KUALA LUMPUR, MALAYSIA: Malaysia has developed itself into an epicenter for semiconductor manufacturing for the last 30 years. In fast tracking up the value chain of Electrical and Electronics (E&E) industry, Malaysia has been involving in research, design and development.
The next focus areas are advanced analog, radio frequency, mixed signal and power management, IC design manufacturing and fabrication.
The Minister of Science, Technology and Innovation (MOSTI) for Malaysia, Datuk Dr. Maximus Johnity Ongkili in his statement, has emphasized on the importance of human capital development in supporting the growth of E&E industry in Malaysia. Currently, the sector employs some 462,000 people or 43 percent of total employment in the overall manufacturing sector. In ensuring that Malaysia continue to be competitive, MOSTI collaborates with a network of global technology leaders to induce technology transfer and capacity building program.
MOSTI will also continue to provide tangible incentives on commercialization and innovation efforts, in supporting the designed and development of electronic products in Malaysia.
Through its key agencies including the Malaysian Industry-Government Group for High Technology (MIGHT), MIMOS, SIRIM and Technology Park Malaysia, MOSTI promotes international R&D alliances between Malaysian companies and leading-edge global organizations. This is to ensure the progression into the next-generation of semiconductors involving green initiatives, bio-electronics, nanotechnology, as well as migration towards integrated system solutions.
In effort to grow the E&E industry in Malaysia through innovative design and development, MIGHT, Malaysian Institute of Microsystems (MIMs) and International Society for Quality Electronic Design (ISQED) have taken a joint initiative to gather representatives from global E&E industrial entities and leading universities at the 1st Asia Symposium on Quality Electronic Design (ASQED '09) on 15-16 July 2009 in Kuala Lumpur. This initiative was supported by MOSTI and Malaysian Industrial Development Authority (MIDA).
ASQED '09 was intended to gather and share the electronic design knowledge in bridging the gap between electronic design tools and processes, to achieve optimum design quality. It is the first ever ISQED event held outside the United States, after being a successful and sustainable annual event in the in the United States for the past 10 years.
The symposium also involved the exchange of documents between ISQED and MIMs to mark the rights extended to the latter, to annually organise the ASQED event in Malaysia for the next four years.
The finale of ASQED 2009 was the Partnership Exchange session involving the Deputy Minister of MOSTI representing the Minister, ASQED Committee Members and notable industry figures on electronic design both locally and overseas. The session involved exchanges on impactful suggestions from the industry, as well as insights on MOSTI's direction in further deepening and strengthening the E&E industry in Malaysia.
In moving forward, the 2nd ASQED will be held in Penang, the 'Silicon Island' of Malaysia in July 2010.
Showing posts with label Malaysia. Show all posts
Showing posts with label Malaysia. Show all posts
Monday, 17 August 2009
Tuesday, 23 June 2009
1st Asia Symposium on Quality Electronic Design -- July 15-16, Kuala Lumpur
SAN JOSE, USA & KUALA LUMPUR, MALAYSIA:The 1st Asia Symposium on Quality Electronic Design (ASQED09) has announced the final program consisting of several keynote speeches by industry leaders and experts from Synopsys, NXP, Cadence Design Systems, University of Tokyo, and Verdant Electronics, tutorials, panel discussion, and over 80 technical presentations.
This is the first ASQED event in Asia. The ASQED09 conference is being held on July 15-16, 2009 in Kuala Lumpur, Malaysia. ASQED plays a critical role in promoting quality-based electronic design and manufacturing in Asia and plans to be an integral part of establishing a communication link between semiconductor disciplines such as design, design methodologies, manufacturing, test, and packaging.
“As the electronics world moves from individual subsystem ICs to systems-on-chip (SoCs), design verification is becoming a crucial factor in overall product quality,” said Dr. Charlie Huang, Senior Vice President and Chief Strategy Officer of Cadence Design Systems, and ASQED keynote speaker.
“The ASQED conference provides an opportunity to highlight the growing need for advanced verification tools and methodologies so that engineers can ensure the quality of their designs and produce truly differentiated electronics products for the Asian market.”
Powerful keynotes headline conference
The list of plenary keynoters offers a comprehensive perspective from design, process, and tool methodologies. Keynoters include:
A New World of Partnerships for 22nm and Below
Dr. Chi-Foon Chan, President and COO, Synopsys
The Present Status and Issues in Solar Photovoltaic Systems
Prof. Takashi Tomita, Solar Quest, RCAST, the University of Tokyo
IC Packaging Technology - Electronic's New Gatekeeper for Cost and Performance
Joseph Fjelstad, Founder and President, Verdant Electronics
Trust But Verify – Product Quality in the SoC Era
Dr. Charlie Huang, SVP & Chief Strategy Officer, Cadence Design Systems
Variability-Resilient Mixed-Signal IC Design Methods
Dr. Hans Rijns, Vice President, head of Research, NXP Semiconductors, Netherlands
Tutorials
ASQED09 is pleased to offer the following tutorials by industry experts:
* Tera-scale Computing and Interconnect Challenges – 3D Stacking Considerations; Dr. Tanay Karnik, Intel, and
* Advanced Packaging Technologies and Future Interconnection Trends; Joseph Fjelstad, Verdant Electronics.
Panel discussion
Electronic Industry Trends and Implications for Asia
Moderated by Dr. Ali Iranmanesh, CEO & Chairman, Silicon Valley Technical Institute
Technical sessions
ASQED09 technical session consists of over 80 papers by engineers and researchers worldwide, covering the following topics:
* Circuit & System Design
* Test & Verification
* IC Packaging Technology
* PCB and PWB Technology & Manufacturing
* Semiconductor Technology & Manufacturing
* Nano and Bio Electronics Innovations
* Photovoltaic Technology & Manufacturing
* Electronic Design Automation Methodologies
The papers will be presented in three parallel tracks on Wednesday July 15th and Thursday July 16th.
ASQED09 corporate sponsors and supporters include Synopsys (Titanium Sponsor), Mentor Graphics (Platinum Sponsor), and Cadence Design Systems (Gold Sponsor). ASQED also includes select company exhibits.
This is the first ASQED event in Asia. The ASQED09 conference is being held on July 15-16, 2009 in Kuala Lumpur, Malaysia. ASQED plays a critical role in promoting quality-based electronic design and manufacturing in Asia and plans to be an integral part of establishing a communication link between semiconductor disciplines such as design, design methodologies, manufacturing, test, and packaging.
“As the electronics world moves from individual subsystem ICs to systems-on-chip (SoCs), design verification is becoming a crucial factor in overall product quality,” said Dr. Charlie Huang, Senior Vice President and Chief Strategy Officer of Cadence Design Systems, and ASQED keynote speaker.
“The ASQED conference provides an opportunity to highlight the growing need for advanced verification tools and methodologies so that engineers can ensure the quality of their designs and produce truly differentiated electronics products for the Asian market.”
Powerful keynotes headline conference
The list of plenary keynoters offers a comprehensive perspective from design, process, and tool methodologies. Keynoters include:
A New World of Partnerships for 22nm and Below
Dr. Chi-Foon Chan, President and COO, Synopsys
The Present Status and Issues in Solar Photovoltaic Systems
Prof. Takashi Tomita, Solar Quest, RCAST, the University of Tokyo
IC Packaging Technology - Electronic's New Gatekeeper for Cost and Performance
Joseph Fjelstad, Founder and President, Verdant Electronics
Trust But Verify – Product Quality in the SoC Era
Dr. Charlie Huang, SVP & Chief Strategy Officer, Cadence Design Systems
Variability-Resilient Mixed-Signal IC Design Methods
Dr. Hans Rijns, Vice President, head of Research, NXP Semiconductors, Netherlands
Tutorials
ASQED09 is pleased to offer the following tutorials by industry experts:
* Tera-scale Computing and Interconnect Challenges – 3D Stacking Considerations; Dr. Tanay Karnik, Intel, and
* Advanced Packaging Technologies and Future Interconnection Trends; Joseph Fjelstad, Verdant Electronics.
Panel discussion
Electronic Industry Trends and Implications for Asia
Moderated by Dr. Ali Iranmanesh, CEO & Chairman, Silicon Valley Technical Institute
Technical sessions
ASQED09 technical session consists of over 80 papers by engineers and researchers worldwide, covering the following topics:
* Circuit & System Design
* Test & Verification
* IC Packaging Technology
* PCB and PWB Technology & Manufacturing
* Semiconductor Technology & Manufacturing
* Nano and Bio Electronics Innovations
* Photovoltaic Technology & Manufacturing
* Electronic Design Automation Methodologies
The papers will be presented in three parallel tracks on Wednesday July 15th and Thursday July 16th.
ASQED09 corporate sponsors and supporters include Synopsys (Titanium Sponsor), Mentor Graphics (Platinum Sponsor), and Cadence Design Systems (Gold Sponsor). ASQED also includes select company exhibits.
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