MILPITAS, USA: Nanometrics Inc., a leading supplier of advanced process control metrology systems used primarily in the manufacturing of semiconductors, solar photovoltaics and high-brightness LEDs as well as advanced wafer-scale packaging, announced that is has received an order for multiple Atlas XP metrology systems equipped with NanoCD capability.
The systems are expected to be qualified in the third quarter of this year at a leading semiconductor manufacturer. The systems will be installed with Nanometrics’ scalable NanoGen cluster computing solutions to enable analysis of the most critical and complex process steps in an advanced technology node, supporting both film thickness and optical critical dimension (OCD) metrology.
“The challenges of leading edge semiconductor manufacturing methods have pushed many conventional technologies aside and require that the measurement of thin film thickness, profiles and device geometries occur directly on complex structures,” commented Bill McGahan, Director of OCD Technology Development at Nanometrics.
“Additionally, the rapidly changing process environment necessitates a system and software solution to support robust recipe development. By combining the full NanoCD suite, including our NanoDiffract software, NanoGen cluster computing solutions and Atlas XP metrology systems, our customer has a path to accurate and precise process monitoring in a dynamic and rapidly evolving development line.”
With this deployment, Nanometrics now has OCD solutions in every segment of the fab including lithography, etch, chemical mechanical polishing (CMP) and thin film deposition, and across all device types including logic, DRAM, flash memory, and magnetic heads spanning the 65nm to 22nm nodes.
Showing posts with label Nanometrics. Show all posts
Showing posts with label Nanometrics. Show all posts
Thursday, 20 August 2009
Monday, 3 August 2009
Nanometrics' multiple system order for Caliper Mosaic overlay metrology systems
MILPITAS, USA: Nanometrics Inc., a leading supplier of advanced process control metrology systems used primarily in the manufacturing and packaging of semiconductors, solar photovoltaics and high-brightness LEDs, announced a multiple system order for its Caliper Mosaic overlay metrology system.
The systems will be used in production running in conjunction with the Blossom overlay target technology and are expected to be delivered and qualified in the third quarter of 2009.
The Caliper Mosaic systems were ordered as a follow on to an initial system purchased in 2008 from a leading DRAM manufacturer for high volume lithography process control. The customer will also purchase licenses for the Blossom overlay target technology.
“The Blossom overlay mark, when used in conjunction with our Caliper Mosaic systems enables customers to extend their known metrology technologies while continuing to leverage improvements in precision and throughput,” commented Nigel Smith, Director of Overlay Product Technology at Nanometrics.
“The Blossom technology is gaining traction as an alternative to established target schemes as it enables our customers to measure up to 28 layers at one time. This simultaneous multi-layer measurement capability is especially beneficial in double patterning processes, offering the best possible precision for advanced lithography process control of critical layers, while substantially reducing total target real-estate requirements.”
The systems will be used in production running in conjunction with the Blossom overlay target technology and are expected to be delivered and qualified in the third quarter of 2009.
The Caliper Mosaic systems were ordered as a follow on to an initial system purchased in 2008 from a leading DRAM manufacturer for high volume lithography process control. The customer will also purchase licenses for the Blossom overlay target technology.
“The Blossom overlay mark, when used in conjunction with our Caliper Mosaic systems enables customers to extend their known metrology technologies while continuing to leverage improvements in precision and throughput,” commented Nigel Smith, Director of Overlay Product Technology at Nanometrics.
“The Blossom technology is gaining traction as an alternative to established target schemes as it enables our customers to measure up to 28 layers at one time. This simultaneous multi-layer measurement capability is especially beneficial in double patterning processes, offering the best possible precision for advanced lithography process control of critical layers, while substantially reducing total target real-estate requirements.”
Tuesday, 14 July 2009
Nanometrics delivers follow-on Unifire system to leading HDD maker
MILPITAS, USA: Nanometrics Inc. a leading supplier of advanced process control metrology systems used primarily in the manufacturing of semiconductors, solar photovoltaics and high-brightness LEDs, announced the delivery of a Unifire metrology system equipped with the Advanced Film Capability (AFC) option.
The Unifire technology configured with AFC enables the simultaneous, nondestructive measurement of film thickness and step height metrology within the industry’s smallest test areas and targets. This system is a follow-on order currently being qualified to support a leading hard drive manufacturer’s production capacity for advanced magnetic heads.
“We are pleased with the traction of the Unifire product in both the semiconductor and magnetic head manufacturing sectors. Unifire systems are being placed into specific segments that leverage the unique capabilities of the interferometer measurement technology,” commented Michael Darwin, Vice President of the Unifire Product Group at Nanometrics.
“Our customers are deploying the Unifire systems to monitor critical process parameters including device topography, film thickness and step height, many of which can only be observed non-destructively with our proprietary small-spot AFC technology.”
Nanometrics’ Unifire platform has been deployed across front-end manufacturing and advanced packaging processes in applications including lithography, etch, chemical mechanical polishing (CMP) and thin film deposition.
The Unifire technology configured with AFC enables the simultaneous, nondestructive measurement of film thickness and step height metrology within the industry’s smallest test areas and targets. This system is a follow-on order currently being qualified to support a leading hard drive manufacturer’s production capacity for advanced magnetic heads.
“We are pleased with the traction of the Unifire product in both the semiconductor and magnetic head manufacturing sectors. Unifire systems are being placed into specific segments that leverage the unique capabilities of the interferometer measurement technology,” commented Michael Darwin, Vice President of the Unifire Product Group at Nanometrics.
“Our customers are deploying the Unifire systems to monitor critical process parameters including device topography, film thickness and step height, many of which can only be observed non-destructively with our proprietary small-spot AFC technology.”
Nanometrics’ Unifire platform has been deployed across front-end manufacturing and advanced packaging processes in applications including lithography, etch, chemical mechanical polishing (CMP) and thin film deposition.
Thursday, 18 June 2009
Nanometrics, ZYGO in strategic business alliance
MILPITAS & MIDDLEFIELD, USA: Nanometrics Inc. and Zygo Corp., each leading providers of optical metrology technologies to the global semiconductor and related industries, today announced that Nanometrics has purchased inventory and certain other assets relating to ZYGO’s Semiconductor Solutions business and that the two companies have entered into a supply agreement.
Under an exclusive OEM supply agreement, ZYGO will provide interferometer sensors to Nanometrics for incorporation into the Unifire line of products as well as Nanometrics’ family of automated metrology systems.
“We are very excited about our new business partnership with ZYGO,” commented Tim Stultz, CEO of Nanometrics. “The Unifire is a terrific complement to our current product offering, and our partnership with ZYGO enables us to integrate an additional state-of-the-art metrology sensor into our system-level platform while leveraging our existing application, distribution and support capabilities.
"With ZYGO’s unique optical metrology capabilities, we expand our served markets to include the high end of dimensional control metrology for the rapidly-growing back-end-of-line packaging market, while also enhancing our product offerings to front-end-of-line metrology customers.”
Bruce Robinson, CEO of Zygo, added: “By leveraging Nanometrics’ established position as a top-tier supplier in the semiconductor industry, we can accomplish our goal of accelerating the commercial deployment and market penetration of our core interferometer technology into the worldwide semiconductor industry, without the investment associated with system integration, distribution, applications and support.”
The arrangement is structured as an asset purchase and exclusive OEM supply agreement aimed at wafer-based markets. Nanometrics will assume all inventory, backlog and customer sales and support responsibilities and ZYGO will provide measurement sensors for integration by Nanometrics.
In addition to the applications currently addressed by Nanometrics and ZYGO products, the business partnership allows for the joint development of additional technology solutions targeted at the semiconductor and related industries.
Under an exclusive OEM supply agreement, ZYGO will provide interferometer sensors to Nanometrics for incorporation into the Unifire line of products as well as Nanometrics’ family of automated metrology systems.
“We are very excited about our new business partnership with ZYGO,” commented Tim Stultz, CEO of Nanometrics. “The Unifire is a terrific complement to our current product offering, and our partnership with ZYGO enables us to integrate an additional state-of-the-art metrology sensor into our system-level platform while leveraging our existing application, distribution and support capabilities.
"With ZYGO’s unique optical metrology capabilities, we expand our served markets to include the high end of dimensional control metrology for the rapidly-growing back-end-of-line packaging market, while also enhancing our product offerings to front-end-of-line metrology customers.”
Bruce Robinson, CEO of Zygo, added: “By leveraging Nanometrics’ established position as a top-tier supplier in the semiconductor industry, we can accomplish our goal of accelerating the commercial deployment and market penetration of our core interferometer technology into the worldwide semiconductor industry, without the investment associated with system integration, distribution, applications and support.”
The arrangement is structured as an asset purchase and exclusive OEM supply agreement aimed at wafer-based markets. Nanometrics will assume all inventory, backlog and customer sales and support responsibilities and ZYGO will provide measurement sensors for integration by Nanometrics.
In addition to the applications currently addressed by Nanometrics and ZYGO products, the business partnership allows for the joint development of additional technology solutions targeted at the semiconductor and related industries.
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