.

ST's revenues of $1,993 million, up 20pc sequentially

SINGAPORE: STMicroelectronics (reported financial results for the 2009 second quarter and first half ended June 27, 2009.

“ST’s second quarter results reflect solid progress across several key fronts,” said President and CEO Carlo Bozotti.

He added: “Revenue results of $1.99 billion for the second quarter came in above the high end of our internal planning target range of $1.73 to $1.93 billion, principally driven by stronger-than-expected performance across most market segments including Computer, Automotive, Telecom and Industrial and in China and Asia-Pacific.
Bookings steadily increased through the second quarter despite a still uncertain environment.

"Our strong actions on fab loading to reduce inventory levels have led to a reduction in inventories of almost $400 million in just six months, accelerating inventory turns sequentially to 4.1 turns from 2.9 turns. As expected, these actions have driven our second quarter gross margin to an extraordinary low level.

"It is clear that the global recession has negatively impacted our financial results in the first half of 2009, but it has not slowed our efforts to develop leading-edge products.

"In the second quarter our pace of innovation continued as we brought to the market many next-generation products including analog controllers and power MOSFETs for power management in computer motherboards, high-voltage MDMesh power MOSFETs for switched-mode power supplies, MEMS gyroscopes, and advanced GPS solutions. Additionally, we ramped-up 55nm technology in ICs for set-top-boxes and, in wireless, we shipped in volume TD-SCDMA devices.”

Q2 review
ST’s net revenues for the second quarter of 2009 total $1,993 million and include the complete integration of the former Ericsson Mobile Platforms business into ST-Ericsson and $18 million from the licensing of technology.

Net revenues increased 20 percent sequentially reflecting an increase in demand across ST’s served market segments, as well as in all regions, with particular strength in China and Asia Pacific. Net revenues declined in comparison to the year-ago quarter in all market segments except Telecom, and in all regions except Asia Pacific, due to business conditions.

On a sequential basis, all market segments posted growth with Computer increasing by 36 percent, Automotive by 19 percent, Telecom by 14 percent, Industrial by 7 percent and Consumer by 1 percent.

Distribution registered the strongest sequential improvement by 44 percent reflecting the better alignment of inventory to current demand levels and improving market conditions. In comparison to the year-ago quarter, performance was led by the 17 percent growth of Telecom driven by the NXP Wireless and ST-Ericsson wireless transactions.

All other market segments decreased in the year-ago period with Computer down by 13 percent, Consumer by 33 percent, Industrial by 37 percent, and Automotive by 38 percent. Distribution decreased 36 percent reflecting a destocking of the channel and weak industry conditions.

Gross margin in the second quarter of 2009 was 26.1 percent, in-line with the first quarter of 2009 gross margin of 26.3%. As anticipated, ST’s second quarter gross margin was at an extraordinary low level due to significant unused capacity charges, inefficiencies related to manufacturing operations and a negative mix impact driven by the market demand in certain geographies, in particular, China.

In comparison to the year-ago period, lower manufacturing efficiencies, volumes and price more than offset the improved contribution of product mix, the positive effects from currency, licensing ST’s technology and the inclusion of the wireless transactions.

In the 2009 second quarter, combined SG&A and R&D expenses were $896 million compared to $837 million in the prior quarter and $751 million in the year-ago quarter.

As anticipated, combined SG&A and R&D expenses in the second quarter increased sequentially due to the integration of one additional month of the former Ericsson Mobile Platforms business into ST-Ericsson and a higher number of days in the second quarter, but were partially offset by ongoing cost reduction programs.

During the second quarter, the Company’s cost realignment initiatives were focused on completing the phase-out of wafer manufacturing operations in Carrollton, Texas, the ongoing reduction in workforce programs and the announced cost reduction actions at ST-Ericsson.

In conjunction with these efforts, ST posted second quarter restructuring and impairment charges of $86 million compared to $56 million and $185 million in the first quarter of 2009 and year-ago period, respectively.

Tuesday, 28 July 2009

ST's Cartesio+ processor for automotive infotainment and PNS

SINGAPORE: STMicroelectronics has introduced Cartesio+, a new application processor with embedded GPS for next-generation in-car and portable navigation systems.

Combining superior processing power and positioning accuracy with a rich set of integrated peripherals, ST’s Cartesio+ enables cost- and space-efficient navigation and infotainment applications with enhanced user experience.

“Capitalizing on the success of the first-generation Cartesio application processor, which made ST into one of the leading suppliers for GPS- enabled System-on-Chip ICs, the next-generation Cartesio+ offers high integration and high-performance features, while meeting the constraints of cost-sensitive applications,” said Domenico Rossi, General Manager of ST’s Car Radio and Multimedia Division.

“It is a cutting-edge System-on-Chip device that offers high-sensitivity embedded positioning capabilities and meets the power requirements of portable applications, while satisfying the most stringent automotive quality constraints.”

The Cartesio+ System-on-Chip is manufactured in ST’s 55nm process technology and integrates a powerful ARM1176 processor with a GPS/Galileo positioning subsystem enhanced with indoor sensitivity, an advanced 3D graphics engine, and a large set of connectivity peripherals, including multiple SD/MMC, CAN and USB with integrated physical layers.

The device’s embedded graphics acceleration engine is optimized for 3D map content rendering using ST’s patented anti-aliasing technique, which smoothes jagged edges in digital images improving map readability, without impacting on processor performance.

Cartesio+ also integrates a video input port for connecting auxiliary devices, such as a rear-view camera for safe parking, and a hardware JPEG decoder for fast picture browsing without taxing the chip’s main processing resources.

Cartesio+ also offers advanced power management capabilities, based on ‘power island’ technology, which allows areas of the chip to operate at different voltage levels. The device also supports dynamic scaling of the core frequency to improve battery life for portable applications.

To support customer designs, ST offers a complete cost-optimized kit for portable navigation devices, built around Cartesio+, which couples the application processor with ST’s STA5630 advanced GPS RF chip with integrated Low-Noise Amplifier, and three other key components from the Company’s rich portfolio: the STW4210 power management chip, an audio processing amplifier/LED display driver, and the STA2500D Bluetooth controller.

Building on ST’s world-class abilities in automotive technologies and applications, the new Cartesio+ processor has been designed to meet the specific and rigorous demands for quality and reliability in the automotive market.

Cartesio+ is a scalable device available with two different feature sets: the STA2064 and STA2065, which have been optimized for BOM-sensitive and performance-demanding applications, respectively.

Samples are available now to lead customers, with volume production scheduled for December 2009.

Monday, 27 July 2009

ST unveils latest advances in design methodologies at DAC 2009

SINGAPORE: STMicroelectronics will participate as presenter or co-author of several papers at the DAC 2009 (Design Automation Conference), which takes place from July 26-31, 2009, in San Francisco, California.

ST’s contributions to the conference cover advances in design methodologies and automation in the areas of 3-D stacking for complex SoC (System-on-Chip) ICs, physical- and system-level chip design, and IC reliability.

In the DAC 2009 ‘Management Day’ session, Philippe Magarshack, STMicroelectronics’ General Manager of Central CAD & Design Solutions will present: ‘3-D Stacking: Opportunities and Trends for Consumer SOCs’, which will discuss 3-D integration as a promising technology to extend the momentum of Moore’s Law into the next decade, offering higher transistor density, faster interconnects, heterogeneous technology integration, with potentially lower power, cost and faster time-to-market.

However, 3-D integration isn’t without challenges: the presentation discusses the need for a range of new capabilities including process technology, architectures, design methods and tools, and manufacturing-worthy test solutions to be developed before 3-D chips can be mass produced for consumer applications.

Also, as part of the Management Day, Magarshack will participate on the panel ‘Making Critical Decisions for Emerging SoC Development,’ which will discuss emerging solutions for complex nanometer SoCs and their economic impact.

ST is also presenting several papers in physical and system-level design, including the examination of architectural-level design and power-estimation techniques, and the design-automation of IP re-use.

The need to design differentiated SoC product derivatives in extremely narrow time windows is tackled by a paper from ST engineers. The paper describes the moving of design creation to higher levels of abstraction, presenting an ESL (Electronic System Level) design methodology as a solution to deal with the increasing design challenges in the industry. In addition, the paper explores solutions for optimal designs in terms of power performance and silicon die area.

Another paper describes how ST engineers have used the SPIRIT (Structure for Packaging, Integrating and Re-using IP within Tool flows) Consortium’s IP-XACT standards to enable IP reuse through design automation, to provide an SoC integration solution for ST’s program (with Freescale) for the fast development of new 32-bit automotive microcontroller families.

An approach to improving design productivity for digital consumer ICs is the subject of another paper. ST’s engineers propose allowing front-end designers to prototype the SoC at the architecture level, gaining early insight into potential implementation issues during the design capture stage.

Power management, also, is an increasingly important concern for both wireless and wired applications. ST engineers will present an architectural-level power planning and estimation system to manage the challenges to preserve power and extend battery life in portable products.

Testing and reliability are also addressed by ST’s engineers, in two papers. The first paper is a presentation on a low-power DFT (Design-For-Test) flow for multi-voltage designs and ATPG (Automatic Test Pattern Generation).

The second paper examines an approach for the reduction of EMI (Electromagnetic Interference) to produce very robust automotive IC designs.

Sunday, 26 July 2009

ST's integrated protection IC for standardized battery chargers for mobile devices

SINGAPORE: STMicroelectronics has introduced a new IC for cellphones and mobile devices that will help combat the environmental impact of large numbers of battery chargers discarded when their owners upgrade to newer equipment. With about one billion handsets now shipping each year, this could save over 500 million scrap chargers, worldwide.

Organizations, including the Chinese government and the GSM Association are proposing standard battery-charger connectors and voltages to allow universal chargers for mobile phones. These efforts are focusing on USB standards as a convenient, cost-effective solution.

In addition to reducing discarded chargers, standard chargers will also allow charging from a PC or laptop USB port. In fact, any type of mobile device, marketed in any territory, can improve environmental performance and increase convenience for users by providing a standardized charger interface.

ST’s new IC, the STBP120, protects the charging-control circuitry inside cellphones and other battery-powered portable equipment in case the external charger applies an excessive voltage.

A number of variants are available, suitable for a range of charging-voltage levels including the USB voltages recommended by the current best-known proposals. These include YD/T 1591-2006 put forward by China’s Minister for Information and Industry (MII).

When implemented inside a battery-powered product, the STBP120 monitors the voltage from the connected charger. If the detected voltage exceeds a preset threshold, an internal solid-state switch is opened, thereby preventing the over-voltage from damaging the internal circuitry.

There are four variants spanning threshold values from 5.375V to 6.02V, allowing engineers to optimize for USB chargers at up to 5.25V or other chargers at higher voltages up to 6.8V. Each device will protect against over-voltages as high as 28V.

In normal operation the internal switch, an N-channel MOSFET, has very low resistance of 90 milliOhms to promote efficiency and minimize heat dissipation.

Other features include a fault-indicator output, soft-start capability to limit inrush current to the charging circuitry, and a thermal shutdown to protect against excessive temperature.

The device can save pc-board space and component count in many other types of products where over-voltage protection is normally implemented using a discrete transient-voltage suppressor and a fuse. The over-voltage threshold can also be set more accurately than when using discrete devices.

The STBP120 is delivered in an ultra-small 2 x 2.5mm, 10-lead TDFN package, and is in full production priced at $0.37 in quantities of 1000 units.

Saturday, 18 July 2009

Nano2012 framework agreement at STMicroelectronics' Crolles site

CROLLES, FRANCE: STMicroelectronics and CEA-LETI, the French Laboratory for Electronics & Information Technology, have announced that Madame Christine Lagarde, the French Minister of Economy, Industry and Employment, along with representatives from national, regional and local authorities and managers from CEA-LETI and ST met at ST's site at Crolles, near Grenoble, France, to celebrate the formal launch of the Nano2012 Research and Development program.

Also present at the ceremony were representatives of IBM, which is a key partner of ST and CEA-LETI via important technology development agreements it has signed with both organizations.

Nano2012 is a public/private strategic R&D program, led by ST, which gathers research institutes and industrial partners and is supported by French national, regional and local authorities. The program aims to create one of the world's most advanced R&D clusters for the development of new generations of semiconductor technologies at the nanoelectronic level, where the dimensions of the structures used to build the silicon chips are in the order of tens of nanometers (billionths of a meter).

The Nano2012 co-operation program, along with other leading cooperative programs such as CATRENE, will significantly contribute to the continued strength of Europe's electronics industry by providing competitive access to the most advanced CMOS technologies from 32nm down to 22nm.

Work on the Nano2012 program started on January 1, 2008. The five-year program, which will run until December 31, 2012, is partly funded (Euros 457 million) by the French public authorities.

The program includes the participation of other partners such as INRIA (the French National Institute for Research in Computer Science and Control), CNRS (National Center for Scientific Research), universities, and many small- and medium-sized enterprise partners.

ST and CEA-LETI have a long history of R&D collaboration, including the initial set up of the Crolles R&D center in 1992. As a leading research laboratory, CEA-LETI provides a vital interface between long-term academic research and ST's market-driven industrial R&D.

In July 2007, ST joined the semiconductor Joint Development Alliance centered at IBM's Semiconductor Research and Development Center in East Fishkill and Albany, New York, which develops core and low-power CMOS processes from 32 to 22nm, and IBM joined ST in Crolles to develop value-added application-specific derivative CMOS technologies.

Additionally, CEA-LETI and IBM, which have strong and complementary expertise in the development of materials and processes required for CMOS technology, are collaborating on advanced process R&D down to 22nm and beyond, at CEA-LETI's Grenoble site (France), IBM's East Fishkill facility (NY), ST's Crolles site (France), and at the Albany NanoTech research center (NY).

Since the start of the Nano2012 program in January 2008, ST and IBM have exchanged researchers between their sites at Crolles and East Fishkill and have begun working along with researchers from CEA-LETI on a variety of key programs, including 32nm and 28 nm core CMOS processes, 45nm RF derivative technology for wireless applications and 65nm non-volatile-memory derivative technology for use in automotive and smart-card applications.

These technologies will allow exciting new products in communication, consumer, computer and automotive applications that consume less power and last longer on batteries, operate faster, and provide more functions and greater utility to end users.

Nano2012 focuses on technology platform development for low-power and application-specific derivative CMOS technologies. A technology platform encompasses the manufacturing process by which billions of transistors are integrated onto a single silicon chip as well as the components libraries and the design methodology to efficiently design leading-edge circuits in this process.

Utilizing its world-class teams based in Crolles and Grenoble, ST and its partners are already among the world leaders in this area and a key aim of Nano2012 is to extend this leadership.

Value-added application-specific derivative technologies are key differentiators to the standard CMOS technology and an important goal of Nano2012 is for the R&D cluster based in Grenoble-Isere to continue as a world leader in this field.

Thursday, 9 July 2009

STMicroelectronics boosts music phone user experience

SINGAPORE: STMicroelectronics has introduced a new IC that delivers superior sound quality from portable music players and feature-phones by excluding high-frequency interference from cellphones.

This new device is ideal for the growing number of cellphones being shipped with music-playback capabilities, which iSuppli predicts will grow to exceed one billion handsets annually by 2010, representing more than 90 percent of the market. It will also protect other portable music devices against interference from nearby cellphones.

The EMIF04-EAR02M8, measuring 1.5 x 1.7mm, can replace a network of discrete components or two separate ICs, normally designed into the music player’s headset-connection circuitry, saving as much as 72 percent of pc-board space.

This gives product developers extra freedom to implement new features. High attenuation of signals at frequencies from 900MHz to 1900MHz allows use in handsets for all cellular standards, as well as multi-band products, without lengthy fine-tuning of each design.

Although a small number of single-chip alternatives are available, only ST’s filtering and protection IC provides circuits that are individually optimized for the earphone and microphone connections, which require different filter characteristics.

ST has achieved this by combining its existing EMIF02-MIC03M6 and EMIF02-SPK02F2 for microphone and speaker interfaces into a single integrated device. Features to help maximize handset battery life include low-resistance earphone circuitry (0.3 Ohms), resulting in efficient driving of the speakers.

In addition to its highly integrated and optimized filtering, the new IC also provides required protection against electrostatic discharge (ESD) capable of damaging the handset’s internal components.

By protecting against ESD spikes up to 30kV in direct contact with the signal connections, this new device is more effective than passive ESD-protection components.

The EMIF04-EAR02M8 is available in a micro-QFN 8-lead package, priced at $0.24 for orders over 10,000 units.

Wednesday, 8 July 2009

Seoul Subway to save millions of dollars with ST's RFID ticketing technology

SINGAPORE: The world’s first RFID-based scheme for single-journey reusable ticketing in mass transportation has recently gone live in Seoul, South Korea

It is expected to save some 3 billion Won (over US$2.4 million) per year using a robust solution based on RFID technology from STMicroelectronics (NYSE: STM), a leading developer of RFID chips.

Serving a city of 10 million people and operating since 1974, the Seoul Subway became a part of the Seoul Metropolitan Government’s New Transportation System combining subway and bus networks in July 2004.

The New Transportation system introduced a refillable traffic-card system called T-Money, alongside conventional paper tickets for cash-paying passengers. Now, to save the cost of provisioning more than 450 million printed paper tickets every year, estimated at 6.8 Won each, the Seoul Subway is replacing its paper tickets with RFID smart cards called Single Journey Tickets.

In the new system, automated vending machines issue the Single Journey Ticket in exchange for each passenger’s payment plus a 500 Won deposit for the ticket. Each ticket contains ST’s SRT512 contactless memory chip, which has features that allow the cards to be returned and re-issued to new passengers.

This recycling of the tickets will save the cost and environmental impact of generating hundreds of millions of disposable paper tickets.

ST has worked with card issuer Korea Smart Card Co. Ltd. (KSCC), which operates the New Transportation System for the Seoul Metropolitan Government, to optimize the SRT512 to support the subway’s ticketing system.

“Support provided by ST has been invaluable in ensuring timely introduction of the Single Journey Ticket, particularly in providing standards-compliant products, technical expertise, and stability of supply,” said Kevin C.Moon, CFO, Korea Smart Card Co., Ltd. “The system is secure and robust and will reduce operating costs by eliminating paper tickets and saving staff time.”

“This is a major success for ST as it clearly demonstrates that our solution can satisfy the largest and most demanding applications,” said Benoit Rodrigues, General Manager of the RFID and EEPROM Division, STMicroelectronics.

“Our RFID solutions are in action worldwide, supporting ticketing for numerous events, venues and infrastructures, and this project proves the capabilities of our products in very large transportation systems. We expect this to create a stepping stone for further successes.”

The SRT512 is specifically designed for short-range applications meeting ISO 14443-B that need re-usable tokens, such as access-control, event-ticketing and mass-transport ticketing applications. To operate effectively in these applications, the device features a built-in anti-collision mechanism to prevent conflicts with other nearby cards, and achieves best-in-class transaction speed.

On-chip computation, including dual counters and anti-tear properties, enable a secure and physically robust solution.

“The SRT512 feature set was a key factor in winning the design-in for this project, and enabled us to deliver the security, reliability and robustness that KSCC and the Seoul Metropolitan Government required,” added Rodrigues.

ST has also previously collaborated with KSCC in the introduction of the T-Money pre-paid transport card. Accepted in buses, subway and taxis, these cards can also be used as an e-purse enabling low-value payments in shops in Seoul.

The T-Money pre-paid card is based on ST’s proven ST19WR contactless smartcards and has been deployed in large volume for the past two years. The device has demonstrated excellent contactless performance, which is a key factor to ensure speed of transaction and high throughput at validation gates, in addition to high security against attacks and counterfeiting.

With a wide range contactless product portfolio, from RFID memory to contactless smartcards, ST offers global solutions to transport operators ranging from single journey re-usable tickets to transport and micro-payment cards.

Monday, 6 July 2009

Veredus Labs’ VereFlu chip tested successfully on clinical samples of Pandemic H1N1-2009 influenza strain

SINGAPORE: Veredus Laboratories, a leading provider of molecular detection tests, today announced that the VereFlu chip has been tested successfully on confirmed pandemic H1N1-2009 influenza positive samples in a joint trial with the National Public Health Laboratory (NPHL).

The VereFlu chip, based on STMicroelectronics’s lab-on-chip platform, is a portable lab-on-chip application that can identify and differentiate human strains of Influenza A and B viruses in a single test with high accuracy and sensitivity.

The ability of the chip to simultaneously lock on multiple segments of the genes of the A(H1N1) influenza virus enables it to identify the virus with a much higher degree of confidence compared to other tests.

This capability is made possible by the microarray on the chip and this is especially relevant for influenza viruses as they are known for their rapid mutation. The advantage of VereFlu is its ability to identify an infection without multiple testing as required by current methods, thereby saving time.

“Monitoring of influenza activity is very important, as demonstrated by this crisis with H1N1-2009. The NPHL does regular surveillance of influenza subtypes and strains circulating in the community. We have now involved more medical labs to participate in the surveillance work. We are constantly on the lookout for new technologies able to detect and identify influenza virus types quickly. It is good that Singapore companies are able to respond with new solutions for testing pandemic influenza," said Associate Professor Raymond Lin, Head of the Ministry of Health’s National Public Health Laboratory.

“We are greatly encouraged with the findings as it validates our proprietary methodology. Veredus will continue to work with our current customers, including public health laboratories around the world to further confirm our findings. Our next step is to enable the chip to check for drug resistance in Influenza A(H1N1) as it mutates. This will significantly enhance its capability to combat potentially deadly variants of influenza viruses,” said Dr Rosemary Tan, CEO of Veredus Laboratories. “VereFlu is already being deployed to several pilot users in Asia and Middle East and we look forward to increasing our customer base.”

“In face of this global pandemic on A(H1N1), the combination of ST’s lab-on-chip platform with Veredus’ molecular diagnostics expertise stands out as a powerful tool in its ability to provide rapid and accurate identification of the virus,” said Anton Hofmeister, Group Vice-President and General Manager for ST’s Microfluidic Division. “The findings of the trial confirm our joint efforts in the field of molecular diagnostics are on the right track and set to catalyze the adoption of VereFluTM in the market.”