Multiple wins for Axcelis' Optima XE high energy implanter

BEVERLY, USA: Axcelis Technologies Inc., a leading supplier of innovative, high-productivity solutions for the semiconductor industry, announced that it has achieved multiple wins for its Optima XE single wafer high energy implanter from two major manufacturers of memory devices located in Asia.

The systems will be used for the development of next generation devices at the 32nm node, as well as for high volume chip manufacturing.

Mary Puma, chairman and CEO commented: "We're very excited about these recent sales. The Optima XE offers unique technical advantages to customers striving to meet the demands of high volume device manufacturing at 32nm and beyond. It is the industry's only high energy implanter with high beam current over a broad energy range to meet today's as well as emerging implant applications.

"Combined with rapid tune times and long source life, the Optima XE delivers unmatched productivity. These wins are validation of the confidence customers have in Axcelis as the industry leader in high energy, and allow us to further extend our leadership position in this applications space."

The Optima XE provides a complete range of energy levels from 10keV to 4.5MeV. Its inherent flexibility and broad energy range allow a single tool to support chipmakers' dynamic high energy requirements for DRAM, NAND and NOR FLASH, embedded memory, image sensor and logic device manufacturing.

The Optima XE combines Axcelis' industry leading and production-proven RF Linac high energy, spot beam technology with a high-speed, state-of-the-art single wafer endstation, enabling unmatched productivity. Axcelis' advanced spot beam ensures that all points across the wafer see the same beam at the same angle, resulting in exceptional process control and maximum yield.

Axcelis, Applied Materials in strategic service agreement for Japan

BEVERLY & SANTA CLARA, USA: Axcelis Technologies Inc. and Applied Materials, Inc. have announced a strategic agreement making Applied the exclusive service provider for Axcelis semiconductor processing systems in Japan.

This program will enable Axcelis' customers to utilize Applied's extensive support infrastructure in Japan to optimize the performance and productivity of Axcelis process systems.

"We are pleased to join with Applied Materials, a company widely recognized for its outstanding service capabilities," said Mary Puma, chairman and CEO of Axcelis Technologies. "This agreement will allow Axcelis to assure the highest level of satisfaction for our present and future customers in Japan. It will also enable us to focus on our key strength -- delivering world-class manufacturing technology to the semiconductor industry."

"With expert service teams already in place in virtually every semiconductor fab, Applied is committed to providing Axcelis and its customers with the same world-class service that has gained us the respect and trust of semiconductor manufacturers worldwide," said Manfred Kerschbaum, senior vice president and general manager of Applied Global Services. "Our leading-edge service solutions can easily be expanded to non-Applied tools to simplify manufacturing operations, raise efficiency and reduce waste in the fab. We believe this program can serve as a model for the future: combining both companies' strengths for the benefit of our mutual customers."

Under the agreement, Applied will offer a comprehensive portfolio of service programs for Axcelis ion implantation, rapid thermal processing, curing and cleaning systems in Japan. Using a wide range of engineering and logistics technologies including Applied's ExpertConnect remote diagnostic capability, local and internationally located Applied certified engineers will provide preventive and corrective maintenance, spare parts management, parts cleaning and coating, and analytical services.