CAMBRIDGE, UK & IRVINE, USA: ARM and Broadcom Corp. have signed a major licensing agreement for the ARM Cortex-A9 MPCore multicore processor.
Broadcom intends to target the technology towards next-generation mobile, wireless and other consumer electronics applications.
In addition to the Cortex-A9 processor, the agreement included ARM NEON SIMD (Single Instruction, Multiple Data) technology for the ARM Cortex-A series processors, designed to provide acceleration for advanced, feature-rich multimedia, gaming and compute intensive applications.
“This licensing agreement extends our ARM processor portfolio. The flexibility and scalability of the Cortex-A9 processor enables us to optimize development costs by addressing the requirements of wireless applications from a common core platform,” said Nambi Seshadri, VP and CTO, Mobile Platforms and Wireless Connectivity Division, Broadcom.
“This latest agreement with a recognized market leader in wireless system integration demonstrates the continued market momentum for the ARM Cortex-A9 processor and ARM multicore technology,” said Mike Inglis, EVP and general manager, Processor Division, ARM.
“By leveraging the performance and power efficiency benefits of the Cortex family of processors along with the other advanced ARM technology, Broadcom can offer feature-rich, future proof solutions for every segment of the wireless market.”
The ARM Cortex-A9 MPCore processor’s scalable performance enables developers to exceed the performance of today’s high-performance embedded devices while consuming significantly less power.
In addition, the Cortex-A9 processor features power management features including adaptive gating, dynamic voltage and frequency scaling and the ability for each core to go independently into standby, dormant or power-off energy management states, providing control over the dynamic as well as the static energy consumed by both the processor and memories.
The Cortex-A9 MPCore processor can contain up to four independently configured, but fully coherent cores carrying out multiple tasks on each one in parallel. However since any complexity is hidden in hardware, the processor can be programmed as easily as a single core processor by utilizing one of the many SMP-aware operating systems.
A single core Cortex-A9 processor is capable of delivering 2x the performance of today’s smartphone processors and the ARM MPCore technology scales that performance even further.
A four-CPU Cortex-A9 processor cluster is capable of delivering an unprecedented 10,000 aggregate DMIPS when clocked at 1GHz. To simplify and broaden the adoption of multicore solutions, the Cortex-A9 processor supports system-level coherence with accelerators and DMA to increase performance and reduce power consumption at the system level.
Showing posts with label Broadcom. Show all posts
Showing posts with label Broadcom. Show all posts
Monday, 28 September 2009
Monday, 17 August 2009
MoCA 1.1 certification for Broadcom's integrated MoCA SoC reference design
IRVINE, USA: Broadcom Corp. recently announced that its home networking reference design platform for set-top box (STB) and broadband access products, featuring integrated Multimedia over Coax Alliance (MoCA) connectivity, has received MoCA 1.1 Certification from the MoCA Certification Board.
The integration of MoCA 1.1 connectivity into Broadcom SoC solutions enables Broadcom to offer net throughput of 175Mbps using packet aggregation, a significant increase over MoCA's previously stated performance metric of 100Mbps (with unmatched coax outlet coverage).
Additional features include parameterized quality of service (PQoS) for bandwidth management and the ability to prioritize multiple streams of high definition (HD) content. Broadcom's MoCA 1.1 certified home networking reference design platform also includes an increase in network size from eight nodes to 16 nodes.
As digital content usage increases in the home, consumers expect it to be available on any television, and at any time. MoCA connectivity allows service providers to utilize their existing in-home coaxial infrastructure, enabling media devices to take advantage of these new applications throughout the home.
The MoCA specification developed by the alliance has been adopted by most of the leading US service providers as the preferred in-home networking technology.
The ability to access and share distributed digital multimedia content throughout multiple rooms and devices within a household is rapidly becoming a reality, as cable, satellite and telecom service providers begin to offer these services as consumer electronics makers offer Digital Living Network Alliance (DLNA) products. DLNA enables consumer appliances to connect and exchange digital content throughout the home utilizing MoCA, Ethernet or Wi-Fi networks.
By implementing the Broadcom MoCA 1.1 reference design platform for STB and media gateway designs, service providers can offer whole-home digital media distribution services that let subscribers securely access, store and share multiple types of digital media content including HDTV programs, video-on-demand, recordings from digital video recorders, Internet content, video, music, photos and voice over Internet protocol.
Broadcom's MoCA Certification within its MoCA reference design platform will help the specification's adoption and will proliferate into a variety of next generation solutions.
"We are pleased that our integrated MoCA reference design received MoCA 1.1 certification which further emphasizes our commitment to enabling whole-home entertainment for the consumer," said Dan Marotta, Senior Vice President & General Manager of Broadcom's Broadband Communications Group.
"Coupled with our broad portfolio of STB and media gateway designs, MoCA 1.1 will address the evolving needs of operators for additional throughput, more device support and quality of service."
"Service providers are always looking for better methods of bandwidth management for premium services and content, especially with the expanding network of technologies incorporating the MoCA standard," said Rob Gelphman, Chair, Marketing Work Group, Multimedia over Coax Alliance.
"As one of the most prominent chip vendors in the cable industry and home networking market, Broadcom's 1.1 certification is yet another milestone for the MoCA standard, as their commitment will help to accelerate deployment of the standard as we make great strides towards achieving worldwide adoption."
The integration of MoCA 1.1 connectivity into Broadcom SoC solutions enables Broadcom to offer net throughput of 175Mbps using packet aggregation, a significant increase over MoCA's previously stated performance metric of 100Mbps (with unmatched coax outlet coverage).
Additional features include parameterized quality of service (PQoS) for bandwidth management and the ability to prioritize multiple streams of high definition (HD) content. Broadcom's MoCA 1.1 certified home networking reference design platform also includes an increase in network size from eight nodes to 16 nodes.
As digital content usage increases in the home, consumers expect it to be available on any television, and at any time. MoCA connectivity allows service providers to utilize their existing in-home coaxial infrastructure, enabling media devices to take advantage of these new applications throughout the home.
The MoCA specification developed by the alliance has been adopted by most of the leading US service providers as the preferred in-home networking technology.
The ability to access and share distributed digital multimedia content throughout multiple rooms and devices within a household is rapidly becoming a reality, as cable, satellite and telecom service providers begin to offer these services as consumer electronics makers offer Digital Living Network Alliance (DLNA) products. DLNA enables consumer appliances to connect and exchange digital content throughout the home utilizing MoCA, Ethernet or Wi-Fi networks.
By implementing the Broadcom MoCA 1.1 reference design platform for STB and media gateway designs, service providers can offer whole-home digital media distribution services that let subscribers securely access, store and share multiple types of digital media content including HDTV programs, video-on-demand, recordings from digital video recorders, Internet content, video, music, photos and voice over Internet protocol.
Broadcom's MoCA Certification within its MoCA reference design platform will help the specification's adoption and will proliferate into a variety of next generation solutions.
"We are pleased that our integrated MoCA reference design received MoCA 1.1 certification which further emphasizes our commitment to enabling whole-home entertainment for the consumer," said Dan Marotta, Senior Vice President & General Manager of Broadcom's Broadband Communications Group.
"Coupled with our broad portfolio of STB and media gateway designs, MoCA 1.1 will address the evolving needs of operators for additional throughput, more device support and quality of service."
"Service providers are always looking for better methods of bandwidth management for premium services and content, especially with the expanding network of technologies incorporating the MoCA standard," said Rob Gelphman, Chair, Marketing Work Group, Multimedia over Coax Alliance.
"As one of the most prominent chip vendors in the cable industry and home networking market, Broadcom's 1.1 certification is yet another milestone for the MoCA standard, as their commitment will help to accelerate deployment of the standard as we make great strides towards achieving worldwide adoption."
Friday, 31 July 2009
Top 20 semicon rankings Q2-09 -- TSMC climbs up, AMD slips down!
Very interesting, isn't it? And I am not surprised! TSMC deserves to move up the top 20 semiconductor companies rankings!! It seems that AMD especially needs to really get its act together.
First, to the rankings. Recently, IC Insights released the list of the top 20 semiconductor sales leaders during Q2-09.
Source: IC Insights
In this list, there are four fabless semiconductor companies -- Qualcomm, Broadcom, MediaTek and Nvidia in the top 20, and one foundry -- TSMC, perhaps, emphasizing the growing influence of TSMC as well as the fabless semiconductor companies.
AMD slips! Again?
I had written a couple of posts some time back on AMD and Intel, where the former had commented on the EC ruling on Intel, and also how both were at each other's throats, and had asked the question -- how will all of this help the market?
Well, one hopes that AMD will come back very much stronger in the next quarter, despite its uninspiring guidance for 3Q09, saying that it expects its sales to be "up slightly" from 2Q09.
TSMC, Hynix, MediaTek shine
Coming back to the table, the clear movers are TSMC, and no surprises there, as well as Hynix and MediaTek. In fact, with a little better Q3 performance, TSMC could well move up to the third position, overtaking both Texas Instruments and Toshiba.
Look at the last column -- the 2Q09/1Q09 percentage change -- TSMC has grown by a whopping 93 percent! One other thing! TSMC is reportedly eyeing business opportunities in solar photovoltaics and LEDs in a bid to diversify its revenue channels. Should these happen, expect TSMC to move up higher!
The closest to TSMC in terms of growth are Hynix at 40 percent and Qualcomm at 36 percent, respectively. MediaTek, another impressive mover, grew by 20 percent. Of course, there is Samsung as well, with 29 percent growth.
ST, Micron, Nvidia and NXP have done well too! According to IC Insights, Nvidia replaced Fujitsu in the Q2-09 top 20 rankings. And that brings us to the shakers or those who fared poorly.
Fujitsu, AMD, Freescale slide!
I've already touched upon AMD. Fujitsu cited flash memory and automotive device sales to have suffered immensely this quarter. However, it hopes Q3 will be better and said that customer demand was picking up. So, it could well be back in the Top 20 during Q3.
Yet another slip was in store for Freescale. It slipped from 16th position in 2008 to 18th position during Q1-09, and slid further to 20th position in Q2-09. Perhaps, overdependance on automotives has been its undoing.
An interesting statistic from IC Insights -- Fujitsu, with -9 percent and Freescale, with -2 percent growth, were the only two top-20 companies from Q1-09 to register a 2Q09/1Q09 sales decline!
Wonderful industry guidance
It is heartening to see 19 of the 20 companies registering positive growth this quarter. It won't be improper here to commend IC Insights on its wonderful industry guidance!
In an IC Insights study from late December 2008, it was very vocal in advising firms to adopt a quarterly outlook! It also forecast a significant rebound in the IC market beginning in the third quarter of the year!
IC Insights also stood out by pointing out in early July that H2-09 is likely to usher in strong seasonal strength for electronic system sales, a period of IC inventory replenishment, which began in 2Q09, and positive worldwide GDP growth.
IC Insights had marked 4Q08 as the beginning of the downturn/collapse and Q1-09 as the bottom of the cycle. This quarter (Q2) has largely been a replenishment phase for the inventories. Going by that count, Q3 could well see a true seasonal increase in demand. IC Insights also said that during Q4-09, market growth will mirror the health of the worldwide economy and electronic system sales.
There is light, after all, at the end of the tunnel! Wonder why are the industry folks continue to tell each other -- we still aren't having a good time! Maybe, it is time for them to shed their pessimism and from holding back on investments, and move on to show steely optimism, and indulge in really aggressive buying and selling! After all, work and progress will happen ONLY if you work!!
First, to the rankings. Recently, IC Insights released the list of the top 20 semiconductor sales leaders during Q2-09.
Source: IC InsightsIn this list, there are four fabless semiconductor companies -- Qualcomm, Broadcom, MediaTek and Nvidia in the top 20, and one foundry -- TSMC, perhaps, emphasizing the growing influence of TSMC as well as the fabless semiconductor companies.
AMD slips! Again?
I had written a couple of posts some time back on AMD and Intel, where the former had commented on the EC ruling on Intel, and also how both were at each other's throats, and had asked the question -- how will all of this help the market?
Well, one hopes that AMD will come back very much stronger in the next quarter, despite its uninspiring guidance for 3Q09, saying that it expects its sales to be "up slightly" from 2Q09.
TSMC, Hynix, MediaTek shine
Coming back to the table, the clear movers are TSMC, and no surprises there, as well as Hynix and MediaTek. In fact, with a little better Q3 performance, TSMC could well move up to the third position, overtaking both Texas Instruments and Toshiba.
Look at the last column -- the 2Q09/1Q09 percentage change -- TSMC has grown by a whopping 93 percent! One other thing! TSMC is reportedly eyeing business opportunities in solar photovoltaics and LEDs in a bid to diversify its revenue channels. Should these happen, expect TSMC to move up higher!
The closest to TSMC in terms of growth are Hynix at 40 percent and Qualcomm at 36 percent, respectively. MediaTek, another impressive mover, grew by 20 percent. Of course, there is Samsung as well, with 29 percent growth.
ST, Micron, Nvidia and NXP have done well too! According to IC Insights, Nvidia replaced Fujitsu in the Q2-09 top 20 rankings. And that brings us to the shakers or those who fared poorly.
Fujitsu, AMD, Freescale slide!
I've already touched upon AMD. Fujitsu cited flash memory and automotive device sales to have suffered immensely this quarter. However, it hopes Q3 will be better and said that customer demand was picking up. So, it could well be back in the Top 20 during Q3.
Yet another slip was in store for Freescale. It slipped from 16th position in 2008 to 18th position during Q1-09, and slid further to 20th position in Q2-09. Perhaps, overdependance on automotives has been its undoing.
An interesting statistic from IC Insights -- Fujitsu, with -9 percent and Freescale, with -2 percent growth, were the only two top-20 companies from Q1-09 to register a 2Q09/1Q09 sales decline!
Wonderful industry guidance
It is heartening to see 19 of the 20 companies registering positive growth this quarter. It won't be improper here to commend IC Insights on its wonderful industry guidance!
In an IC Insights study from late December 2008, it was very vocal in advising firms to adopt a quarterly outlook! It also forecast a significant rebound in the IC market beginning in the third quarter of the year!
IC Insights also stood out by pointing out in early July that H2-09 is likely to usher in strong seasonal strength for electronic system sales, a period of IC inventory replenishment, which began in 2Q09, and positive worldwide GDP growth.
IC Insights had marked 4Q08 as the beginning of the downturn/collapse and Q1-09 as the bottom of the cycle. This quarter (Q2) has largely been a replenishment phase for the inventories. Going by that count, Q3 could well see a true seasonal increase in demand. IC Insights also said that during Q4-09, market growth will mirror the health of the worldwide economy and electronic system sales.
There is light, after all, at the end of the tunnel! Wonder why are the industry folks continue to tell each other -- we still aren't having a good time! Maybe, it is time for them to shed their pessimism and from holding back on investments, and move on to show steely optimism, and indulge in really aggressive buying and selling! After all, work and progress will happen ONLY if you work!!
Friday, 10 July 2009
Broadcom drops efforts to acquire Emulex
IRVINE, USA: Broadcom Corp., in response to the rejection by the Board of Directors of Emulex Corp. of its proposal to enter into friendly discussions toward a negotiated transaction, said it would cease all efforts to acquire Emulex.
Broadcom reiterated that its all-cash $11-per-share offer, announced on June 29, 2009, is the best offer it intends to make. Broadcom said it will allow its previously announced tender offer for Emulex stock to expire at midnight Eastern Time on July 14, 2009.
"As we stated in our letter of June 29, 2009 to the Emulex Board, we believe it is in the interest of each company's stakeholders to complete a transaction expeditiously or to move on," said Scott A. McGregor, President and CEO of Broadcom.
"Although we were unable to negotiate an expeditious and friendly transaction at a price that makes sense to us given the expectations set by the Emulex Board, there are other value-creating alternatives that we will now turn our attention to as we position Broadcom to capitalize on the emerging opportunities in the converged enterprise networking markets."
Because of Emulex's rejection, coupled with its previous adoption of a poison pill and other revisions made to its corporate bylaws in January 2009, Broadcom does not expect that the conditions to close its tender offer will be satisfied by July 14, 2009, and Broadcom does not intend to waive any of these conditions.
Assuming that the conditions are not satisfied on or before July 14, 2009, Broadcom will not accept for payment any shares that have been tendered and will return those shares as promptly as practicable after the tender offer expires.
Broadcom reiterated that its all-cash $11-per-share offer, announced on June 29, 2009, is the best offer it intends to make. Broadcom said it will allow its previously announced tender offer for Emulex stock to expire at midnight Eastern Time on July 14, 2009.
"As we stated in our letter of June 29, 2009 to the Emulex Board, we believe it is in the interest of each company's stakeholders to complete a transaction expeditiously or to move on," said Scott A. McGregor, President and CEO of Broadcom.
"Although we were unable to negotiate an expeditious and friendly transaction at a price that makes sense to us given the expectations set by the Emulex Board, there are other value-creating alternatives that we will now turn our attention to as we position Broadcom to capitalize on the emerging opportunities in the converged enterprise networking markets."
Because of Emulex's rejection, coupled with its previous adoption of a poison pill and other revisions made to its corporate bylaws in January 2009, Broadcom does not expect that the conditions to close its tender offer will be satisfied by July 14, 2009, and Broadcom does not intend to waive any of these conditions.
Assuming that the conditions are not satisfied on or before July 14, 2009, Broadcom will not accept for payment any shares that have been tendered and will return those shares as promptly as practicable after the tender offer expires.
Emulex board unanimously rejects Broadcom's offer
COSTA MESA, USA: Emulex Corp. announced that its Board of Directors has responded to the revised offer by Broadcom Corp. to acquire Emulex for $11.00 per share in cash, and unanimously rejected the offer.
After a thorough review of the Broadcom revised offer with the assistance of its financial and legal advisors, Goldman Sachs & Co. and Gibson, Dunn & Crutcher LLP, respectively, the Board determined that the offer significantly undervalues Emulex's long-term prospects, is inadequate, and is not in the best interests of Emulex and its stockholders.
The Board therefore recommends that Emulex stockholders not tender their shares into the offer. The Company also announced preliminary financial results for the fourth fiscal quarter ended June 28, 2009 at the high end of its guidance, and four new tier-one original equipment manufacturer (OEM) product design wins.
"Throughout our review of Broadcom's offers, the Board has been focused first and foremost on serving the best interests of Emulex stockholders," said Paul Folino, Executive Chairman.
"We unanimously believe Emulex will deliver significantly more value than Broadcom's revised offer through the Company's rapidly developing converged networking business and solid execution in our host server and embedded storage markets.
While the Board is very enthusiastic about Emulex's future prospects and will continue to focus on executing the Company's current strategy, consistent with the Board's fiduciary duties we would of course give full consideration to a bona fide offer from any party that reflects the full value of the Company."
Jim McCluney, President and CEO, said, "Underscoring the success of our strategic initiatives, we recently secured two new tier-one 10Gb/s Ethernet OneConnect Converged Network Adapter design wins, adding to the twelve wins that we disclosed in May.
In recent weeks, we also secured two new OEM design wins for our LightPulse Fibre Channel Host Bus Adapters. These new design wins further validate our projections of $600 million in revenue and $1.45 in non-GAAP earnings per share in fiscal year 2012, and reinforce the additional upside opportunities available to the Company.
We are also pleased to announce today preliminary revenue and fully diluted EPS results for the fourth quarter that are at the high end of our guidance. We believe this solid performance demonstrates our ability to execute against our guidance.
"Emulex today announced that it preliminarily expects to report revenues of approximately $78 - $79 million for its fourth fiscal quarter ended June 28, 2009, compared to the range of $73 - $80 million projected in April 2009 during the Company's third quarter conference call. The Company preliminarily expects non-GAAP earnings per share for its fourth fiscal quarter to be at the high end of the prior guidance of $0.01 - $0.05 per diluted share.
After a thorough review of the Broadcom revised offer with the assistance of its financial and legal advisors, Goldman Sachs & Co. and Gibson, Dunn & Crutcher LLP, respectively, the Board determined that the offer significantly undervalues Emulex's long-term prospects, is inadequate, and is not in the best interests of Emulex and its stockholders.
The Board therefore recommends that Emulex stockholders not tender their shares into the offer. The Company also announced preliminary financial results for the fourth fiscal quarter ended June 28, 2009 at the high end of its guidance, and four new tier-one original equipment manufacturer (OEM) product design wins.
"Throughout our review of Broadcom's offers, the Board has been focused first and foremost on serving the best interests of Emulex stockholders," said Paul Folino, Executive Chairman.
"We unanimously believe Emulex will deliver significantly more value than Broadcom's revised offer through the Company's rapidly developing converged networking business and solid execution in our host server and embedded storage markets.
While the Board is very enthusiastic about Emulex's future prospects and will continue to focus on executing the Company's current strategy, consistent with the Board's fiduciary duties we would of course give full consideration to a bona fide offer from any party that reflects the full value of the Company."
Jim McCluney, President and CEO, said, "Underscoring the success of our strategic initiatives, we recently secured two new tier-one 10Gb/s Ethernet OneConnect Converged Network Adapter design wins, adding to the twelve wins that we disclosed in May.
In recent weeks, we also secured two new OEM design wins for our LightPulse Fibre Channel Host Bus Adapters. These new design wins further validate our projections of $600 million in revenue and $1.45 in non-GAAP earnings per share in fiscal year 2012, and reinforce the additional upside opportunities available to the Company.
We are also pleased to announce today preliminary revenue and fully diluted EPS results for the fourth quarter that are at the high end of our guidance. We believe this solid performance demonstrates our ability to execute against our guidance.
"Emulex today announced that it preliminarily expects to report revenues of approximately $78 - $79 million for its fourth fiscal quarter ended June 28, 2009, compared to the range of $73 - $80 million projected in April 2009 during the Company's third quarter conference call. The Company preliminarily expects non-GAAP earnings per share for its fourth fiscal quarter to be at the high end of the prior guidance of $0.01 - $0.05 per diluted share.
Thursday, 9 July 2009
TV IC market declines seasonally to 30.8mn units shipped in Q1’09
AUSTIN, USA: The TV IC market declined seasonally to 30.8 million units shipped into flat panel TVs in Q1’09, according to the latest research in the DisplaySearch Q2’09 Quarterly TV Electronics Report.
Shipments were down 4.3 percent Q/Q, but up 11 percent Y/Y. This is in line with the normal seasonal trends, and with the maturing of flat panel TV as developed markets have completed the switch from CRT TVs.
The growth of integrated digital TVs and the analog switch-off in developed regions is profoundly changing the demands of broadcast reception.
While it is clear that analog reception will remain a requirement for some years after switch-off dates, a combination of silicon tuner IC maturity, a more benign reception environment, and cost pressure will bring silicon tuners into the mainstream.
DisplaySearch forecasts that silicon tuners will grow to just under 39 million units shipped into TV sets in 2013, compared to a total of 177 million sets shipped with digital decoding.
By then, Japan, the EU and the US will all have completed analog switch-off, but the fastest growth will be in emerging markets, which are expected to increase from 4 million in 2009 to 70 million in 2013.
“While silicon tuners still have a way to go to exceed the performance of the best ‘can tuner’ modules, they are poised to grow rapidly in television sets” Paul Gray, DisplaySearch Director of European TV Research noted.
Gray added: “Despite the strong growth of digital TVs, it would be unwise to ignore analog transmissions, which will live on for some years in older cable installations, low power transmissions and to support legacy equipment. It will be a brave product manager who makes a digital-only set even in 2013.”
Fig. 1: Shipment Forecast for TVs with Terrestrial Silicon Tuners
Source: DisplaySearch Q2’09 Quarterly TV Electronics Report.
Industry consolidation took several steps in the quarter, with Micronas completing the sale of its frame rate conversion, audio and demodulator product lines to Trident.
The remainder of its consumer business (including the TV system-on-chip business) will cease by the end of the year. In addition, NEC and Renesas announced an intention to merge, while AMD’s TV IC business completed its first quarter as part of Broadcom, now one of the top five TV system IC suppliers.
Table 1: Top TV System IC Vendors
Source: DisplaySearch Q2’09 Quarterly TV Electronics Report.
Other highlights from DisplaySearch’s Quarterly TV Electronics Report include:
* An analysis of the emergence of silicon tuners into TV sets: This includes technical requirements, the future shape of the tuner business and a forecast of silicon tuners in TV sets. DisplaySearch expects that 38.9 million TV sets sold in 2013 will have silicon tuners.
* Forecast and analysis of 200/240 Hz TVs, including a comparison of the different video processing systems used by major set makers.
* Outlook for MPEG-4 enabled TVs for the latest HD DVB broadcast in Europe, networked TVs and sets with DVB-S2 reception: DisplaySearch forecasts that almost 110 million MPEG-4 ICs will be built into TVs in 2012.
Shipments were down 4.3 percent Q/Q, but up 11 percent Y/Y. This is in line with the normal seasonal trends, and with the maturing of flat panel TV as developed markets have completed the switch from CRT TVs.
The growth of integrated digital TVs and the analog switch-off in developed regions is profoundly changing the demands of broadcast reception.
While it is clear that analog reception will remain a requirement for some years after switch-off dates, a combination of silicon tuner IC maturity, a more benign reception environment, and cost pressure will bring silicon tuners into the mainstream.
DisplaySearch forecasts that silicon tuners will grow to just under 39 million units shipped into TV sets in 2013, compared to a total of 177 million sets shipped with digital decoding.
By then, Japan, the EU and the US will all have completed analog switch-off, but the fastest growth will be in emerging markets, which are expected to increase from 4 million in 2009 to 70 million in 2013.
“While silicon tuners still have a way to go to exceed the performance of the best ‘can tuner’ modules, they are poised to grow rapidly in television sets” Paul Gray, DisplaySearch Director of European TV Research noted.
Gray added: “Despite the strong growth of digital TVs, it would be unwise to ignore analog transmissions, which will live on for some years in older cable installations, low power transmissions and to support legacy equipment. It will be a brave product manager who makes a digital-only set even in 2013.”
Fig. 1: Shipment Forecast for TVs with Terrestrial Silicon Tuners
Source: DisplaySearch Q2’09 Quarterly TV Electronics Report.Industry consolidation took several steps in the quarter, with Micronas completing the sale of its frame rate conversion, audio and demodulator product lines to Trident.
The remainder of its consumer business (including the TV system-on-chip business) will cease by the end of the year. In addition, NEC and Renesas announced an intention to merge, while AMD’s TV IC business completed its first quarter as part of Broadcom, now one of the top five TV system IC suppliers.
Table 1: Top TV System IC Vendors
Source: DisplaySearch Q2’09 Quarterly TV Electronics Report.Other highlights from DisplaySearch’s Quarterly TV Electronics Report include:
* An analysis of the emergence of silicon tuners into TV sets: This includes technical requirements, the future shape of the tuner business and a forecast of silicon tuners in TV sets. DisplaySearch expects that 38.9 million TV sets sold in 2013 will have silicon tuners.
* Forecast and analysis of 200/240 Hz TVs, including a comparison of the different video processing systems used by major set makers.
* Outlook for MPEG-4 enabled TVs for the latest HD DVB broadcast in Europe, networked TVs and sets with DVB-S2 reception: DisplaySearch forecasts that almost 110 million MPEG-4 ICs will be built into TVs in 2012.
Tuesday, 30 June 2009
Emulex advises stockholders to take no action to revised Broadcom tender offer
COSTA MESA, USA: Emulex Corp. said that its Board of Directors, consistent with its fiduciary duties and with the assistance of its financial and legal advisors, Goldman, Sachs & Co. and Gibson, Dunn & Crutcher LLP, respectively, will review the terms of the revised tender offer from Broadcom Corp. to acquire all of the outstanding Emulex shares for $11.00 per share in cash.
Broadcom's previous offer was $9.25 per share in cash. The Emulex Board will make its recommendation to stockholders on the revised tender offer in due course. The Company urges stockholders at this time not to tender any shares into the revised offer pending the Board's recommendation.
Emulex noted that Broadcom stated in their announcement that Broadcom dropped its consent solicitation without delivering any consents and that Broadcom has also filed a notice of dismissal of its Delaware litigation against Emulex and the Emulex Board of Directors.
Emulex stockholders with any questions about the tender offer or other related matters may contact MacKenzie Partners, Inc. at 1-800-322-2885.
Broadcom's previous offer was $9.25 per share in cash. The Emulex Board will make its recommendation to stockholders on the revised tender offer in due course. The Company urges stockholders at this time not to tender any shares into the revised offer pending the Board's recommendation.
Emulex noted that Broadcom stated in their announcement that Broadcom dropped its consent solicitation without delivering any consents and that Broadcom has also filed a notice of dismissal of its Delaware litigation against Emulex and the Emulex Board of Directors.
Emulex stockholders with any questions about the tender offer or other related matters may contact MacKenzie Partners, Inc. at 1-800-322-2885.
Broadcom raises Emulex offer to $11.00 per share
IRVINE, USA: Broadcom Corp. announced that it raised its tender offer for all of the currently outstanding shares of common stock (including the associated preferred stock purchase rights) of Emulex Corp. from $9.25 to $11.00 per share in cash, representing a total equity value of approximately $912 million.
As required by law, Broadcom will extend its tender offer for an additional 10 business days, until midnight New York City time, July 14, 2009.
This is the best offer Broadcom intends to make, reflecting Broadcom's assessment of the publicly available information on Emulex and the value Broadcom anticipates to itself from an expedited transaction.
The offer represents a premium of 66 percent to Emulex's closing stock price on April 20, 2009, the day before Broadcom announced its initial offer; of 93 percent to the average closing price for the 30 trading days before Broadcom's initial offer; of approximately 149 percent to Enterprise Value on the day before Broadcom's initial offer; of 69 percent to the analysts' median 12-month price target for Emulex on the day before Broadcom's initial offer.
Broadcom recognizes that, in the absence of its offer, Emulex's share price would have continued to fluctuate in the two months since Broadcom's initial offer. Had the Emulex stock traded in line with the stock of its closest peer, QLogic Corp. (up 7.6 percent since April 20, 2009), it would be $7.11 today. Broadcom's revised offer represents a premium to this implied current share price of 55 percent.
As required by law, Broadcom will extend its tender offer for an additional 10 business days, until midnight New York City time, July 14, 2009.
This is the best offer Broadcom intends to make, reflecting Broadcom's assessment of the publicly available information on Emulex and the value Broadcom anticipates to itself from an expedited transaction.
The offer represents a premium of 66 percent to Emulex's closing stock price on April 20, 2009, the day before Broadcom announced its initial offer; of 93 percent to the average closing price for the 30 trading days before Broadcom's initial offer; of approximately 149 percent to Enterprise Value on the day before Broadcom's initial offer; of 69 percent to the analysts' median 12-month price target for Emulex on the day before Broadcom's initial offer.
Broadcom recognizes that, in the absence of its offer, Emulex's share price would have continued to fluctuate in the two months since Broadcom's initial offer. Had the Emulex stock traded in line with the stock of its closest peer, QLogic Corp. (up 7.6 percent since April 20, 2009), it would be $7.11 today. Broadcom's revised offer represents a premium to this implied current share price of 55 percent.
Wednesday, 24 June 2009
iPhone 3G S BOM and manufacturing cost $178.96
EL SEGUNDO, USA: With the new iPhone 3G S’s Bill of Materials (BOM) and feature set nearly the same as the previous model in the iPhone line, you might think the product’s component selection would be virtually unchanged. However, a dissection conducted by iSuppli Corp.’s Teardown Analysis Service reveals some interesting changes in the parts and suppliers.
“The entry-level, 16Gbyte version of Apple Inc.’s new iPhone 3G S carries a BOM cost of $172.46 and a manufacturing expense of $6.50, for a total of $178.96,” said Andrew Rassweiler, director and principal analyst, teardown services, for iSuppli.
“This is slightly higher than iSuppli’s estimate of $174.33 for the original low-end 8Gbyte iPhone 3G based on pricing in July 2008. Although the retail price of the 16Gbyte iPhone 3G S is $199, the same as for the 8Gbyte version of the original iPhone 3G, the actual price of the phone paid by the service provider is considerably higher, reflecting the common wireless industry practice of subsidizing the upfront cost of a mobile phone and then making a profit on subscriptions.”
The table presents a summary of the major component cost drivers in the iPhone 3G S.
Source: iSuppli, June 2009
The table and cost data presented in this article consist only of the iPhone 3G S’s BOM. The total does not include other costs, including software development, shipping and distribution, packaging, royalty fees and miscellaneous accessories included with each phone.
Source: iSuppli, June 2009
This year’s model
Beyond faster performance, the iPhone 3G S differentiates itself from the original 3G with the addition of video capture, an autofocus 3-Megapixel camera—compared to 2 Megapixels before—and a built-in digital compass. Besides these extras, the 3G S hardware feature set is not much different from that of the 3G.
“From a component and design perspective, there’s also a great deal of similarity between the 3G and the 3G S. By leveraging this commonality to optimize materials costs, and taking advantage of price erosion in the electronic component marketplace, Apple can provide a higher-performing product with more memory and features at only a slightly higher materials and manufacturing cost,” Rassweiler said. “Nonetheless, there are a few key differences in component selection compared to the iPhone 3G introduced a year ago.”
Broadcom and Dialog dial in to iPhone
One of the more noteworthy changes in hardware is the use of a Broadcom Corp. single-chip Bluetooth/FM/WLAN device, costing $5.95. This represents the ongoing industry trend of moving to higher levels of integration, by putting all of these functions into one chip.
Previously, to implement these functions, the 3G employed two devices: a Marvell Technology Group Ltd. WLAN chip and a Cambridge Silicon Radio (CSR) Bluetooth Integrated Circuit (IC).
Making its debut in the iPhone line is Dialog Semiconductor with its power management IC serving the 3G S’s applications processor. At an estimated cost of $1.30, the Dialog chip replaces a corresponding NXP Semiconductors device in the 3G.
STMicroelectronics and AKM find way into 3G S
To implement the digital compass feature, the iPhone 3G S adds AKM Semiconductor Inc.’s electronic compass and STMicroelectronics’ accelerometer, both of which are 3-axis devices.
The STMicroelectronics part allows the 3G S to determine device orientation or inclination, while the AKM sensor detects device movement relative to magnetic north, supporting the 3G S’s capability to reorient a map displayed on the screen to correspond with the direction the user is facing.
Infineon and TriQuint hold down the fort
Prior the 3G S introduction, speculation was rife that Qualcomm Inc. might displace Infineon Technologies AG as the supplier of the phone’s critical baseband chip. However, Infineon has held onto this critical spot with its PMB8878 baseband chip, which accounts for $13 of the 3G S component costs.
Similarly, TriQuint has kept its slot as the 3G power amplifier module supplier, supporting the tri-band HSPA functionality of the phone.
Major cost drivers
Toshiba Corp. scored the biggest single design win in the 3G S, with its 16Gbyte Multilevel-Cell (MLC) NAND flash costing $24. With the price of NAND flash having risen in recent months due to supply constraints, this represents a lucrative design win for Toshiba.
However, while Toshiba was the supplier of the NAND in the specific 3G S torn down by iSuppli, the part is available from other sources that Apple is likely to use, most notably Samsung Electronics Co. Ltd.
Samsung also maintained its position as iPhone’s applications processor supplier. Priced at $14.46, the applications processor is the fourth most costly component in the iPhone 3G S after the NAND flash, the display module and the touch-screen assembly.
The applications processor plays a key role in the 3G S’s faster performance. In the 3G, the processor used an ARM RISC microprocessor with 400MHz clock speed; the 3G S employs a 600MHz version.
“The entry-level, 16Gbyte version of Apple Inc.’s new iPhone 3G S carries a BOM cost of $172.46 and a manufacturing expense of $6.50, for a total of $178.96,” said Andrew Rassweiler, director and principal analyst, teardown services, for iSuppli.
“This is slightly higher than iSuppli’s estimate of $174.33 for the original low-end 8Gbyte iPhone 3G based on pricing in July 2008. Although the retail price of the 16Gbyte iPhone 3G S is $199, the same as for the 8Gbyte version of the original iPhone 3G, the actual price of the phone paid by the service provider is considerably higher, reflecting the common wireless industry practice of subsidizing the upfront cost of a mobile phone and then making a profit on subscriptions.”
The table presents a summary of the major component cost drivers in the iPhone 3G S.
Source: iSuppli, June 2009The table and cost data presented in this article consist only of the iPhone 3G S’s BOM. The total does not include other costs, including software development, shipping and distribution, packaging, royalty fees and miscellaneous accessories included with each phone.
Source: iSuppli, June 2009This year’s model
Beyond faster performance, the iPhone 3G S differentiates itself from the original 3G with the addition of video capture, an autofocus 3-Megapixel camera—compared to 2 Megapixels before—and a built-in digital compass. Besides these extras, the 3G S hardware feature set is not much different from that of the 3G.
“From a component and design perspective, there’s also a great deal of similarity between the 3G and the 3G S. By leveraging this commonality to optimize materials costs, and taking advantage of price erosion in the electronic component marketplace, Apple can provide a higher-performing product with more memory and features at only a slightly higher materials and manufacturing cost,” Rassweiler said. “Nonetheless, there are a few key differences in component selection compared to the iPhone 3G introduced a year ago.”
Broadcom and Dialog dial in to iPhone
One of the more noteworthy changes in hardware is the use of a Broadcom Corp. single-chip Bluetooth/FM/WLAN device, costing $5.95. This represents the ongoing industry trend of moving to higher levels of integration, by putting all of these functions into one chip.
Previously, to implement these functions, the 3G employed two devices: a Marvell Technology Group Ltd. WLAN chip and a Cambridge Silicon Radio (CSR) Bluetooth Integrated Circuit (IC).
Making its debut in the iPhone line is Dialog Semiconductor with its power management IC serving the 3G S’s applications processor. At an estimated cost of $1.30, the Dialog chip replaces a corresponding NXP Semiconductors device in the 3G.
STMicroelectronics and AKM find way into 3G S
To implement the digital compass feature, the iPhone 3G S adds AKM Semiconductor Inc.’s electronic compass and STMicroelectronics’ accelerometer, both of which are 3-axis devices.
The STMicroelectronics part allows the 3G S to determine device orientation or inclination, while the AKM sensor detects device movement relative to magnetic north, supporting the 3G S’s capability to reorient a map displayed on the screen to correspond with the direction the user is facing.
Infineon and TriQuint hold down the fort
Prior the 3G S introduction, speculation was rife that Qualcomm Inc. might displace Infineon Technologies AG as the supplier of the phone’s critical baseband chip. However, Infineon has held onto this critical spot with its PMB8878 baseband chip, which accounts for $13 of the 3G S component costs.
Similarly, TriQuint has kept its slot as the 3G power amplifier module supplier, supporting the tri-band HSPA functionality of the phone.
Major cost drivers
Toshiba Corp. scored the biggest single design win in the 3G S, with its 16Gbyte Multilevel-Cell (MLC) NAND flash costing $24. With the price of NAND flash having risen in recent months due to supply constraints, this represents a lucrative design win for Toshiba.
However, while Toshiba was the supplier of the NAND in the specific 3G S torn down by iSuppli, the part is available from other sources that Apple is likely to use, most notably Samsung Electronics Co. Ltd.
Samsung also maintained its position as iPhone’s applications processor supplier. Priced at $14.46, the applications processor is the fourth most costly component in the iPhone 3G S after the NAND flash, the display module and the touch-screen assembly.
The applications processor plays a key role in the 3G S’s faster performance. In the 3G, the processor used an ARM RISC microprocessor with 400MHz clock speed; the 3G S employs a 600MHz version.
Sunday, 21 June 2009
Broadcom to intro GPON IAD semiconductors in China
IRVINE, USA: Broadcom Corp. will introduce a new family of Gigabit passive optical network (GPON) integrated access device (IAD) semiconductors to telecommunications providers and original equipment manufacturers (OEMs) in China this year.
The Broadcom BCM6800 family of GPON gateway processors are designed to enable more cost effective optical network terminals (ONTs) or optical network units (ONUs) used in conjunction with service provider networks.
As a result, service providers that deploy Broadcom's BCM6800 family of gateway processors will leverage increased bandwidth for such offerings as high quality triple play services, high definition (HD) video, gaming, wireless and voice over IP (VoIP) supporting Fiber-to-the-Home (FTTH) and Fiber-to-the-Node (FTTN) applications.
With unparalleled levels of integration and increased throughput performance, Broadcom's GPON products will offer Chinese telecommunications carriers high performance and feature-rich passive optical network (PON) capabilities that are built on years of Broadcom's experience in the Chinese broadband access market.
The GPON specification is based on the International Telecommunications Union (ITU) G.984 GPON recommendation that offers Chinese carriers a global standard for PON deployments, with economies of scale built on interoperability and driven by deployments around the world.
GPON further offers network timing that is compatible with existing TDM voice networks in carrier infrastructures that allows carriers to transition existing TDM traffic to a more cost effective network, resulting in a greater revenue return on legacy services with corresponding declines in operating costs.
"Broadcom is pleased to provide our Chinese customers with a reliable and cost effective, stable, long term source of GPON silicon," said Greg Fischer, Vice President & General Manager of Broadcom's Carrier Access line of business. "Our presence and commitment to the carrier market in China is well established with leadership in DSL, Ethernet and wireless LAN products. The global GPON standard provides next generation FTTH and FTTN opportunities for China and we look forward to extending our leading access technologies and investments in this area."
The Broadcom BCM6800 family of GPON solutions are comprised of Fiber-to-the-X (FTTX) products spanning Gigabit bridges through full IAD capabilities. When used with Broadcom's leading ADSL2+, VDSL2 and Gigabit Ethernet products, they comprise a complete FTTN or Fiber-to-the-Building (FTTB) portfolio for remote nodes and multi-dwelling units.
Broadcom will begin production of these GPON devices later this year and is actively supporting customer designs immediately.
The Broadcom BCM6800 family of GPON gateway processors are designed to enable more cost effective optical network terminals (ONTs) or optical network units (ONUs) used in conjunction with service provider networks.
As a result, service providers that deploy Broadcom's BCM6800 family of gateway processors will leverage increased bandwidth for such offerings as high quality triple play services, high definition (HD) video, gaming, wireless and voice over IP (VoIP) supporting Fiber-to-the-Home (FTTH) and Fiber-to-the-Node (FTTN) applications.
With unparalleled levels of integration and increased throughput performance, Broadcom's GPON products will offer Chinese telecommunications carriers high performance and feature-rich passive optical network (PON) capabilities that are built on years of Broadcom's experience in the Chinese broadband access market.
The GPON specification is based on the International Telecommunications Union (ITU) G.984 GPON recommendation that offers Chinese carriers a global standard for PON deployments, with economies of scale built on interoperability and driven by deployments around the world.
GPON further offers network timing that is compatible with existing TDM voice networks in carrier infrastructures that allows carriers to transition existing TDM traffic to a more cost effective network, resulting in a greater revenue return on legacy services with corresponding declines in operating costs.
"Broadcom is pleased to provide our Chinese customers with a reliable and cost effective, stable, long term source of GPON silicon," said Greg Fischer, Vice President & General Manager of Broadcom's Carrier Access line of business. "Our presence and commitment to the carrier market in China is well established with leadership in DSL, Ethernet and wireless LAN products. The global GPON standard provides next generation FTTH and FTTN opportunities for China and we look forward to extending our leading access technologies and investments in this area."
The Broadcom BCM6800 family of GPON solutions are comprised of Fiber-to-the-X (FTTX) products spanning Gigabit bridges through full IAD capabilities. When used with Broadcom's leading ADSL2+, VDSL2 and Gigabit Ethernet products, they comprise a complete FTTN or Fiber-to-the-Building (FTTB) portfolio for remote nodes and multi-dwelling units.
Broadcom will begin production of these GPON devices later this year and is actively supporting customer designs immediately.
Friday, 5 June 2009
Emulex comments on Broadcom's self-serving and misleading statements
COSTA MESA, USA: Emulex Corp. President and Chief Executive Officer, Jim McCluney, today commented on statements and presentation materials issued yesterday by Broadcom Corp.
"Broadcom's nearly 50 pages of documents issued yesterday are littered with misleading statements and mischaracterizations meant to distract Emulex stockholders from the core issues of value and leverage. We urge stockholders to see through Broadcom's rhetoric and concentrate on what we believe are the facts -- Broadcom's tender offer is inadequate and their related consent solicitation aims to capture leverage over Emulex stockholders by ultimately seeking to replace Emulex's Board with hand-picked Broadcom nominees who we believe, if elected, will pursue Broadcom's self serving agenda of acquiring Emulex on-the-cheap to the detriment of Emulex's stockholders. Giving Broadcom a consent is giving them leverage with no benefit to stockholders. Why call a special meeting to facilitate a grossly inadequate offer?"
"The key issue for stockholders to consider is that Emulex is well positioned for significant and rapid growth through our leadership in the converged networking market. We are securing design wins, in many cases against Broadcom, which is threatening their current and future Ethernet business. We believe Broadcom has now made it clear that they recognize this problem. In our view, Broadcom is simply attempting to mitigate the damage to its business and capture the significant future value that rightly belongs to all Emulex stockholders.
"In fact, at a June 3 analyst conference, Broadcom's CEO Scott McGregor admitted what Emulex has said all along, that Broadcom simply cannot compete effectively in converged networking without making an acquisition. More importantly, McGregor said that Broadcom recognizes that its 'best option' is to buy Emulex, underscoring Emulex's significant future prospects and value creation opportunities through our current strategy. We note that this acknowledgement is a marked change from the misleading statements Broadcom used initially upon launching their offer to suggest that they could just as easily build their way into converged networking."
"At the June 3 conference, McGregor stated that Broadcom's only alternatives outside an acquisition of an established Fibre Channel market participant are either to do nothing, or organically build a Fibre Channel offering and then try to harden it if an OEM agrees to use it. However, McGregor admitted that doing nothing could result in significant lost opportunity across 'five' to 'ten years' and building something would at minimum require 'dilutive' spending on R&D over a number of years. Even if the R&D effort was successful in creating an offering, we believe Broadcom would be too late to the market to compete effectively against an established incumbent with strong OEM relationships and a third or fourth generation offering."
"The materials filed yesterday by Broadcom continue their pattern of making misleading statements. As an example, Broadcom continues to talk about what they believe is an 'attractive' implied premium of their offer despite knowing well that (a) Emulex's stock price at the time of their offer did not reflect the long-term significant value of the Company's numerous new yet undisclosed to the public design wins and strong positioning in the converged networking market, and (b) given considerable recent recovery in the broader markets and in the valuations of our comparables, Emulex would likely be currently trading at a much higher valuation on fundamentals than when Broadcom first made their offer on April 21.
"We believe our stockholders clearly recognize that Broadcom's hostile takeover attempt is opportunistic and unacceptable, as evidenced by the meager less than three percent of outstanding shares tendered into the offer to-date."
"The Board is focused on delivering value and will continue to take actions it believes are in the best interests of stockholders. We continue to strongly urge our stockholders to NOT TENDER into the grossly inadequate offer and to NOT CONSENT to the bylaw amendments that will decrease Emulex's leverage. We appreciate our stockholders' support and look forward to continuing our dialogue with them regarding Broadcom's statements and what we believe are the true facts."
To reject Broadcom's tender offer, Emulex stockholders do NOT need to take any action. Similarly, to reject Broadcom's consent solicitation, stockholders do NOT need to take any action on Broadcom's GOLD consent card. Instead, Emulex stockholders should sign and return Emulex's WHITE consent revocation card when available, which will enable the Company to keep informed of stockholder sentiment.
"Broadcom's nearly 50 pages of documents issued yesterday are littered with misleading statements and mischaracterizations meant to distract Emulex stockholders from the core issues of value and leverage. We urge stockholders to see through Broadcom's rhetoric and concentrate on what we believe are the facts -- Broadcom's tender offer is inadequate and their related consent solicitation aims to capture leverage over Emulex stockholders by ultimately seeking to replace Emulex's Board with hand-picked Broadcom nominees who we believe, if elected, will pursue Broadcom's self serving agenda of acquiring Emulex on-the-cheap to the detriment of Emulex's stockholders. Giving Broadcom a consent is giving them leverage with no benefit to stockholders. Why call a special meeting to facilitate a grossly inadequate offer?"
"The key issue for stockholders to consider is that Emulex is well positioned for significant and rapid growth through our leadership in the converged networking market. We are securing design wins, in many cases against Broadcom, which is threatening their current and future Ethernet business. We believe Broadcom has now made it clear that they recognize this problem. In our view, Broadcom is simply attempting to mitigate the damage to its business and capture the significant future value that rightly belongs to all Emulex stockholders.
"In fact, at a June 3 analyst conference, Broadcom's CEO Scott McGregor admitted what Emulex has said all along, that Broadcom simply cannot compete effectively in converged networking without making an acquisition. More importantly, McGregor said that Broadcom recognizes that its 'best option' is to buy Emulex, underscoring Emulex's significant future prospects and value creation opportunities through our current strategy. We note that this acknowledgement is a marked change from the misleading statements Broadcom used initially upon launching their offer to suggest that they could just as easily build their way into converged networking."
"At the June 3 conference, McGregor stated that Broadcom's only alternatives outside an acquisition of an established Fibre Channel market participant are either to do nothing, or organically build a Fibre Channel offering and then try to harden it if an OEM agrees to use it. However, McGregor admitted that doing nothing could result in significant lost opportunity across 'five' to 'ten years' and building something would at minimum require 'dilutive' spending on R&D over a number of years. Even if the R&D effort was successful in creating an offering, we believe Broadcom would be too late to the market to compete effectively against an established incumbent with strong OEM relationships and a third or fourth generation offering."
"The materials filed yesterday by Broadcom continue their pattern of making misleading statements. As an example, Broadcom continues to talk about what they believe is an 'attractive' implied premium of their offer despite knowing well that (a) Emulex's stock price at the time of their offer did not reflect the long-term significant value of the Company's numerous new yet undisclosed to the public design wins and strong positioning in the converged networking market, and (b) given considerable recent recovery in the broader markets and in the valuations of our comparables, Emulex would likely be currently trading at a much higher valuation on fundamentals than when Broadcom first made their offer on April 21.
"We believe our stockholders clearly recognize that Broadcom's hostile takeover attempt is opportunistic and unacceptable, as evidenced by the meager less than three percent of outstanding shares tendered into the offer to-date."
"The Board is focused on delivering value and will continue to take actions it believes are in the best interests of stockholders. We continue to strongly urge our stockholders to NOT TENDER into the grossly inadequate offer and to NOT CONSENT to the bylaw amendments that will decrease Emulex's leverage. We appreciate our stockholders' support and look forward to continuing our dialogue with them regarding Broadcom's statements and what we believe are the true facts."
To reject Broadcom's tender offer, Emulex stockholders do NOT need to take any action. Similarly, to reject Broadcom's consent solicitation, stockholders do NOT need to take any action on Broadcom's GOLD consent card. Instead, Emulex stockholders should sign and return Emulex's WHITE consent revocation card when available, which will enable the Company to keep informed of stockholder sentiment.
Thursday, 4 June 2009
Expiration date for Emulex offer extended to June 17, 2009
IRVINE, USA: Broadcom Corp. announced that Fiji Acquisition Corp. has extended its tender offer for all of the currently outstanding shares of common stock (including the associated preferred stock purchase rights) of Emulex Corp. to 11:59 pm, New York City time, on June 17, 2009, unless further extended. The tender offer was previously set to expire at 12:00 midnight, New York City time, on June 3, 2009.
"We believe our all-cash offer of $9.25 net per share reflects a full and fair price for Emulex common stock. It represents a 40 percent premium to the closing price of Emulex common stock on April 20, 2009, the day before Broadcom made public its offer, and a 62 percent premium to the average price of Emulex for the 30 trading days ending on April 20, 2009," said Scott A. McGregor, President and Chief Executive Officer of Broadcom.
As of 6:00 pm, New York City time, on Wednesday, June 3, 2009, approximately 2,267,882 shares of Emulex had been tendered in and not withdrawn from the tender offer.
The complete terms and conditions of the tender offer are set forth in the Offer to Purchase and related Letter of Transmittal, copies of which are available by contacting the Information Agent for the tender offer, Innisfree M&A Inc.
"We believe our all-cash offer of $9.25 net per share reflects a full and fair price for Emulex common stock. It represents a 40 percent premium to the closing price of Emulex common stock on April 20, 2009, the day before Broadcom made public its offer, and a 62 percent premium to the average price of Emulex for the 30 trading days ending on April 20, 2009," said Scott A. McGregor, President and Chief Executive Officer of Broadcom.
As of 6:00 pm, New York City time, on Wednesday, June 3, 2009, approximately 2,267,882 shares of Emulex had been tendered in and not withdrawn from the tender offer.
The complete terms and conditions of the tender offer are set forth in the Offer to Purchase and related Letter of Transmittal, copies of which are available by contacting the Information Agent for the tender offer, Innisfree M&A Inc.
Friday, 29 May 2009
GSA appoints Neil Kim as new director
SAN JOSE, USA: Global Semiconductor Alliance (GSA), the platform for global collaboration, announces its most recent addition to the board of directors, Neil Kim, Senior Vice President of Operations and Central Engineering at Broadcom Corporation.
At Broadcom, Kim is responsible for all global manufacturing activities, including foundry operation, packaging and test engineering as well as setting the process technology direction. Additionally, he is responsible for engineering activities that include the development of analog mixed-signal and radio frequency (RF) products and building Broadcom's library of core technologies.
He joined Broadcom as director of engineering in January 2000 and became vice president of central engineering in October 2001.
Prior to joining Broadcom, Kim held a series of progressively senior technical and management positions at Western Digital Corporation, where his last position was vice president of engineering. He received a B.S.E.E. from the University of California, Berkeley.
In his position at Broadcom, Kim manages the company’s vital relationships with its foundries and assembly and test suppliers.
Moreover, his extensive knowledge in analog mixed-signal and RF products brings value to GSA by enabling a better understanding of the complexity involved in managing the analog mixed-signal and RF product deliverables. His addition to the GSA board of directors will enhance its diversity and improve the Alliance’s ability to service the global supply-chain.
“I appreciate this appointment by the board and look forward to working with my peers, partners and competitors to bring about a more efficient ecosystem so that we all benefit. GSA is an exceptional organization in that it identifies challenges and opportunities and achieves maximum value for the industry,” stated Neil Kim.
Broadcom, a GSA member since 1998, is a major technology innovator and global leader in semiconductors for wired and wireless communications. Broadcom products enable the delivery of voice, video, data and multimedia to and throughout the home, the office and the mobile environment. “Broadcom has been a great supporter of GSA over the life of the Alliance. They have established themselves as a role and success model for the semiconductor community. We are pleased that Neil Kim will represent them on our board of directors,” said Jodi Shelton, president of GSA.
“Neil’s broad knowledge and experience provides an additional perspective of managing a multifaceted supply chain and understanding the challenges that companies face. This will further develop our ability to facilitate and drive solutions to the industry. It is our ambition to learn and grow from experts like Kim. His contribution will be of great benefit to GSA’s continued success,” Shelton further commented.
The GSA board of directors is comprised of 25 industry executives representing all sectors of the semiconductor industry and includes all geographies and representatives from critical supply partners.
At Broadcom, Kim is responsible for all global manufacturing activities, including foundry operation, packaging and test engineering as well as setting the process technology direction. Additionally, he is responsible for engineering activities that include the development of analog mixed-signal and radio frequency (RF) products and building Broadcom's library of core technologies.
He joined Broadcom as director of engineering in January 2000 and became vice president of central engineering in October 2001.
Prior to joining Broadcom, Kim held a series of progressively senior technical and management positions at Western Digital Corporation, where his last position was vice president of engineering. He received a B.S.E.E. from the University of California, Berkeley.
In his position at Broadcom, Kim manages the company’s vital relationships with its foundries and assembly and test suppliers.
Moreover, his extensive knowledge in analog mixed-signal and RF products brings value to GSA by enabling a better understanding of the complexity involved in managing the analog mixed-signal and RF product deliverables. His addition to the GSA board of directors will enhance its diversity and improve the Alliance’s ability to service the global supply-chain.
“I appreciate this appointment by the board and look forward to working with my peers, partners and competitors to bring about a more efficient ecosystem so that we all benefit. GSA is an exceptional organization in that it identifies challenges and opportunities and achieves maximum value for the industry,” stated Neil Kim.
Broadcom, a GSA member since 1998, is a major technology innovator and global leader in semiconductors for wired and wireless communications. Broadcom products enable the delivery of voice, video, data and multimedia to and throughout the home, the office and the mobile environment. “Broadcom has been a great supporter of GSA over the life of the Alliance. They have established themselves as a role and success model for the semiconductor community. We are pleased that Neil Kim will represent them on our board of directors,” said Jodi Shelton, president of GSA.
“Neil’s broad knowledge and experience provides an additional perspective of managing a multifaceted supply chain and understanding the challenges that companies face. This will further develop our ability to facilitate and drive solutions to the industry. It is our ambition to learn and grow from experts like Kim. His contribution will be of great benefit to GSA’s continued success,” Shelton further commented.
The GSA board of directors is comprised of 25 industry executives representing all sectors of the semiconductor industry and includes all geographies and representatives from critical supply partners.
Tuesday, 5 May 2009
Broadcom commences all cash tender offer to purchase Emulex shares
IRVINE, USA: Broadcom Corp. today announced that its wholly owned subsidiary, Fiji Acquisition Corporation, has commenced a tender offer for all the outstanding shares of common stock of Emulex Corp. In addition, Broadcom announced the filing of a preliminary consent solicitation statement to amend Emulex's Bylaws to allow stockholders to call a special meeting of stockholders.
Under the terms of the offer, Emulex stockholders would receive $9.25 net per share in cash (less any applicable withholding taxes and without interest). This represents a total equity value of approximately $764 million. The offer is:
* A 62-percent premium to Emulex's average closing stock price for the 30 trading days immediately prior to Broadcom's public offer to acquire Emulex announced on April 21, 2009;
* A 42-percent premium over the median 12-month stock price target published by research analysts as of April 20, 2009;
* A 40-percent premium over the closing price of Emulex common stock on April 20, 2009; and
* An approximately 85-percent premium over Emulex's enterprise value as of the closing price of Emulex common stock on April 20, 2009.
Unless extended, the tender offer is scheduled to expire at midnight, Eastern time, on Wednesday, June 3, 2009.
Scott A. McGregor, President and CEO of Broadcom, said: "We are disappointed by Emulex Corporation's rejection of Broadcom's proposal which would deliver substantial, immediate and highly certain value to Emulex's stockholders, while further providing significant benefits to customers and employees alike. The Emulex Board's response on Monday and its continued unwillingness to engage in discussions with Broadcom are clearly not in the best interests of either its stockholders or its customers. This intransigence could cause needless delay in efforts to combine our two companies, leading to further deterioration of Emulex's market share and stockholder value."
"Emulex's Board has taken steps, including the adoption of a 'poison pill' and the imposition of bylaw amendments, to erect barriers to stockholders' ability to express their will as owners of Emulex," continued McGregor. "While we much prefer to arrive at a negotiated agreement with Emulex, the Emulex Board has left us with no choice but to ask Emulex stockholders to call for a special meeting of stockholders so that they can consider the merits of our offer for themselves."
Broadcom said that while Emulex has touted its "design wins" in its response to Broadcom and in other communications with the financial community, it has failed to demonstrate an ability to convert design wins into either revenue growth or market share. Over the last several years, including this most recent quarter, Emulex has continued to lose share to its larger competitor.
In fact, in its most recent quarter, Emulex's revenue fell short of analysts' consensus expectations, and the midpoint of Emulex's revenue guidance for the June 2009 quarter implies that Emulex is likely to deliver its 6th quarter of sequential revenue decline. In addition, Emulex's primary competitor said last week that it continued to gain share in key markets during the most recent quarter, after achieving record net revenues in 2008.
Broadcom also noted that while Emulex contends long-term value creation opportunities might exist on a standalone basis, recently revised analyst models exhibit less optimism regarding its future prospects --- consensus analyst estimates for Emulex's revenues in calendar year 2009 and 2010 were lowered following Emulex's April 27 earnings release and guidance update, suggesting that Emulex's future standalone opportunities amid increased competition remain highly uncertain.
"Emulex has made it clear that it shares our view that the convergence of data and storage networking is the long-term future of enterprise networks. This combination would enable us to accelerate our efforts to bring this vision to our customers. We believe the logic of this combination is equally compelling for the employees of both companies. In particular Emulex's highly skilled employees would have greater opportunities to enhance their careers as a result of access to Broadcom's Ethernet portfolio, our intellectual property and tools and the enhanced sales, service and manufacturing support our greater scale makes possible," McGregor said.
Broadcom's all-cash offer is not subject to a financing condition. Broadcom intends to fund the offer with its existing cash holdings. The offer is subject to certain conditions described in the tender offer statement filed with the U.S. Securities and Exchange Commission, a copy of which will be mailed to Emulex's stockholders.
Broadcom also today filed a preliminary consent solicitation statement with the U.S. Securities and Exchange Commission. It solicits stockholders' consent for certain amendments to Emulex's Bylaws (including allowing Emulex stockholders holding 10% or more of the shares outstanding of Emulex to call a special meeting of stockholders), consent for appointment of representatives of Broadcom as stockholders' agents for purposes of calling a special meeting of the stockholders of Emulex and consent for repealing any amendments of Emulex's Bylaws adopted by its Board of Directors on or after January 15, 2009.
Under the terms of the offer, Emulex stockholders would receive $9.25 net per share in cash (less any applicable withholding taxes and without interest). This represents a total equity value of approximately $764 million. The offer is:
* A 62-percent premium to Emulex's average closing stock price for the 30 trading days immediately prior to Broadcom's public offer to acquire Emulex announced on April 21, 2009;
* A 42-percent premium over the median 12-month stock price target published by research analysts as of April 20, 2009;
* A 40-percent premium over the closing price of Emulex common stock on April 20, 2009; and
* An approximately 85-percent premium over Emulex's enterprise value as of the closing price of Emulex common stock on April 20, 2009.
Unless extended, the tender offer is scheduled to expire at midnight, Eastern time, on Wednesday, June 3, 2009.
Scott A. McGregor, President and CEO of Broadcom, said: "We are disappointed by Emulex Corporation's rejection of Broadcom's proposal which would deliver substantial, immediate and highly certain value to Emulex's stockholders, while further providing significant benefits to customers and employees alike. The Emulex Board's response on Monday and its continued unwillingness to engage in discussions with Broadcom are clearly not in the best interests of either its stockholders or its customers. This intransigence could cause needless delay in efforts to combine our two companies, leading to further deterioration of Emulex's market share and stockholder value."
"Emulex's Board has taken steps, including the adoption of a 'poison pill' and the imposition of bylaw amendments, to erect barriers to stockholders' ability to express their will as owners of Emulex," continued McGregor. "While we much prefer to arrive at a negotiated agreement with Emulex, the Emulex Board has left us with no choice but to ask Emulex stockholders to call for a special meeting of stockholders so that they can consider the merits of our offer for themselves."
Broadcom said that while Emulex has touted its "design wins" in its response to Broadcom and in other communications with the financial community, it has failed to demonstrate an ability to convert design wins into either revenue growth or market share. Over the last several years, including this most recent quarter, Emulex has continued to lose share to its larger competitor.
In fact, in its most recent quarter, Emulex's revenue fell short of analysts' consensus expectations, and the midpoint of Emulex's revenue guidance for the June 2009 quarter implies that Emulex is likely to deliver its 6th quarter of sequential revenue decline. In addition, Emulex's primary competitor said last week that it continued to gain share in key markets during the most recent quarter, after achieving record net revenues in 2008.
Broadcom also noted that while Emulex contends long-term value creation opportunities might exist on a standalone basis, recently revised analyst models exhibit less optimism regarding its future prospects --- consensus analyst estimates for Emulex's revenues in calendar year 2009 and 2010 were lowered following Emulex's April 27 earnings release and guidance update, suggesting that Emulex's future standalone opportunities amid increased competition remain highly uncertain.
"Emulex has made it clear that it shares our view that the convergence of data and storage networking is the long-term future of enterprise networks. This combination would enable us to accelerate our efforts to bring this vision to our customers. We believe the logic of this combination is equally compelling for the employees of both companies. In particular Emulex's highly skilled employees would have greater opportunities to enhance their careers as a result of access to Broadcom's Ethernet portfolio, our intellectual property and tools and the enhanced sales, service and manufacturing support our greater scale makes possible," McGregor said.
Broadcom's all-cash offer is not subject to a financing condition. Broadcom intends to fund the offer with its existing cash holdings. The offer is subject to certain conditions described in the tender offer statement filed with the U.S. Securities and Exchange Commission, a copy of which will be mailed to Emulex's stockholders.
Broadcom also today filed a preliminary consent solicitation statement with the U.S. Securities and Exchange Commission. It solicits stockholders' consent for certain amendments to Emulex's Bylaws (including allowing Emulex stockholders holding 10% or more of the shares outstanding of Emulex to call a special meeting of stockholders), consent for appointment of representatives of Broadcom as stockholders' agents for purposes of calling a special meeting of the stockholders of Emulex and consent for repealing any amendments of Emulex's Bylaws adopted by its Board of Directors on or after January 15, 2009.
Emulex board unanimously rejects Broadcom's proposal
COSTA MESA, USA: Emulex Corp. announced that its Board of Directors, with the assistance of its financial and legal advisors, has completed its evaluation of the unsolicited, non-binding proposal received on April 21, 2009 from Broadcom Corp. to acquire Emulex for $9.25 per share in cash and has unanimously determined that the Broadcom proposal significantly undervalues Emulex and is not in the best interest of Emulex stockholders.
Paul F. Folino, Executive Chairman of the Board of Emulex, said: "After a thorough review of the proposal in consultation with our advisors, the Board unanimously concluded that it is an opportunistic attempt by Broadcom to capture substantial current and long-term value that properly belongs to Emulex stockholders. The Board is very enthusiastic about Emulex's future prospects and the long-term value we expect to deliver through the Company's current strategy."
Jim McCluney, President and Chief Executive Officer of Emulex, added: "In addition to our leadership position in the host server and embedded storage markets, Emulex is also quickly becoming the premier provider of converged networking for the enterprise. As Broadcom is uniquely aware, Emulex has recently won tier-one original equipment manufacturer (OEM) contracts at the expense of Broadcom and our other competitors, and as such, we are well positioned to gain share in this rapidly growing segment. We look forward to continuing to execute on our strategy to create significant value for stockholders and customers over the long-term."
In a letter to Broadcom, the Emulex Board of Directors stated that Broadcom's unsolicited proposal is not in the best interests of Emulex stockholders because it:
* Significantly undervalues Emulex's long-term prospects, particularly with respect to our opportunities in network convergence, which are more than doubling Emulex's addressable market;
* Is opportunistic given Broadcom is aware of significant new unannounced design wins that Emulex has secured with tier-one OEMs, at the expense of Broadcom and other competitors, and their potential long-term value creation for Emulex and its stockholders;
* Is clearly timed to take advantage of Emulex's depressed stock price during the current unprecedented macroeconomic conditions. Emulex's stock price has traded well above the proposal price within the last 12 months.
Paul F. Folino, Executive Chairman of the Board of Emulex, said: "After a thorough review of the proposal in consultation with our advisors, the Board unanimously concluded that it is an opportunistic attempt by Broadcom to capture substantial current and long-term value that properly belongs to Emulex stockholders. The Board is very enthusiastic about Emulex's future prospects and the long-term value we expect to deliver through the Company's current strategy."
Jim McCluney, President and Chief Executive Officer of Emulex, added: "In addition to our leadership position in the host server and embedded storage markets, Emulex is also quickly becoming the premier provider of converged networking for the enterprise. As Broadcom is uniquely aware, Emulex has recently won tier-one original equipment manufacturer (OEM) contracts at the expense of Broadcom and our other competitors, and as such, we are well positioned to gain share in this rapidly growing segment. We look forward to continuing to execute on our strategy to create significant value for stockholders and customers over the long-term."
In a letter to Broadcom, the Emulex Board of Directors stated that Broadcom's unsolicited proposal is not in the best interests of Emulex stockholders because it:
* Significantly undervalues Emulex's long-term prospects, particularly with respect to our opportunities in network convergence, which are more than doubling Emulex's addressable market;
* Is opportunistic given Broadcom is aware of significant new unannounced design wins that Emulex has secured with tier-one OEMs, at the expense of Broadcom and other competitors, and their potential long-term value creation for Emulex and its stockholders;
* Is clearly timed to take advantage of Emulex's depressed stock price during the current unprecedented macroeconomic conditions. Emulex's stock price has traded well above the proposal price within the last 12 months.
Monday, 27 April 2009
Qualcomm to pay $891 million to Broadcom
USA: Qualcomm Inc. and Broadcom Corp. have entered into a settlement and multi-year patent agreement. The agreement will result in the dismissal with prejudice of all litigation between the companies, including all patent infringement claims in the International Trade Commission and US District Court in Santa Ana, as well as the withdrawal by Broadcom of its complaints to the European Commission and the Korea Fair Trade Commission.
Under the agreement, the companies have granted certain rights to each other under their respective patent portfolios. Qualcomm will pay Broadcom $891 million over a four-year period. The terms of this agreement will not result in any change to Qualcomm's 3G (e.g., CDMA2000, WCDMA and TD-SCDMA) and 4G (e.g., LTE and WiMAX) licensing revenue model.
The terms of the agreement include, among other elements:
* Broadcom and Qualcomm agree not to assert patents against each other for their respective integrated circuit products and certain other products and services;
* Broadcom agrees not to assert its patents against Qualcomm's customers for Qualcomm's integrated circuit products incorporated into cellular products;
* Qualcomm's customers do not receive rights to any of Broadcom's patents with respect to Qualcomm integrated circuit products incorporated into non-cellular products and equipment;
* Qualcomm agrees not to assert its patents against Broadcom's customers for Broadcom's integrated circuit products incorporated in non-cellular products;
* Broadcom customers do not receive rights to any of Qualcomm's patents with respect to Broadcom integrated circuit products incorporated into cellular products and equipment;
Qualcomm will pay Broadcom $891 million in cash over a period of four years, of which $200 million will be paid in the quarter ending June 30, 2009. The agreement does not provide for any other scheduled payments between the parties.
Other terms of the agreement are confidential.
"We believe that this resolution is positive for both Qualcomm and Broadcom, our customers, our partners and the overall industry," said Dr. Paul E. Jacobs, chairman and CEO of Qualcomm, and Scott A. McGregor, president and CEO of Broadcom.
"The settlement will allow us to direct our full attention and resources to continuing to innovate, improving our competitive position in this economic downturn, and growing demand for wireless products and services," Jacobs said. "I am pleased that we have achieved this important settlement. At a time when the wireless industry should be focused on moving forward, the agreement removes uncertainty for Qualcomm and its customers."
"Today's settlement allows both companies to move on with their business and compete in the semiconductor sector as two of its innovation leaders," McGregor said. "We have set aside our differences while addressing the needs of our customers, our shareholders and the industry. In addition, the companies have worked together to achieve their mutual goals of improving the competitive dynamics of the industry."
Under the agreement, the companies have granted certain rights to each other under their respective patent portfolios. Qualcomm will pay Broadcom $891 million over a four-year period. The terms of this agreement will not result in any change to Qualcomm's 3G (e.g., CDMA2000, WCDMA and TD-SCDMA) and 4G (e.g., LTE and WiMAX) licensing revenue model.
The terms of the agreement include, among other elements:
* Broadcom and Qualcomm agree not to assert patents against each other for their respective integrated circuit products and certain other products and services;
* Broadcom agrees not to assert its patents against Qualcomm's customers for Qualcomm's integrated circuit products incorporated into cellular products;
* Qualcomm's customers do not receive rights to any of Broadcom's patents with respect to Qualcomm integrated circuit products incorporated into non-cellular products and equipment;
* Qualcomm agrees not to assert its patents against Broadcom's customers for Broadcom's integrated circuit products incorporated in non-cellular products;
* Broadcom customers do not receive rights to any of Qualcomm's patents with respect to Broadcom integrated circuit products incorporated into cellular products and equipment;
Qualcomm will pay Broadcom $891 million in cash over a period of four years, of which $200 million will be paid in the quarter ending June 30, 2009. The agreement does not provide for any other scheduled payments between the parties.
Other terms of the agreement are confidential.
"We believe that this resolution is positive for both Qualcomm and Broadcom, our customers, our partners and the overall industry," said Dr. Paul E. Jacobs, chairman and CEO of Qualcomm, and Scott A. McGregor, president and CEO of Broadcom.
"The settlement will allow us to direct our full attention and resources to continuing to innovate, improving our competitive position in this economic downturn, and growing demand for wireless products and services," Jacobs said. "I am pleased that we have achieved this important settlement. At a time when the wireless industry should be focused on moving forward, the agreement removes uncertainty for Qualcomm and its customers."
"Today's settlement allows both companies to move on with their business and compete in the semiconductor sector as two of its innovation leaders," McGregor said. "We have set aside our differences while addressing the needs of our customers, our shareholders and the industry. In addition, the companies have worked together to achieve their mutual goals of improving the competitive dynamics of the industry."
Sunday, 26 April 2009
Broadcom's combo chip and software achieve Bluetooth qualification
IRVINE, USA: Broadcom Corp. recently announced that its leading Bluetooth combo chip technology and associated BTE software have been qualified as compliant with the ratified Bluetooth v3.0 + HS (high speed) specification.
The new standard significantly expands the capabilities of Bluetooth wireless technology in multimedia smartphones, netbooks and other devices by enabling the transmission of large files via Bluetooth profiles at speeds up to 24 Megabits per second (Mbps), or a 10 times increase in speed over the previous Bluetooth v2.1 + EDR (enhanced data rate) standard. With the company's InConcert(R) BCM4325 Bluetooth + Wi-Fi(R) + FM combo chip solution (the first product in the industry to achieve qualification) and Bluetooth software, Broadcom is uniquely positioned to support the latest Bluetooth specification with proven single-chip solutions.
While competing implementations require multiple discrete components that raise cost and power requirements, Broadcom is able to provide a single-chip solution that includes both a qualified Bluetooth v3.0 BR/EDR (basic rate) controller and Wi-Fi CERTIFIED(TM) media access controller (MAC)/physical layer (PHY) device.
When combined with Broadcom's v3.0 + HS qualified host software solution, these products enable OEMs to add the convenience of high speed Bluetooth data transfer while reducing board space, power consumption and overall system cost in next generation Bluetooth-enabled devices.
Broadcom's high speed Bluetooth technology was recently demonstrated at the 2009 International Consumer Electronics Show (CES) in Las Vegas. The Bluetooth Special Interest Group (SIG) announced the formal adoption of its next generation Bluetooth v3.0 + HS wireless connectivity technology on April 21, 2009, at the SIG Annual All-Hands meeting in Tokyo.
In addition to enabling Bluetooth profiles to utilize high speed 802.11 data rates, Broadcom silicon and software solutions will further enable mobile devices to leverage the low power connection management features provided by Bluetooth wireless technology, increasing the valuable synergy between these already popular technologies. Broadcom is working together with other companies and various standards groups to standardize these additional capabilities.
"The new Bluetooth v3.0 + HS specification is a welcome step in the continuing evolution of Bluetooth technology, adding industry approved techniques for leveraging the high data rates of Wi-Fi with the ease of use, low-power and utility that Bluetooth wireless technology is recognized for," said Craig Ochikubo, Vice President & General Manager of Broadcom's Wireless Personal Area Networking line of business. "The new specification makes our combo chip products even more attractive to OEMs who seek to provide their customers with the most complete wireless user experience available."
The Bluetooth products now qualified as compliant with the v3.0 + HS specification include the Broadcom(R) BCM4325 802.11b/g combo chip solution that combines Bluetooth, Wi-Fi and FM radio functionality on a single-chip design.
Broadcom's popular BTE software, the core Bluetooth software stack on which all Broadcom Bluetooth software is based (including BTW, BTW Mobile and embedded software for cellular handsets and other devices) has also been qualified as compliant with the new v3.0 + HS standard. The BCM4325 is also Wi-Fi CERTIFIED in a number of customer products.
In addition to enabling 10 times the transmission speed over previous Bluetooth specifications, v3.0 + HS provides other useful innovations that Broadcom combo chips and BTE software can utilize as well. This includes expanded capabilities for remote control applications featuring Unicast Connectionless Data (UCD) functionality that enables low power operation and reduced latency, making Bluetooth's radio technology ideally suited for consumer electronics remote control applications.
The Bluetooth v3.0 + HS specification also enhances the already powerful security capabilities of Bluetooth technology by including the new Read Encryption Key Size feature that allows Bluetooth applications to ensure an appropriate level of communications security.
Broadcom's Bluetooth BR/EDR controller solutions, including the BCM4325, further provide support for the Enhanced Power Control feature introduced in the Bluetooth v3.0 + HS specification. This feature provides improved control over transmit power levels on Bluetooth BR/EDR links, improving the robustness of communications and providing better optimized power consumption.
"The Bluetooth Special Interest Group is gratified that Broadcom has played an active role in helping drive the evolution of Bluetooth technology through its contributions to the standard and timely implementation of these new features," said Michael Foley, Ph.D., executive director of the Bluetooth SIG. "With strength in multiple wireless technologies, the company is helping make the vision of high speed Bluetooth technology a reality."
The new standard significantly expands the capabilities of Bluetooth wireless technology in multimedia smartphones, netbooks and other devices by enabling the transmission of large files via Bluetooth profiles at speeds up to 24 Megabits per second (Mbps), or a 10 times increase in speed over the previous Bluetooth v2.1 + EDR (enhanced data rate) standard. With the company's InConcert(R) BCM4325 Bluetooth + Wi-Fi(R) + FM combo chip solution (the first product in the industry to achieve qualification) and Bluetooth software, Broadcom is uniquely positioned to support the latest Bluetooth specification with proven single-chip solutions.
While competing implementations require multiple discrete components that raise cost and power requirements, Broadcom is able to provide a single-chip solution that includes both a qualified Bluetooth v3.0 BR/EDR (basic rate) controller and Wi-Fi CERTIFIED(TM) media access controller (MAC)/physical layer (PHY) device.
When combined with Broadcom's v3.0 + HS qualified host software solution, these products enable OEMs to add the convenience of high speed Bluetooth data transfer while reducing board space, power consumption and overall system cost in next generation Bluetooth-enabled devices.
Broadcom's high speed Bluetooth technology was recently demonstrated at the 2009 International Consumer Electronics Show (CES) in Las Vegas. The Bluetooth Special Interest Group (SIG) announced the formal adoption of its next generation Bluetooth v3.0 + HS wireless connectivity technology on April 21, 2009, at the SIG Annual All-Hands meeting in Tokyo.
In addition to enabling Bluetooth profiles to utilize high speed 802.11 data rates, Broadcom silicon and software solutions will further enable mobile devices to leverage the low power connection management features provided by Bluetooth wireless technology, increasing the valuable synergy between these already popular technologies. Broadcom is working together with other companies and various standards groups to standardize these additional capabilities.
"The new Bluetooth v3.0 + HS specification is a welcome step in the continuing evolution of Bluetooth technology, adding industry approved techniques for leveraging the high data rates of Wi-Fi with the ease of use, low-power and utility that Bluetooth wireless technology is recognized for," said Craig Ochikubo, Vice President & General Manager of Broadcom's Wireless Personal Area Networking line of business. "The new specification makes our combo chip products even more attractive to OEMs who seek to provide their customers with the most complete wireless user experience available."
The Bluetooth products now qualified as compliant with the v3.0 + HS specification include the Broadcom(R) BCM4325 802.11b/g combo chip solution that combines Bluetooth, Wi-Fi and FM radio functionality on a single-chip design.
Broadcom's popular BTE software, the core Bluetooth software stack on which all Broadcom Bluetooth software is based (including BTW, BTW Mobile and embedded software for cellular handsets and other devices) has also been qualified as compliant with the new v3.0 + HS standard. The BCM4325 is also Wi-Fi CERTIFIED in a number of customer products.
In addition to enabling 10 times the transmission speed over previous Bluetooth specifications, v3.0 + HS provides other useful innovations that Broadcom combo chips and BTE software can utilize as well. This includes expanded capabilities for remote control applications featuring Unicast Connectionless Data (UCD) functionality that enables low power operation and reduced latency, making Bluetooth's radio technology ideally suited for consumer electronics remote control applications.
The Bluetooth v3.0 + HS specification also enhances the already powerful security capabilities of Bluetooth technology by including the new Read Encryption Key Size feature that allows Bluetooth applications to ensure an appropriate level of communications security.
Broadcom's Bluetooth BR/EDR controller solutions, including the BCM4325, further provide support for the Enhanced Power Control feature introduced in the Bluetooth v3.0 + HS specification. This feature provides improved control over transmit power levels on Bluetooth BR/EDR links, improving the robustness of communications and providing better optimized power consumption.
"The Bluetooth Special Interest Group is gratified that Broadcom has played an active role in helping drive the evolution of Bluetooth technology through its contributions to the standard and timely implementation of these new features," said Michael Foley, Ph.D., executive director of the Bluetooth SIG. "With strength in multiple wireless technologies, the company is helping make the vision of high speed Bluetooth technology a reality."
Tuesday, 21 April 2009
Broadcom proposes to acquire Emulex for $9.25 per share in cash
IRVINE, USA: Broadcom Corp. has made a proposal to the Emulex Corp. Board of Directors to acquire all the outstanding shares of Emulex common stock for $9.25 per share in cash, representing a total equity value of approximately $764 million.
The offer represents a 40 percent premium above the closing price of Emulex common stock on April 20, 2009, a 62 percent premium to trailing 30 day average price per share and an approximately 85 percent premium to enterprise value.
Broadcom believes that its leadership in Ethernet networking, together with Emulex's deep expertise in Fibre Channel storage networking, will enable the combined company to accelerate the development of converged solutions for enterprise networks.
This combination offers compelling benefits to shareholders, customers and employees of both companies:
* Accelerates vision of network conversion which promises significant benefits to customers and the industry.
* Creates significant shareholder value for both companies.
* Emulex shareholders will receive a substantial premium to the current value of their shares and immediate value, in cash, for their equity stake in Emulex.
* Broadcom expects the acquisition of Emulex will be accretive to earnings per share in 2010.
* Broadcom expects to increase both companies' revenue growth through an improved ability to innovate next-generation solutions for customers of both companies, as well as broadening the distribution channels for each company's products.
* Broadcom's cash offer will be funded from its approximately $2 billion of existing cash and marketable securities on hand, with the fundamentals of Broadcom's capital position remaining strong.
Scott A. McGregor, President and Chief Executive Officer of Broadcom, said: "This combination is strategically compelling and provides significant value to the shareholders of both companies. Broadcom has long and successful experience, through over 40 transactions, of integrating companies into Broadcom, so this is a highly achievable proposal to deliver value to customers and employees of both companies."
"A combination of Broadcom and Emulex addresses our customers' growing need to apply the economics of Ethernet to the Fibre Channel storage space to achieve low-cost network converged solutions," he added. "The logical evolution of the enterprise network is for a transition to a converged fabric architecture that incorporates a broad array of technologies. Our combined entity can be a one-stop shop for key networking and storage technologies for the enterprise and for our industry. Our preference is to proceed in a friendly, collaborative manner, and we hope that Emulex's Board will see the merits of this combination and appreciate the substantial value being offered to its shareholders."
The combination of Broadcom and Emulex is highly complementary, with little customer or product overlap and compatible workforces. Both companies have highly-skilled engineering employees with expertise in different product areas. Emulex's employees would benefit from the ability to utilize Broadcom's vast intellectual property, engineering resources and substantial R&D scale. Broadcom's employees would benefit from Emulex's strong position and expertise within the storage market for host bus adapters and diversified channels.
The offer represents a 40 percent premium above the closing price of Emulex common stock on April 20, 2009, a 62 percent premium to trailing 30 day average price per share and an approximately 85 percent premium to enterprise value.
Broadcom believes that its leadership in Ethernet networking, together with Emulex's deep expertise in Fibre Channel storage networking, will enable the combined company to accelerate the development of converged solutions for enterprise networks.
This combination offers compelling benefits to shareholders, customers and employees of both companies:
* Accelerates vision of network conversion which promises significant benefits to customers and the industry.
* Creates significant shareholder value for both companies.
* Emulex shareholders will receive a substantial premium to the current value of their shares and immediate value, in cash, for their equity stake in Emulex.
* Broadcom expects the acquisition of Emulex will be accretive to earnings per share in 2010.
* Broadcom expects to increase both companies' revenue growth through an improved ability to innovate next-generation solutions for customers of both companies, as well as broadening the distribution channels for each company's products.
* Broadcom's cash offer will be funded from its approximately $2 billion of existing cash and marketable securities on hand, with the fundamentals of Broadcom's capital position remaining strong.
Scott A. McGregor, President and Chief Executive Officer of Broadcom, said: "This combination is strategically compelling and provides significant value to the shareholders of both companies. Broadcom has long and successful experience, through over 40 transactions, of integrating companies into Broadcom, so this is a highly achievable proposal to deliver value to customers and employees of both companies."
"A combination of Broadcom and Emulex addresses our customers' growing need to apply the economics of Ethernet to the Fibre Channel storage space to achieve low-cost network converged solutions," he added. "The logical evolution of the enterprise network is for a transition to a converged fabric architecture that incorporates a broad array of technologies. Our combined entity can be a one-stop shop for key networking and storage technologies for the enterprise and for our industry. Our preference is to proceed in a friendly, collaborative manner, and we hope that Emulex's Board will see the merits of this combination and appreciate the substantial value being offered to its shareholders."
The combination of Broadcom and Emulex is highly complementary, with little customer or product overlap and compatible workforces. Both companies have highly-skilled engineering employees with expertise in different product areas. Emulex's employees would benefit from the ability to utilize Broadcom's vast intellectual property, engineering resources and substantial R&D scale. Broadcom's employees would benefit from Emulex's strong position and expertise within the storage market for host bus adapters and diversified channels.
Thursday, 4 December 2008
Global semicon could decline by over 5pc in 2009!
The year 2008 will soon be relegated to history, albeit with the dubious distinction of handing out an extremely unforgettable year for the memory chip makers!This trend was starkly evident, as a major downturn in this segment caused revenue to fall for nearly all suppliers and contributed to negative results for the overall semiconductor industry, according to recently released preliminary market-share figures from iSuppli Corp. (The memory market is being dealt with in the next blog!)
The key question remains as to whether the semicon industry has really lost the money-making ability? According to Dale Ford, senior vice president, market intelligence services, for iSuppli, the semiconductor industry goes through cycles of revenue growth and profitability. He says, "It would not be correct to extrapolate the current challenges of the semiconductor industry and say that the industry has “lost its money-making ability.”
iSuppli expects that the the industry will experience some level of restructuring during this downturn that will help it emerge to renewed revenue growth and profitability.
Revenue to drop 2 percent
Given the current scenario, it is taken for granted now that the global semicon revenue will likely decline in 2008. Ford says: "iSuppli predicts that the semiconductor industry will decline by 2 percent in 2008. However, it is possible for the decline to worsen as more companies revise down their fourth quarter guidance."
The primary reasons for the decline are the over supply of memory ICs and resulting steep price declines and the global financial/economic crisis that has impacted consumer spending and the production of electronic equipment.
Fabless flies high
Coming down to the top 20 semiconductor suppliers (see table above), it would be interesting to see how the fabless companies have fared overall. Ford says that Qualcomm, Broadcom and nVidia are predicted to be the only fabless companies in the top 20 semiconductor suppliers in 2008.
"Qualcomm and Broadcom are expected to see their revenues grow by 19.6 percent and 26.4 percent, respectively. Only nVidia is expected to see a decline in revenues with a projected contraction of 0.5 percent," he adds.
There are some non-memory players in the top 20, who have registered declines. While it is not possible to comment on every single company, Ford mentions that the declining revenues are due to a variety of factors, including divestiture of business units, declining markets, and lost market share.
Fab spend and outlook 2009
Critically, there is a need to also see how the fab spends are looking like in 2009.
According to SEMI's recent World Fab Forecast, spending on fab construction projects in 2008 is likely to decline by 41 percent year-over-year (YoY), as projects are pushed out or put on hold. In 2009, the Americas and Japan are expected to be the only regions with positive growth rates for construction spending.
Ford adds, "Currently, we see fab spending declining significantly in 2009."
Overall, what's the outlook going to be like for the global semiconductor industry in 2009! Ford concludes: "We have not released a formal forecast to the press at this time. However, I will say that we expect the semiconductor market to decline by more than 5 percent in 2009."
Friday, 25 July 2008
Karnataka semicon policy very soon!
The government of Karnataka will be announcing a semiconductor policy very soon, according to Katta Subramanya Naidu, the minister for Excise, Information, BWWB, IT and BT, government of Karnataka, while delivering the opening address at the ISA Excite organized by the India Semiconductor Association.
Over the last several years, India has been a destination favored by almost all leading global semiconductor companies for setting up their development centers for semiconductors and embedded designs.
The size of the Indian semicon design industry is currently $6 billion across VLSI and board design, and embedded software, with the potential to be around $9 billion by 2009. There are nearly 200 companies and it employs over 130,000 professionals, all over India, with the potential to employ over 180,000 by 2009. The Indian semicon design industry has a CAGR of nearly 22 percent versus the global average of 7-8 percent.
Nearly 90 percent of the VLSI design work is done out of Bangalore alone. Appropriately, the ISA is headquartered in Bangalore, the heart of India's chip industry. The minister said: "The conducive work environment policies and high-quality talent are the important attractions for both MNCs and Indian companies to set up shop here. We value the contribution of our technology leaders and engineers to build the economy of the state and make it a global leader. Bangalore is next only to Silicon Valley, California, in terms of the work done here."
New centers likely
In future, the government of Karnataka wants to look at Mysore, Mangalore and Hubli as important centers to be developed. "These are centers of education with high quality and quantity of engineering talent. Our government is working on improving the connectivity to these cities to help attract investment there, as well as the expansion of companies from Bangalore to other towns within Karnataka," he added.
Welcome the ISA initiative to launch Excite, a program for the semiconductor and ecosystem companies, he noted that it was a good platform to understand the technology trends and to collaborate with the right partner.
He said: "Karnataka today is at the crossroads. We have the direction and leadership of Hon'ble chief minister Yeddyruppa. He is extremely committed to the cause of making Karnataka as the most preferred destination for the semiconductor industry and electronics hardware manufacturing. My (BJP) government would be glad to extend any support for your business plans in the state."
Semicon policy soon
The state government plans to announce a semiconductor policy in the very near future, actually. It has also earmarked land for a hardware technology park near the new airport (in Devanahalli).
The government is also thinking in the lines of finishing schools in PPP mode as the semiconductor industry is technology driven, and demands continuous training and re-skilling of the workforce.
Initiatives in Karnataka
The minister pointed out that his government has been taking several pro-active steps for further accelerating the growth of these sectors, as well as for their expansion in tier II and III cities. For these two sectors, the government proposes to identify and set apart exclusive IT/BT zones in Mysore, Mangalore, Hubli-Dharwad, Belgaum, Shimoga and Gulbarga.
Yeddyruppa, the state chief minister, has made an announcement of a number of initiatives to boost the growth and development of IT/BT. A bio-IT park on a 100-acre plot is proposed to be developed with private participation near Bangalore. IT parks, with private participation, would be set up in tier II and III cities. A massive IT city on the lines of the Electronics City near Bangalore is under consideration. Similarly, BT parks are proposed to be set up in Mangalore, Dharwad and Bidar. KEONICS, a government of Karnataka undertaking, will play a major role in development of the IT city, IT parks and computer literacy campaigns.
He added that the state government believes in formulating initiatives and policies in consultation with the industry. The existing Mahithi IT policy is also being revised with inputs from the Vision Group on IT headed by N.R. Narayana Murthy of Infosys.
"The state government would be happy to see IT and BT developments happening in tier II and III cities. We are taking steps to improve and upgrade the infrastructure in these cities. The CM is personally reviewing the construction and upgradation of airports in Mysore, Shimoga and Gulbarga, which will provide vital air connectivity, essential for the growth of industry and business," he noted.
The NASSCOM-Kearney report has identified 43 potential locations in the country for IT development. The report also suggests measures to be taken to make these locations attractive for IT investments. Recommendations, such as improving the quality of education, imparting employable skills to the uneducated youth, improving infrastructure, particularly, air connectivity, etc., would be taken into consideration.
The minister said: "Our government would take all the necessary steps to ensure that there is no flight of investment to other states, and to make Karnataka the most attractive region for IT/BT investments. We want the semiconductor industry to grow and flourish in the state."
Participative semicon policy likely
Elaborating on the proposed semiconductor policy for Karnataka, Ashok Kumar C. Manoli, principal secretary to the government, said: "When you look at India, it is software, and when you look at China, it is hardware. We should make a beginning and try and become the global capital for both hardware and software. We need to design such a policy that design activities continue and also facilitate manufacturing."
He added: "We will come up with a very participative semiconductor policy. It will also look at addressing infrastructure requirements for manufacturing setups." According to him, the hardware industry is the foundation for the entire revolution, which the government is looking at. He requested all companies present at the ISA Excite to participate at the forthcoming BangaloreIT.com event, and added that the state government was committed and fully geared up to deliver.
Announcing the ISA Excite initiative, Sanjeev Keskar, country sales manager, Freescale Semiconductor India Pvt Ltd, said: "We need to collaborate with the right partner. The ISA felt the need to arrange an ecosystem meet. Telecom and healthcare are the two drivers of importance." The ISA has plans to take Excite to other cities too, possibly, New Delhi, focusing on industrial and consumer.
The one-day ISA Excite event had an exhibition running simultaneously, featuring about 40 companies. These included ARM, Farnell, Ittiam Systems, Broadcom, Cosmic Circuits, Windriver, Wipro, HCL, AMDL, LSI Logic, TI, NXP, Cisco, Synopsys, SemIndia, Freescale, Open Silicon, MindTree, AMD, Analog Devices, RFMD, Cir-Q-Tech, NewEra, STPI, etc.
Over the last several years, India has been a destination favored by almost all leading global semiconductor companies for setting up their development centers for semiconductors and embedded designs.The size of the Indian semicon design industry is currently $6 billion across VLSI and board design, and embedded software, with the potential to be around $9 billion by 2009. There are nearly 200 companies and it employs over 130,000 professionals, all over India, with the potential to employ over 180,000 by 2009. The Indian semicon design industry has a CAGR of nearly 22 percent versus the global average of 7-8 percent.
Nearly 90 percent of the VLSI design work is done out of Bangalore alone. Appropriately, the ISA is headquartered in Bangalore, the heart of India's chip industry. The minister said: "The conducive work environment policies and high-quality talent are the important attractions for both MNCs and Indian companies to set up shop here. We value the contribution of our technology leaders and engineers to build the economy of the state and make it a global leader. Bangalore is next only to Silicon Valley, California, in terms of the work done here."
New centers likely
In future, the government of Karnataka wants to look at Mysore, Mangalore and Hubli as important centers to be developed. "These are centers of education with high quality and quantity of engineering talent. Our government is working on improving the connectivity to these cities to help attract investment there, as well as the expansion of companies from Bangalore to other towns within Karnataka," he added.
Welcome the ISA initiative to launch Excite, a program for the semiconductor and ecosystem companies, he noted that it was a good platform to understand the technology trends and to collaborate with the right partner.
He said: "Karnataka today is at the crossroads. We have the direction and leadership of Hon'ble chief minister Yeddyruppa. He is extremely committed to the cause of making Karnataka as the most preferred destination for the semiconductor industry and electronics hardware manufacturing. My (BJP) government would be glad to extend any support for your business plans in the state."
Semicon policy soon
The state government plans to announce a semiconductor policy in the very near future, actually. It has also earmarked land for a hardware technology park near the new airport (in Devanahalli).
The government is also thinking in the lines of finishing schools in PPP mode as the semiconductor industry is technology driven, and demands continuous training and re-skilling of the workforce.
Initiatives in Karnataka
The minister pointed out that his government has been taking several pro-active steps for further accelerating the growth of these sectors, as well as for their expansion in tier II and III cities. For these two sectors, the government proposes to identify and set apart exclusive IT/BT zones in Mysore, Mangalore, Hubli-Dharwad, Belgaum, Shimoga and Gulbarga.
Yeddyruppa, the state chief minister, has made an announcement of a number of initiatives to boost the growth and development of IT/BT. A bio-IT park on a 100-acre plot is proposed to be developed with private participation near Bangalore. IT parks, with private participation, would be set up in tier II and III cities. A massive IT city on the lines of the Electronics City near Bangalore is under consideration. Similarly, BT parks are proposed to be set up in Mangalore, Dharwad and Bidar. KEONICS, a government of Karnataka undertaking, will play a major role in development of the IT city, IT parks and computer literacy campaigns.
He added that the state government believes in formulating initiatives and policies in consultation with the industry. The existing Mahithi IT policy is also being revised with inputs from the Vision Group on IT headed by N.R. Narayana Murthy of Infosys.
"The state government would be happy to see IT and BT developments happening in tier II and III cities. We are taking steps to improve and upgrade the infrastructure in these cities. The CM is personally reviewing the construction and upgradation of airports in Mysore, Shimoga and Gulbarga, which will provide vital air connectivity, essential for the growth of industry and business," he noted.
The NASSCOM-Kearney report has identified 43 potential locations in the country for IT development. The report also suggests measures to be taken to make these locations attractive for IT investments. Recommendations, such as improving the quality of education, imparting employable skills to the uneducated youth, improving infrastructure, particularly, air connectivity, etc., would be taken into consideration.
The minister said: "Our government would take all the necessary steps to ensure that there is no flight of investment to other states, and to make Karnataka the most attractive region for IT/BT investments. We want the semiconductor industry to grow and flourish in the state."
Participative semicon policy likely
Elaborating on the proposed semiconductor policy for Karnataka, Ashok Kumar C. Manoli, principal secretary to the government, said: "When you look at India, it is software, and when you look at China, it is hardware. We should make a beginning and try and become the global capital for both hardware and software. We need to design such a policy that design activities continue and also facilitate manufacturing."
He added: "We will come up with a very participative semiconductor policy. It will also look at addressing infrastructure requirements for manufacturing setups." According to him, the hardware industry is the foundation for the entire revolution, which the government is looking at. He requested all companies present at the ISA Excite to participate at the forthcoming BangaloreIT.com event, and added that the state government was committed and fully geared up to deliver.
Announcing the ISA Excite initiative, Sanjeev Keskar, country sales manager, Freescale Semiconductor India Pvt Ltd, said: "We need to collaborate with the right partner. The ISA felt the need to arrange an ecosystem meet. Telecom and healthcare are the two drivers of importance." The ISA has plans to take Excite to other cities too, possibly, New Delhi, focusing on industrial and consumer.
The one-day ISA Excite event had an exhibition running simultaneously, featuring about 40 companies. These included ARM, Farnell, Ittiam Systems, Broadcom, Cosmic Circuits, Windriver, Wipro, HCL, AMDL, LSI Logic, TI, NXP, Cisco, Synopsys, SemIndia, Freescale, Open Silicon, MindTree, AMD, Analog Devices, RFMD, Cir-Q-Tech, NewEra, STPI, etc.
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