EINDHOVEN, THE NETHERLANDS: NXP Semiconductors today announced availability of the LPC1340 series microcontrollers with full-speed USB 2.0 device connectivity enabled by on-chip USB drivers certified by USB-IF, making them the easiest to use USB MCUs in the industry.
The LPC1340 is supported by VDE IEC 60335 Class B test libraries to support customers in the Class B certification process. In addition, NXP will offer an easy-to-use, comprehensive development tool platform for under US $30.
"Having introduced the first Cortex-M0 based LPC1100 MCU series just weeks ago, we are now adding easy-to-use USB connectivity to our pin-compatible Cortex-M3 series,” said Geoff Lees, vice president and general manager, microcontroller product line, NXP Semiconductors. “In addition we’ve created the industry’s first virtually free fully integrated open-source development tools for the ARM Cortex platform.”
The USB 2.0 device controller is fully certified and supports all 4 transfer types including isochronous transfer which is a key requirement for USB-based audio applications. Double buffering is supported on both isochronous and bulk end-points.
The on-chip USB drivers support both the Mass Storage Class (MSC) and Human Interface Device (HID) class. Furthermore, these drivers are incorporated in ROM, saving customers approximately 5-6 K bytes of user code.
ROM-based firmware drivers offer the dual advantage of low power operation as well as secure and safe bootloading via USB or other on-chip serial channels. The LPC1340 series is enumerated and recognized by any Windows or Linux PC as a mass storage device. Flash programming is enabled by a simple drag-and-drop action.
VDE Class B Certified Libraries
These license- and royalty-free libraries have been approved by the VDE (Verband der Elektrotechnik Elektronik Informationstechnik e.V.: German Association for Electrical, Electronic & Information Technologies) testing and certification institute, which is globally recognized as a leader in this field.
Now, when a designer uses these libraries, the application will not need to be completely re-evaluated by VDE as part of the final product certification -- saving valuable time for the manufacturer. These free NXP libraries eliminate the need for the designer to develop their own self-test routines, which require in-depth knowledge of the microcontroller architecture and assembler programming skills.
NXP Low-Cost Development Tool Platform
The LPC1340 series is supported by NXP’s low-cost development tool platform, providing customers with an end-to-end solution from initial prototype evaluation to final production. The platform includes an Eclipse-based IDE using the latest Galileo release, customized GNU tool chain, JTAG/SWD debugger, and a development board offering compatibility with the mbed rapid development tool ecosystem.
These development tools specifically focus on ease-of-use and faster product development time and supports all derivatives of Cortex-M0/M3 families and specific devices from the LPC2000 and LPC3000 families.
The LPC1340 series microcontrollers are also supported by industry-leading comprehensive development tools from IAR, Keil, Hitex, Code Red, and many others.
Parts are available now from NXP distributors worldwide with recommended distribution pricing in 10,000 quantities starting at $1.49.
Monday, 30 November 2009
AIS' embedded Panel PC solutions feature embedded Intel architecture and Windows embedded OS
IRVINE, USA: American Industrial Systems Inc. (AIS), has introduced a complete line of industrial Panel PC solutions featuring embedded Intel architecture and Windows embedded operating systems.
AIS’ embedded solutions have been designed to meet a variety of applications including Control Automation, HMI, Heating Ventilation and Air Conditioning (HVAC) control, Military, Marine, Transportation, Digital Signage, and Medical Industries. Through the use of embedded infrastructures AIS’ products offer long lifetime support, lower operation costs, reliable performance, and efficient operation.
AIS’ combines LCD Technology with the latest embedded platforms to create solutions including Medical Tablet PC’s, Military Rack Mount Panel Computers, Marine Panel PC, Digital Signage Engines, Rugged Vehicle PC, Touch POS Systems, Access Management Systems, HMI Touch System, and standard Industrial Panel PCs.
These off-the-shelf products are highly ruggedized and utilize industrial grade components to guarantee the high reliability and life cycle. Several enhancement technologies are utilized into these units such as MIL-810F Std. Stock/Vibration compliance, Wide Temperature Range Operation, IP65 Water/Dustproof rating, Anti-corrosion coatings, Sunlight Readability Enhancements, and Touch screen integration.
At the heart of the systems is Intel processors, including the Atom and Core 2 Duo processors, which feature high performance and low power consumption (Atom) to meet new standards in energy conservation.
Embedded computing has become a part of everyday life; AIS has created the products and tools to deploy embedded systems into existing as we as new embedded solutions. AIS offers hundreds of off-the-shelf pre engineered embedded solutions which are ready for quick deployment in the field.
Benefits
* Embedded Intel Atom Processors and Core 2 Duo Systems.
* Windows XP Embedded Standard, POS, and Professional.
* Intel Atom 1.6Ghz N270 Processor.
* Industrial Grade Construction and Components.
* Pre-engineered Ready to Deploy Solutions.
* Lower Power Consumption.
* High Reliability.
* Long Product Life Cycle.
* Several Mechanical Designs
AIS’ embedded solutions have been designed to meet a variety of applications including Control Automation, HMI, Heating Ventilation and Air Conditioning (HVAC) control, Military, Marine, Transportation, Digital Signage, and Medical Industries. Through the use of embedded infrastructures AIS’ products offer long lifetime support, lower operation costs, reliable performance, and efficient operation.
AIS’ combines LCD Technology with the latest embedded platforms to create solutions including Medical Tablet PC’s, Military Rack Mount Panel Computers, Marine Panel PC, Digital Signage Engines, Rugged Vehicle PC, Touch POS Systems, Access Management Systems, HMI Touch System, and standard Industrial Panel PCs.
These off-the-shelf products are highly ruggedized and utilize industrial grade components to guarantee the high reliability and life cycle. Several enhancement technologies are utilized into these units such as MIL-810F Std. Stock/Vibration compliance, Wide Temperature Range Operation, IP65 Water/Dustproof rating, Anti-corrosion coatings, Sunlight Readability Enhancements, and Touch screen integration.
At the heart of the systems is Intel processors, including the Atom and Core 2 Duo processors, which feature high performance and low power consumption (Atom) to meet new standards in energy conservation.
Embedded computing has become a part of everyday life; AIS has created the products and tools to deploy embedded systems into existing as we as new embedded solutions. AIS offers hundreds of off-the-shelf pre engineered embedded solutions which are ready for quick deployment in the field.
Benefits
* Embedded Intel Atom Processors and Core 2 Duo Systems.
* Windows XP Embedded Standard, POS, and Professional.
* Intel Atom 1.6Ghz N270 Processor.
* Industrial Grade Construction and Components.
* Pre-engineered Ready to Deploy Solutions.
* Lower Power Consumption.
* High Reliability.
* Long Product Life Cycle.
* Several Mechanical Designs
Sunday, 29 November 2009
Power electronics in electric and hybrid vehicles
LYON, FRANCE: Yole Developpement has recently released a new publication in its power electronics collection -- Power electronics in electric and hybrid vehicles.
A $5 billion power module market in 2020
Toyota, the world leading car producer, has been dominant on the hybrid market up to now, but this niche market is becoming a must for car makers as the focus on car C02 emissions intensifies. Hybrid is defined in different levels: micro, mild, full, and plug in hybrid.
Micro hybrid will see the highest growth due to its low cost and easy integration, specifically in Europe. Mild and full hybrid will continue their strong penetration in the US market. Plug-in hybrid is a bridge to EV technology, and uses the same high voltage battery technology and plug-to-grid for recharge.
EV car business will really ramp up in 2010 with the arrival of big car makers (Mitsubishi, Renault, GM, Ford, Daimler). Limited drive range (40 miles) and high cost, are still issues, but it is expected that huge investments in new Li-Ion batteries will increase the performance/cost ratio of EVs. Globally, more than 17 million cars will be hybrid or electric in 2015 and some forecasters suggest sales will reach 50 million units in 2020, meaning half of the cars produced.
Power electronics are a key technology for hybrids and represent 20% of the material costs. It is even bigger for EV cars. HEV/EV power devices are used in DC/DC converters and DC/AC inverters. There are various configurations depending on the hybrid version and car makers’ choices.
Inverters are roughly the same for full hybrid, plug in hybrid and EV cars with an average power of 50 kW. This application alone represent 74% of the total power module market for HEV and EV cars in 2009.
IGBT is the device of choice for such high power applications and represents 80% of the total HEV/EV power module market. Standard voltage of IGBT devices is 650V but there is a trend to increase it. It is still unknown if it will be 700/800V or directly 1.2kV which is already a standard.
The HEV/EV power module market stands at $300M in 2009 and is expected to grow strongly until 2020 at a growth rate close to 30% to reach $5B in 2020. Today, the power module market is mainly dominated by Toyota who manufactures the module internally. With the near universal involvement of other car makers, semiconductor companies (Infineon, Fuji, Mitsubishi, STM…) will enter the market and will take a big market share in the power device pie.
As HEV and EV remain expensive, car makers and tier one suppliers want to cut the cost. Power modules represent about 50% of the inverter and converter cost so power module cost reduction is the main goal of all the market players. It is expected that the power module average cost will be reduced by more than 25% in the coming years.
HEV/EV power devices value chain
Up to now, Toyota was dominating the HEV market and power module value chain. With the market growth and arrival of many players at the different levels (car makers, tier one suppliers, semi conductor companies), the landscape will change drastically.
Automotive tier one suppliers invest heavily in HEV/EV powertrain and will play an important role in HEV/EV power devices value chain: Bosch, Continental, Valeo, Delphi, Denso, Hitachi…. They have the knowledge of specific automotive requirements that are very stringent for power devices. Some of them design the power modules themselves to cut the cost.
At the same time, semi conductor companies try to climb the value chain by developing new power modules. Hence, it will be a hard time in the next years for power modules manufacturers to find a significant place on the HEV/EV market.
SiC and GaN : key technologies for HEV/EV power device applications?
Several companies (Mitsubishi, Rohm, Toyota, …) have developed inverter prototypes based on SiC diodes and switches that show significant size reduction up to ¼ of the size with silicon devices.
SiC has clear advantages in HEV/EV applications (better power density, less losses, higher operating temperature) but cost pressure for automotive is a big challenge. To succeed, the availability of SiC switches is paramount because it would allow reduction of the cooling systems cost.
At the same time, SiC devices cost would need to be significantly reduced and the passive components and packaging adapted to support high operating temperatures.
If the SiC devices cost can be reduced, then SiC may be an option for HEV and EV. Maybe, it will be introduced first in EV applications that are more sensitive to losses to gain distance range.
GaN is another possible option thanks to its better performance/cost ratio compared to SiC. Toyota and many other companies evaluate this solution and consider that if SiC cost can’t be reduce, it would be an affordable substrate specially for inverter application that is very cost sensitive.
This report presents the detailed major market metrics of the current and projected HEV/EV power module, power devices and substrate business, describing the HEV/EV market and architecture, the power devices applications, the key players, the supply-chain, the volumes and related market size of each segment. It gives the possible total accessible market for SiC and GaN, highlighting the strengths and weaknesses of those materials over the current established silicon technologies.
Yole will be hosting a free webinar on Power Electronics in EV/HEV on Dec. 9.
A $5 billion power module market in 2020
Toyota, the world leading car producer, has been dominant on the hybrid market up to now, but this niche market is becoming a must for car makers as the focus on car C02 emissions intensifies. Hybrid is defined in different levels: micro, mild, full, and plug in hybrid.
Micro hybrid will see the highest growth due to its low cost and easy integration, specifically in Europe. Mild and full hybrid will continue their strong penetration in the US market. Plug-in hybrid is a bridge to EV technology, and uses the same high voltage battery technology and plug-to-grid for recharge.
EV car business will really ramp up in 2010 with the arrival of big car makers (Mitsubishi, Renault, GM, Ford, Daimler). Limited drive range (40 miles) and high cost, are still issues, but it is expected that huge investments in new Li-Ion batteries will increase the performance/cost ratio of EVs. Globally, more than 17 million cars will be hybrid or electric in 2015 and some forecasters suggest sales will reach 50 million units in 2020, meaning half of the cars produced.
Power electronics are a key technology for hybrids and represent 20% of the material costs. It is even bigger for EV cars. HEV/EV power devices are used in DC/DC converters and DC/AC inverters. There are various configurations depending on the hybrid version and car makers’ choices.
Inverters are roughly the same for full hybrid, plug in hybrid and EV cars with an average power of 50 kW. This application alone represent 74% of the total power module market for HEV and EV cars in 2009.
IGBT is the device of choice for such high power applications and represents 80% of the total HEV/EV power module market. Standard voltage of IGBT devices is 650V but there is a trend to increase it. It is still unknown if it will be 700/800V or directly 1.2kV which is already a standard.
The HEV/EV power module market stands at $300M in 2009 and is expected to grow strongly until 2020 at a growth rate close to 30% to reach $5B in 2020. Today, the power module market is mainly dominated by Toyota who manufactures the module internally. With the near universal involvement of other car makers, semiconductor companies (Infineon, Fuji, Mitsubishi, STM…) will enter the market and will take a big market share in the power device pie.
As HEV and EV remain expensive, car makers and tier one suppliers want to cut the cost. Power modules represent about 50% of the inverter and converter cost so power module cost reduction is the main goal of all the market players. It is expected that the power module average cost will be reduced by more than 25% in the coming years.
HEV/EV power devices value chain
Up to now, Toyota was dominating the HEV market and power module value chain. With the market growth and arrival of many players at the different levels (car makers, tier one suppliers, semi conductor companies), the landscape will change drastically.
Automotive tier one suppliers invest heavily in HEV/EV powertrain and will play an important role in HEV/EV power devices value chain: Bosch, Continental, Valeo, Delphi, Denso, Hitachi…. They have the knowledge of specific automotive requirements that are very stringent for power devices. Some of them design the power modules themselves to cut the cost.
At the same time, semi conductor companies try to climb the value chain by developing new power modules. Hence, it will be a hard time in the next years for power modules manufacturers to find a significant place on the HEV/EV market.
SiC and GaN : key technologies for HEV/EV power device applications?
Several companies (Mitsubishi, Rohm, Toyota, …) have developed inverter prototypes based on SiC diodes and switches that show significant size reduction up to ¼ of the size with silicon devices.
SiC has clear advantages in HEV/EV applications (better power density, less losses, higher operating temperature) but cost pressure for automotive is a big challenge. To succeed, the availability of SiC switches is paramount because it would allow reduction of the cooling systems cost.
At the same time, SiC devices cost would need to be significantly reduced and the passive components and packaging adapted to support high operating temperatures.
If the SiC devices cost can be reduced, then SiC may be an option for HEV and EV. Maybe, it will be introduced first in EV applications that are more sensitive to losses to gain distance range.
GaN is another possible option thanks to its better performance/cost ratio compared to SiC. Toyota and many other companies evaluate this solution and consider that if SiC cost can’t be reduce, it would be an affordable substrate specially for inverter application that is very cost sensitive.
This report presents the detailed major market metrics of the current and projected HEV/EV power module, power devices and substrate business, describing the HEV/EV market and architecture, the power devices applications, the key players, the supply-chain, the volumes and related market size of each segment. It gives the possible total accessible market for SiC and GaN, highlighting the strengths and weaknesses of those materials over the current established silicon technologies.
Yole will be hosting a free webinar on Power Electronics in EV/HEV on Dec. 9.
Sensonor launches high performance MEMS gyro sensor
NORWAY: SAR100 is Sensonor Technologies’ latest high performance gyro sensor, designed for demanding applications in the Aerospace, Defense, Energy, Instrumentation and Industrial markets. Based on inherently rugged MEMS technology, it features bias stability of 50/h.
It is offered in an LCC ceramic package and can withstand high shocks of up to 5000g without performance degradation. SAR100 is offered in two ranges 100/s and 250/s. (optional 2000/s).
SAR100 is interfaced with closed loop electronics based on forced feedback operation; featuring a fully digital output signal available through an SPI interface. It includes a self-test mechanism ensuring optimum performance.
Placed in a hermetically-sealed ceramic LCC package for horizontal and vertical mount that is ideal for application in harsh environments, the SAR100 gyro sensor combines the latest technological advances in MEMS technology together with high performance closed-loop electronic interface.
”SAR100 is an ITAR-free high performance gyro ideal for a number of applications at a cost effective price and we are very excited to provide this solution to our customers, thereby ensuring continuity of supply,” commented Carsten Fongen, Sales Manager at Sensonor Technologies.
”MEMS has enabled a large number of applications in the automotive and consumer markets by providing cost effective disruptive solutions. This same technology is now entering into the high-added value, high performance markets such as Mil/Aerospace, promising displacement of the current expensive, fragile technologies” continued Fongen.
It is offered in an LCC ceramic package and can withstand high shocks of up to 5000g without performance degradation. SAR100 is offered in two ranges 100/s and 250/s. (optional 2000/s).
SAR100 is interfaced with closed loop electronics based on forced feedback operation; featuring a fully digital output signal available through an SPI interface. It includes a self-test mechanism ensuring optimum performance.
Placed in a hermetically-sealed ceramic LCC package for horizontal and vertical mount that is ideal for application in harsh environments, the SAR100 gyro sensor combines the latest technological advances in MEMS technology together with high performance closed-loop electronic interface.
”SAR100 is an ITAR-free high performance gyro ideal for a number of applications at a cost effective price and we are very excited to provide this solution to our customers, thereby ensuring continuity of supply,” commented Carsten Fongen, Sales Manager at Sensonor Technologies.
”MEMS has enabled a large number of applications in the automotive and consumer markets by providing cost effective disruptive solutions. This same technology is now entering into the high-added value, high performance markets such as Mil/Aerospace, promising displacement of the current expensive, fragile technologies” continued Fongen.
Saturday, 28 November 2009
Nano ePrint secures grant for R&D; to demo world’s first printed programmable logic device
MANCHESTER, UK; Nano ePrint Ltd, the pioneer in planar nano-electronics, announced that it has secured a Grant for Research & Development from the UK’s Northwest Regional Development Agency (NWDA). The grant will provide £234k of funding towards a £390k project to demonstrate Nano ePrint’s unique printed programmable logic architecture.
This complements other venture investment and grant funding raised by the company to industrialise and commercialise its innovative approach to printed electronics.
Nano ePrint has already demonstrated that its nano-scale devices dramatically simplify manufactures, and also achieve over 10 times the performance and over 100 times the density of conventional printed electronics.
This new funding supports the further development of Nano ePrint’s modular and configurable circuit architecture to deliver the world’s first printed programmable logic devices.
This approach enables low-cost, high-volume manufacture of a generic circuit design, which can then be tailored for customer-specific requirements as it is integrated into downstream printing processes.
Nano ePrint can therefore address a wide range of market applications, from niche novelty products (such as simple printed electronic games) right through to mass-market electronic smart packaging, with a single device.
Scott White, Chief Executive Officer of Nano ePrint, commented: “This exceptional grant highlights the novelty of Nano ePrint’s approach and the huge market opportunity enabled by our printed programmable logic architecture. We are grateful for the support of the NWDA in further developing this groundbreaking technology.”
Nano ePrint will be showcasing its technology and product concepts at the IDTechEx Printed Electronics USA conference on December 1-4. The company will be exhibiting at booth no. 68, and Scott White will be presenting the benefits of printed programmable logic in the main conference at 15:40 on December 3.
This complements other venture investment and grant funding raised by the company to industrialise and commercialise its innovative approach to printed electronics.
Nano ePrint has already demonstrated that its nano-scale devices dramatically simplify manufactures, and also achieve over 10 times the performance and over 100 times the density of conventional printed electronics.
This new funding supports the further development of Nano ePrint’s modular and configurable circuit architecture to deliver the world’s first printed programmable logic devices.
This approach enables low-cost, high-volume manufacture of a generic circuit design, which can then be tailored for customer-specific requirements as it is integrated into downstream printing processes.
Nano ePrint can therefore address a wide range of market applications, from niche novelty products (such as simple printed electronic games) right through to mass-market electronic smart packaging, with a single device.
Scott White, Chief Executive Officer of Nano ePrint, commented: “This exceptional grant highlights the novelty of Nano ePrint’s approach and the huge market opportunity enabled by our printed programmable logic architecture. We are grateful for the support of the NWDA in further developing this groundbreaking technology.”
Nano ePrint will be showcasing its technology and product concepts at the IDTechEx Printed Electronics USA conference on December 1-4. The company will be exhibiting at booth no. 68, and Scott White will be presenting the benefits of printed programmable logic in the main conference at 15:40 on December 3.
Imagination Technologies intros Connected Processor IP cores
TOKYO, JAPAN: Imagination Technologies, a leading multimedia chip technologies company, says that the next trend in silicon integration will be for ubiquitous connectivity in all forms of consumer electronics.
Reflecting this trend, the company has created a new class of embedded Connected Processor solutions that will power the 'Internet Everywhere' generation of consumer electronics.
Imagination's own research suggests that within five years, more than 70 percent of all mainstream consumer electronics products, including TVs, radios, cameras, printers and more will be connected to the internet. Indeed, several major CE manufacturers have already committed to integrate internet connectivity across their entire product lines.
Imagination CEO Hossein Yassaie says: "The world is getting so connected that soon creating any chip incorporating a processor without connectivity will seem as alien as designing a chip today without memory or peripherals. Connected devices are now truly past the 'What If?' phase – in the future everything from the smallest, cheapest electronic device upwards will have an IP address and be connected to the world via the Internet.
"The most innovative new products being released now and in the next few years are now all connected, and recognising this we are developing new low power, connected processor IP cores based on our innovative 32-bit processor and communications architectures to enable an era of ubiquitous internet connectivity."
The META Connected Processor family will combine Imagination's innovative META multithreaded processor and ENSIGMA multi-standard programmable communications technologies, fully optimised for low power and high performance under all operating conditions.
As a result of this development, these technologies, which are already successful in consumer broadcast markets, will now be able to be used in new lower end markets such as digital photo-frames, media streamers/players, printers, toys and connected cameras.
For the first time, chip designers will be able to utilise a state of the art embedded 32-bit processor IP platform that delivers multi-standard connectivity, alongside a high performance Linux or RTOS based applications environment as well as DSP-intensive algorithm execution – all in one fully integrated IP solution.
The META Connected Processor IP core family will enable high volume consumer products to be connected not only to the internet but also to each other to make possible a world of universal connectivity. By delivering programmability both for general purpose applications as well as communications algorithms, these new IP cores will set the trend for next generation connectivity and embedded application platforms in consumer electronics.
Further details of the new IP core family will be announced in the coming months.
Reflecting this trend, the company has created a new class of embedded Connected Processor solutions that will power the 'Internet Everywhere' generation of consumer electronics.
Imagination's own research suggests that within five years, more than 70 percent of all mainstream consumer electronics products, including TVs, radios, cameras, printers and more will be connected to the internet. Indeed, several major CE manufacturers have already committed to integrate internet connectivity across their entire product lines.
Imagination CEO Hossein Yassaie says: "The world is getting so connected that soon creating any chip incorporating a processor without connectivity will seem as alien as designing a chip today without memory or peripherals. Connected devices are now truly past the 'What If?' phase – in the future everything from the smallest, cheapest electronic device upwards will have an IP address and be connected to the world via the Internet.
"The most innovative new products being released now and in the next few years are now all connected, and recognising this we are developing new low power, connected processor IP cores based on our innovative 32-bit processor and communications architectures to enable an era of ubiquitous internet connectivity."
The META Connected Processor family will combine Imagination's innovative META multithreaded processor and ENSIGMA multi-standard programmable communications technologies, fully optimised for low power and high performance under all operating conditions.
As a result of this development, these technologies, which are already successful in consumer broadcast markets, will now be able to be used in new lower end markets such as digital photo-frames, media streamers/players, printers, toys and connected cameras.
For the first time, chip designers will be able to utilise a state of the art embedded 32-bit processor IP platform that delivers multi-standard connectivity, alongside a high performance Linux or RTOS based applications environment as well as DSP-intensive algorithm execution – all in one fully integrated IP solution.
The META Connected Processor IP core family will enable high volume consumer products to be connected not only to the internet but also to each other to make possible a world of universal connectivity. By delivering programmability both for general purpose applications as well as communications algorithms, these new IP cores will set the trend for next generation connectivity and embedded application platforms in consumer electronics.
Further details of the new IP core family will be announced in the coming months.
Kontron Micro Client IIA: Intel Atom processor based Panel PC series
ECHING & NUREMBURG, GERMANY: The completely fanless Kontron Micro Client II Panel PCs are now available with a 1.6 GHz Intel Atom N270 processor in four screen sizes from 7 to 15 inches. They can serve as a universal HMI (Human Machine Interface) for various visualization tasks.
The IP65-protected Kontron Micro Client IIA Panel PCs with resistive touch screen are designed for the control and monitoring of equipment, machinery, and plants. They support all current thin client concepts from RDP (Remote Desktop Protocol) for Microsoft Windows-based servers to Linux based open platforms with browser based Java clients.
Operators benefit from such open concepts through the open and runtime license-free access to both centralized and decentralized (web) server applications. Kontron's latest panel PCs can also be used for several visualization tasks without requiring any application-specific software to be installed on the client.
The Kontron Micro Clients IIA feature not only SATA and CompactFlash boot functionality, but can also be remotely booted via Ethernet. This facilitates the administration of the complete solution, since only the software on the respective industrial server, e.g., the Kontron KISS server, must be administered.
The Kontron Micro Client IIA Panel PCs also offer a comprehensive interface selection: 2 x 10/1000 Ethernet, 2 external USB 2.0 ports (plus additional USB port on the front for screen sizes from 10.4” to 15.0”), 1 x RS232 with optional RS422/RS485 and CAN bus interface, as well as additional field bus interfaces as an option. They also feature sophisticated embedded graphics for intuitive GUIs, as well as touch-beep for multimedia-oriented operating and monitoring applications including acoustic feedback.
The fanless design enables silent operation, reduced maintenance costs, and lower total-cost-of-ownership due to the impressive MTBF of over 40,000 hours.
For versatile use, the front panel can be omitted, enabling the Kontron Micro Client IIA to be integrated into all custom specific housings including vandal-protected systems for public use. In this case, the OEM needs to integrate the optional touch screen functionality. With bolt or clip panel mount plus the optional VESA mount, the new Kontron Micro Clients IIA HMIs are easy to install. And thanks to their minimal installation depth (max. 50 mm for 15”) placement is easy, even for existing applications.
Shock and vibration resistance, thermal stability, and compliance with the strictest EMC standards are standard features of the Kontron Micro Clients IIA, as is long term availability of at least five years.
The CE-certified Kontron Micro Client IIA family is now available in EMEA and will be available in America and APAC in late Q1 2010. It supports for Windows CE, Windows XP Embedded, and Embedded Linux.
The IP65-protected Kontron Micro Client IIA Panel PCs with resistive touch screen are designed for the control and monitoring of equipment, machinery, and plants. They support all current thin client concepts from RDP (Remote Desktop Protocol) for Microsoft Windows-based servers to Linux based open platforms with browser based Java clients. Operators benefit from such open concepts through the open and runtime license-free access to both centralized and decentralized (web) server applications. Kontron's latest panel PCs can also be used for several visualization tasks without requiring any application-specific software to be installed on the client.
The Kontron Micro Clients IIA feature not only SATA and CompactFlash boot functionality, but can also be remotely booted via Ethernet. This facilitates the administration of the complete solution, since only the software on the respective industrial server, e.g., the Kontron KISS server, must be administered.
The Kontron Micro Client IIA Panel PCs also offer a comprehensive interface selection: 2 x 10/1000 Ethernet, 2 external USB 2.0 ports (plus additional USB port on the front for screen sizes from 10.4” to 15.0”), 1 x RS232 with optional RS422/RS485 and CAN bus interface, as well as additional field bus interfaces as an option. They also feature sophisticated embedded graphics for intuitive GUIs, as well as touch-beep for multimedia-oriented operating and monitoring applications including acoustic feedback.
The fanless design enables silent operation, reduced maintenance costs, and lower total-cost-of-ownership due to the impressive MTBF of over 40,000 hours.
For versatile use, the front panel can be omitted, enabling the Kontron Micro Client IIA to be integrated into all custom specific housings including vandal-protected systems for public use. In this case, the OEM needs to integrate the optional touch screen functionality. With bolt or clip panel mount plus the optional VESA mount, the new Kontron Micro Clients IIA HMIs are easy to install. And thanks to their minimal installation depth (max. 50 mm for 15”) placement is easy, even for existing applications.
Shock and vibration resistance, thermal stability, and compliance with the strictest EMC standards are standard features of the Kontron Micro Clients IIA, as is long term availability of at least five years.
The CE-certified Kontron Micro Client IIA family is now available in EMEA and will be available in America and APAC in late Q1 2010. It supports for Windows CE, Windows XP Embedded, and Embedded Linux.
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