BANGALORE, INDIA: Analog Devices Inc. has introduced the industry’s first digital isolator with an integrated transformer driver and PWM (pulse-width modulation) controller in a single package.
The integration of these components into a small, surface mount 20-lead SSOP (shrink small outline package) enables the new four-channel digital isolator to reduce board space by up to 30 percent and achieve cost reductions of 10 percent while simplifying the development of systems requiring isolated data and power.
The product enables designers to implement an isolated dc-to-dc converter that provides up to 2 watts of regulated, isolated power at 3.3 V to 30 V from a 5.0-V input supply or 3.3-V supply. Analog Devices’ new ADuM347x digital isolators are ideal for applications that require isolated data and isolated power, including data acquisition, industrial process control using Fieldbus, and building control. Watch a video on the ADuM347x digital isolators.
The new devices expand ADI’s iCoupler digital isolation portfolio, which provides the most extensive range of isolation technology in the industry. The ADuM347x isolators, along with other products in the portfolio, enable designers to implement isolation in their designs without the cost, size, power, performance, and reliability constraints found with traditional isolation products, such as optocouplers.
Saturday, 30 October 2010
Mandates boost car safety MEMS sensor market in Korea and Japan
EL SEGUNDO, USA: New mandates set to increase the safety of vehicles in South Korea and Japan will cause market revenue for Microelectromechanical System (MEMS) automotive sensors in those countries to rise dramatically starting in 2012, and will more than double compared to previous expectations by 2014, according to the market research firm iSuppli Corp.
The mandates apply to MEMS sensors needed for Electronic Stability Control (ESC) and Tire Pressure Monitoring Systems (TPMS).
iSuppli research shows that automotive MEMS revenues for ESC and TPMS in those countries will increase at a CAGR of 24.3 percent and reach $122.2 million once the South Korean and Japanese regulations are fully in force by 2014—up from $41.2 million in 2010. iSuppli’s earlier view, based on organic growth alone, would have yielded $54 million by 2014—a CAGR of just 5.5 percent over the same time frame.
The new mandates mean that cars fitted with ESC and TPMS in these regions now account for 16 percent of associated revenues compared to 7 percent without regulation.
The figure shows iSuppli’s forecast of automotive MEMS revenue for ESC and TPMS from 2006 to 2014 in Korea and Japan.
Source: iSuppli, USA.
Korean mandates to kick in; Japan expected to follow suit
With mandates in South Korea expected to take effect on Jan. 1, 2012 for new cars and on Jun. 30, 2014 for existing vehicles, a total about 1.7 million passenger cars weighing less than 4.5 tons will be affected by 2014, according to iSuppli’s Automotive Practice.
The Japanese mandate is not yet public, but multiple iSuppli sources indicate that Japan is likely to follow South Korea’s example, with as many as 5.3 million vehicles impacted during the same time period.
“The mandates underscore the current trend toward international harmonization of automotive safety standards, following those developed for markets in the United States, Europe, Australia and Canada,” said Richard Dixon, senior analyst for MEMS and sensors at iSuppli.
ESC has been recognized in numerous safety studies as highly significant in saving lives by sensing car trajectories and accelerations, computing these against inputs from magnetic sensors that monitor the driver’s intention, and then making the necessary corrections via the brakes if so required. TPMS first began in the United States following the TREAD Act and has been a legal requirement since 2007.
For Japan, a move to ESC will carry significant implications for the country’s small-car segment, which makes up one-third of the market in the region. At present, such vehicles in Japan have a very low ESC penetration of less than 1 percent, compared to 16 percent on average for small cars in Europe.
In comparison, cars in the Japanese luxury segment cars are already fully penetrated, while the much more voluminous mid-range cars exhibit—significantly—fitment rates in common with Europe of more than 80 percent. ESC has the greatest market impact as the contribution to system cost of the MEMS sensor—including accelerometer, gyroscope and one or more pressure sensors—amounts to approximately $21 per vehicle.
As for TPMS, systems based on the most prevalent direct measurement located in the valve of a rim add an average of 4.2 MEMS pressure sensors per vehicle, or around $8 worth of sensors. In such a system, the pressure sensors communicate information wirelessly to an indicator warning light on the dashboard if tire pressure drops below specified limits.
Challenges lie ahead for manufacturers
With the adoption of automotive safety mandates on the increase worldwide, system suppliers and sensor companies find themselves preparing to meet some challenges.
Already, considerable price pressure exists on the components used in these mandated systems. And to remain competitive, manufacturers will need to find ways to produce the critical safety systems for the new markets at the lowest cost possible.
In response, companies like TRW are producing TPMS in the valve with even fewer parts for 2011 models at lower cost. Other major Tier 1 entities, such as Continental and Bosch, are already deploying multi-sensor combo packages containing both gyroscopes and accelerometers to lower package costs and reduce footprint.
For its part, Japanese Tier 1 giant Denso has recently added a gyroscope to its inertial sensor armory and will likely follow suit with a multi-sensor combo package of its own. iSuppli analysis shows that about one-third of all vehicles with ESC will feature this solution in five years’ time.
The mandates apply to MEMS sensors needed for Electronic Stability Control (ESC) and Tire Pressure Monitoring Systems (TPMS).
iSuppli research shows that automotive MEMS revenues for ESC and TPMS in those countries will increase at a CAGR of 24.3 percent and reach $122.2 million once the South Korean and Japanese regulations are fully in force by 2014—up from $41.2 million in 2010. iSuppli’s earlier view, based on organic growth alone, would have yielded $54 million by 2014—a CAGR of just 5.5 percent over the same time frame.
The new mandates mean that cars fitted with ESC and TPMS in these regions now account for 16 percent of associated revenues compared to 7 percent without regulation.
The figure shows iSuppli’s forecast of automotive MEMS revenue for ESC and TPMS from 2006 to 2014 in Korea and Japan.
Source: iSuppli, USA.Korean mandates to kick in; Japan expected to follow suit
With mandates in South Korea expected to take effect on Jan. 1, 2012 for new cars and on Jun. 30, 2014 for existing vehicles, a total about 1.7 million passenger cars weighing less than 4.5 tons will be affected by 2014, according to iSuppli’s Automotive Practice.
The Japanese mandate is not yet public, but multiple iSuppli sources indicate that Japan is likely to follow South Korea’s example, with as many as 5.3 million vehicles impacted during the same time period.
“The mandates underscore the current trend toward international harmonization of automotive safety standards, following those developed for markets in the United States, Europe, Australia and Canada,” said Richard Dixon, senior analyst for MEMS and sensors at iSuppli.
ESC has been recognized in numerous safety studies as highly significant in saving lives by sensing car trajectories and accelerations, computing these against inputs from magnetic sensors that monitor the driver’s intention, and then making the necessary corrections via the brakes if so required. TPMS first began in the United States following the TREAD Act and has been a legal requirement since 2007.
For Japan, a move to ESC will carry significant implications for the country’s small-car segment, which makes up one-third of the market in the region. At present, such vehicles in Japan have a very low ESC penetration of less than 1 percent, compared to 16 percent on average for small cars in Europe.
In comparison, cars in the Japanese luxury segment cars are already fully penetrated, while the much more voluminous mid-range cars exhibit—significantly—fitment rates in common with Europe of more than 80 percent. ESC has the greatest market impact as the contribution to system cost of the MEMS sensor—including accelerometer, gyroscope and one or more pressure sensors—amounts to approximately $21 per vehicle.
As for TPMS, systems based on the most prevalent direct measurement located in the valve of a rim add an average of 4.2 MEMS pressure sensors per vehicle, or around $8 worth of sensors. In such a system, the pressure sensors communicate information wirelessly to an indicator warning light on the dashboard if tire pressure drops below specified limits.
Challenges lie ahead for manufacturers
With the adoption of automotive safety mandates on the increase worldwide, system suppliers and sensor companies find themselves preparing to meet some challenges.
Already, considerable price pressure exists on the components used in these mandated systems. And to remain competitive, manufacturers will need to find ways to produce the critical safety systems for the new markets at the lowest cost possible.
In response, companies like TRW are producing TPMS in the valve with even fewer parts for 2011 models at lower cost. Other major Tier 1 entities, such as Continental and Bosch, are already deploying multi-sensor combo packages containing both gyroscopes and accelerometers to lower package costs and reduce footprint.
For its part, Japanese Tier 1 giant Denso has recently added a gyroscope to its inertial sensor armory and will likely follow suit with a multi-sensor combo package of its own. iSuppli analysis shows that about one-third of all vehicles with ESC will feature this solution in five years’ time.
Friday, 29 October 2010
First AXIe 3.1 standard system module
HOPKINTON, USA: Test Evolution Inc., the leading supplier of OEM test products based on the AXIe 3.1 open standard, has announced its System Module as part of the Evolution© series of test systems focused on the semiconductor test market.
The new System Module brings to the semiconductor industry one of the building blocks of an open hardware and software platform for both device characterization and production test, using common instruments and test programs for lower cost and faster time to volume production.
"The AXIe standard enables high performance instrumentation in an open standard modular solution. This will enable a renaissance in low cost focused test solutions in semiconductor test applications," said Lev Alperovich, president,Test Evolution. "The System Module is the first in a series of products that will give customers the tools to improve productivity, time to market, and ultimately better profitability.”
The System Module is a single slot AXIe 3.1-compliant board. The System Module supports all functionality of AXIe 3.1 standard including robust backplane and front-panel triggering for inter-instrument control, 250 MB/s PCI Express to all slots, in-system calibration support, and controllable load board power supplies. The System Module, with its rear transition connector provides for cable-less connections to semiconductor devices in both characterization and production testing.
"The AXIe 3.1 triggering capabilities allow for Pattern Based Synchronization techniques leading to better test repeatability and fast test times," said David Oka, VP Engineering, Test Evolution. "The routing of test signals through the backplane and rear transition modules provides for cable free test fixtures, a major benefit for test repeatability."
The System Module is compatible with National Instrument’s LabVIEW and TestStand, and the IVI software standard which are all widely used for device characterization, and easily co-exists with PXI and LXI instruments and chassis.
This capability allows for ATE instruments to be used for characterization, and later the same instruments and test programs can be used in production, for both a cost and time savings for semiconductor device vendors.
The System Module is available now.
The new System Module brings to the semiconductor industry one of the building blocks of an open hardware and software platform for both device characterization and production test, using common instruments and test programs for lower cost and faster time to volume production.
"The AXIe standard enables high performance instrumentation in an open standard modular solution. This will enable a renaissance in low cost focused test solutions in semiconductor test applications," said Lev Alperovich, president,Test Evolution. "The System Module is the first in a series of products that will give customers the tools to improve productivity, time to market, and ultimately better profitability.”
The System Module is a single slot AXIe 3.1-compliant board. The System Module supports all functionality of AXIe 3.1 standard including robust backplane and front-panel triggering for inter-instrument control, 250 MB/s PCI Express to all slots, in-system calibration support, and controllable load board power supplies. The System Module, with its rear transition connector provides for cable-less connections to semiconductor devices in both characterization and production testing.
"The AXIe 3.1 triggering capabilities allow for Pattern Based Synchronization techniques leading to better test repeatability and fast test times," said David Oka, VP Engineering, Test Evolution. "The routing of test signals through the backplane and rear transition modules provides for cable free test fixtures, a major benefit for test repeatability."
The System Module is compatible with National Instrument’s LabVIEW and TestStand, and the IVI software standard which are all widely used for device characterization, and easily co-exists with PXI and LXI instruments and chassis.
This capability allows for ATE instruments to be used for characterization, and later the same instruments and test programs can be used in production, for both a cost and time savings for semiconductor device vendors.
The System Module is available now.
Shocking Technologies obtains UL certification
SAN JOSE, USA: Shocking Technologies, Inc. has received notification from Underwriters Laboratories (UL) that it has been awarded 94V-0 certification for its XStaticTM100 product, a voltage switchable dielectric (VSD) material.
Lex Kosowsky, president and CEO of Shocking Technologies, said: “The UL certification is an important milestone that opens the market for us and gives our customers the added confidence to quickly implement our solution. This is well aligned with our high volume manufacturing roll-out in Q1, 2011.”
Shocking Technologies is a privately held company developing Voltage Switchable Dielectric (VSD) materials for electrostatic discharge (ESD) protection in consumer electronic devices.
A VSD material is a polymer nano-composite that behaves as an insulator (dielectric) during normal operation, and becomes conductive in the presence of ESD events. This unique capability enables comprehensive ESD protection at a fraction of the cost of competing, less effective methods.
The company is currently delivering embedded ESD protection within PCBs and semiconductor packages.
Lex Kosowsky, president and CEO of Shocking Technologies, said: “The UL certification is an important milestone that opens the market for us and gives our customers the added confidence to quickly implement our solution. This is well aligned with our high volume manufacturing roll-out in Q1, 2011.”
Shocking Technologies is a privately held company developing Voltage Switchable Dielectric (VSD) materials for electrostatic discharge (ESD) protection in consumer electronic devices.
A VSD material is a polymer nano-composite that behaves as an insulator (dielectric) during normal operation, and becomes conductive in the presence of ESD events. This unique capability enables comprehensive ESD protection at a fraction of the cost of competing, less effective methods.
The company is currently delivering embedded ESD protection within PCBs and semiconductor packages.
Genmark expands technical service network in South Korea
SAN FRANCISCO, USA: Genmark Automation Inc., a global leader in tool and factory automation solutions for the semiconductor manufacturing equipment industry, announced the expansion of its Service and Sales locations in Asia to include a new service and sales facility in Gyeonggi-Do, South Korea, due to the continuous increase in demand for the company’s products and services worldwide.
“Our new facility in Gyeonggi-Do, South Korea will enable us to respond rapidly to the needs of our customers by providing on-site fab support by trained factory personnel, access to a spare parts depot, direct sales and customer service/support 24 hours a day, seven days a week,” said Greg Liebersbach, Director of Service for USA and Asia markets at Genmark Automation.
“The opening of a direct office in South Korea reflects our on-going commitment to deliver superior customer service, sales and field support, helping customers improve and maintain yields, boost productivity and improve overall equipment efficiency.”
“Our new facility in Gyeonggi-Do, South Korea will enable us to respond rapidly to the needs of our customers by providing on-site fab support by trained factory personnel, access to a spare parts depot, direct sales and customer service/support 24 hours a day, seven days a week,” said Greg Liebersbach, Director of Service for USA and Asia markets at Genmark Automation.
“The opening of a direct office in South Korea reflects our on-going commitment to deliver superior customer service, sales and field support, helping customers improve and maintain yields, boost productivity and improve overall equipment efficiency.”
Silego announces GreenPAK Designer for Mac
SANTA CLARA, USA: Silego Technology has released its new GreenPAK Designer for Mac software.
This version of Silego’s GreenPAK Designer was created to provide Apple Mac users with a graphical schematic design tool for the GreenPAK device (a one-time programmable mixed-signal micro-FPGA).
The GreenPAK Designer for Mac software is extremely intuitive for circuit designers, due to the graphical interface and circuit design requiring no programming language or compiler. GreenPAK Designer works in conjunction with Silego’s GreenPAK Programmer (a USB-based programming stick) to give circuit designers the ability to create custom highly integrated circuit designs.
“The development of GreenPAK Designer for Mac is part of Silego’s focus to bring innovative solutions to all electronic designers. The concepts of GreenPAK Designer and the USB GreenPAK programming stick allow engineers the ability to create, program and test stand alone circuit designs in mere minutes,” said Aron Cooperman, product marketing manager at Silego. “To create a circuit design in GreenPAK Designer for Mac is as simple making a block diagram on a piece of paper for an engineer.”
GreenPAK Designer for Mac is available for download free of charge at Silego’s website.
This version of Silego’s GreenPAK Designer was created to provide Apple Mac users with a graphical schematic design tool for the GreenPAK device (a one-time programmable mixed-signal micro-FPGA).
The GreenPAK Designer for Mac software is extremely intuitive for circuit designers, due to the graphical interface and circuit design requiring no programming language or compiler. GreenPAK Designer works in conjunction with Silego’s GreenPAK Programmer (a USB-based programming stick) to give circuit designers the ability to create custom highly integrated circuit designs.
“The development of GreenPAK Designer for Mac is part of Silego’s focus to bring innovative solutions to all electronic designers. The concepts of GreenPAK Designer and the USB GreenPAK programming stick allow engineers the ability to create, program and test stand alone circuit designs in mere minutes,” said Aron Cooperman, product marketing manager at Silego. “To create a circuit design in GreenPAK Designer for Mac is as simple making a block diagram on a piece of paper for an engineer.”
GreenPAK Designer for Mac is available for download free of charge at Silego’s website.
ST unveils true multi-touch technology for slimmer smartphones
INDIA: The next generations of smartphones are unlikely to become much smaller, but they could be slimmer and smarter using a single-chip widescreen capacitive touchscreen controller announced by STMicroelectronics, a leading provider of ICs for mobile and consumer products.
Complementing ST’s leadership in gyroscopes and accelerometers to provide human interface solutions, the S-Touch FingerTip controller offers true multi-touch capability with unlimited simultaneous touches. The FingerTip also enhances multi-touch actions such as pinch-to-zoom and supports stylus operations, enabling a better user experience.
The FingerTip controller’s patented analog IP provides high signal-to-noise-ratio performance with high scan speed that allows robust and fast touch performance for the user. It also offers the industry’s greatest number of channels, allowing higher touch resolution. Its ultra-low power consumption delivers longer battery life.
Advanced noise cancellation makes this the first device of its kind to support the latest on-cell LCD technology without requiring a ground shielding layer between the display and the touch sensor. This feature allows smartphones to have thinner touchscreen LCD modules with enhanced image quality and reduced assembly costs.
Its high resistance to electrostatic discharge (ESD) makes the S-Touch FingerTip touch controller ideal for use in consumer smartphones. Auto-tuning and self calibration features will reduce external components and support a wide range of touchscreen panels. With a 3x3mm low-profile chip-size package, the FingerTip is the industry’s smallest multi-touch controller.
Main features of S-Touch FingerTip:
* n-cell integrated support for thinner displays.
* High SNR.
* Ultra-low-power consumption in touch-ready mode, saving battery life.
* Industry’s highest number of nodes: 288 (18x16).
* 8kV HBM ESD protection.
* Industry’s smallest package.
FingerTip devices are available in two packages, a QFN 56 (7mm x 7mm) and an ultra-small flip-chip CSP 49 (3x3mm), already available for design-ins and mass-production. Budgetary pricing for S-Touch FingerTip is available to OEM customers on request.
Complementing ST’s leadership in gyroscopes and accelerometers to provide human interface solutions, the S-Touch FingerTip controller offers true multi-touch capability with unlimited simultaneous touches. The FingerTip also enhances multi-touch actions such as pinch-to-zoom and supports stylus operations, enabling a better user experience.
The FingerTip controller’s patented analog IP provides high signal-to-noise-ratio performance with high scan speed that allows robust and fast touch performance for the user. It also offers the industry’s greatest number of channels, allowing higher touch resolution. Its ultra-low power consumption delivers longer battery life.
Advanced noise cancellation makes this the first device of its kind to support the latest on-cell LCD technology without requiring a ground shielding layer between the display and the touch sensor. This feature allows smartphones to have thinner touchscreen LCD modules with enhanced image quality and reduced assembly costs.
Its high resistance to electrostatic discharge (ESD) makes the S-Touch FingerTip touch controller ideal for use in consumer smartphones. Auto-tuning and self calibration features will reduce external components and support a wide range of touchscreen panels. With a 3x3mm low-profile chip-size package, the FingerTip is the industry’s smallest multi-touch controller.
Main features of S-Touch FingerTip:
* n-cell integrated support for thinner displays.
* High SNR.
* Ultra-low-power consumption in touch-ready mode, saving battery life.
* Industry’s highest number of nodes: 288 (18x16).
* 8kV HBM ESD protection.
* Industry’s smallest package.
FingerTip devices are available in two packages, a QFN 56 (7mm x 7mm) and an ultra-small flip-chip CSP 49 (3x3mm), already available for design-ins and mass-production. Budgetary pricing for S-Touch FingerTip is available to OEM customers on request.
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