Showing posts with label Sanmina-SCI. Show all posts
Showing posts with label Sanmina-SCI. Show all posts

Monday, 7 September 2009

Sanmina-SCI, OneChip Photonics in optical manufacturing partnership

SAN JOSE, USA & OTTAWA, CANADA: Sanmina-SCI Corp., a leading global EMS company, and OneChip Photonics, an emerging supplier of low-cost, high-performance optical transceivers, announced a manufacturing partnership to produce OneChip Photonics' breakthrough Photonic Integrated Circuit (PIC)-based Fiber-to-the-Premises (FTTP) transceivers.

"Sanmina-SCI is excited to have been selected by OneChip Photonics to support the introduction and volume manufacture of OneChip's unique FTTP transceiver product line," said Dave Dutkowsky, Executive Vice President of Sanmina-SCI's Communications Infrastructure Division.

"This partnership is an excellent example of a high-technology customer using Sanmina-SCI's complete end-to-end manufacturing capabilities and global supply chain solutions to bring a unique optical access product to market. OneChip Photonics will be leveraging our global optical infrastructure which includes our domestic New Product Introduction and Gateway Centers, plus our optical component manufacturing capability in China."

"We look forward to working with Sanmina-SCI, a world leader in optical manufacturing and trusted partner whose expertise, skills and global capabilities will help OneChip rapidly deliver very cost-efficient and high-quality devices to our customers," said Chris Hart, Vice President of Operations at OneChip Photonics.

"We believe our breakthrough approach and technology will accelerate FTTx deployment, and our partnership with Sanmina-SCI will enable us to bring this technology to market on a global basis."

Sanmina-SCI has design, manufacturing and logistics facilities strategically located in key regions throughout the world, including the Shenzhen Optical facility that was acquired from JDS Uniphase in early 2009. Collectively, Sanmina-SCI provides more than 30 years of optical design and engineering experience to its customers.

Tuesday, 18 August 2009

Shocking Technologies certifies Sanmina-SCI

SAN JOSE, USA: Shocking Technologies Inc., a leading developer of next generation embedded electrostatic discharge (ESD) protection solutions, certified Sanmina-SCI Corp., a leading global electronics manufacturing services (EMS) company, to manufacture PCBs with the Shocking Technologies embedded XStatic technology.

The certification allows Sanmina-SCI to manufacture PCBs that meet the industry-standard electrical, mechanical and reliability specifications in addition to providing superior ESD resistance and lower-system cost.

“We’ve had a very productive collaboration with Shocking Technologies and we are looking forward to being the first to commercialize this exciting technology,” said George Dudnikov, Senior Vice President and Chief Technology Officer for Sanmina-SCI’s PCB and Backplane Divisions.

“We’ve already demonstrated comprehensive ESD resistance in a sensitive memory application using XStaticTM material. Migrating to an embedded ESD protection approach from today’s discrete approach means global system protection and significant cost savings.”

“Our XStatic material is designed to be highly compatible with standard PCB manufacturing processes which will enable quick adoption,” explained Lex Kosowsky, CEO of Shocking Technologies.

“This compatibility was demonstrated in our collaboration with Sanmina-SCI and we are pleased to have an industry leader as our first certified PCB supplier. The help and support provided by the Sanmina-SCI team has been key in making Shocking Technologies’ solution a reality. Products containing XStatic technology will reach the market in the coming months. We look forward to proliferating the technology to other PCB manufacturers in the very near future.”

Shocking Technologies’ XStatic technology is based around a patented switchable polymer nano-composite that switches between insulating and conductive states. A thin continuous XStatic layer is contained in the PCB which provides comprehensive protection by shunting ESD-related destructive currents away from the device circuitry all within a nano-second of being pulsed.